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ST72F321BJ9T6

STMicroelectronics

ST72F321BJ9T6 by STMicroelectronics

ST72F321BJ9T6 by STMicroelectronics is an 8-bit microcontroller with 61440 ROM words, 2048 RAM bytes, and 12-Ch 10-Bit ADC channels. It operates at a max clock frequency of 16 MHz and features TIMER(5) peripherals. Ideal for industrial applications requiring I2C, SCI, SPI connectivity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,666 parts In-Stock

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8,666

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Digiode

USA . 3,860 parts In-Stock

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3,860

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Chip Stock

USA . 3,067 parts In-Stock

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3,067

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Anansix

USA . 2,652 parts In-Stock

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2,652

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Distributors (Availability)

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AZTECH Wire

Italy . 519 parts In-Stock

1+ parts

$9.900

100+ parts

-

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-

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-

519

$9.900

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Microchip USA

USA . 405 parts In-Stock

1+ parts

$10.430

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-

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405

$10.430

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IDEA Electronic Components Group

UK . 92 parts In-Stock

1+ parts

$14.475

100+ parts

-

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$13.028

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92

$14.475

-

$13.028

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MKK Technologies

India . 1,004 parts In-Stock

1+ parts

$27.220

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1,004

$27.220

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DigiPath Technology Company

USA . 1,004 parts In-Stock

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$27.220

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1,004

$27.220

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Futuretech Components

Singapore . 8,640 parts In-Stock

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8,640

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A-Z Elektronik GmbH

Germany . 6,902 parts In-Stock

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6,902

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Corphita

USA . 4,664 parts In-Stock

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4,664

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Perfect Parts

USA . 2,943 parts In-Stock

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2,943

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Parana Technologies

USA . 1,672 parts In-Stock

1+ parts

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$17.307

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1,672

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$17.307

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iodParts Technologies Inc.

India . 150 parts In-Stock

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150

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Eastek

USA . 28 parts In-Stock

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$5.220

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28

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$5.220

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Overview

Unlock the possibilities with the ST72F321BJ9T6 microcontroller by STMicroelectronics. Crafted with precision and expertise, this powerful device offers unmatched performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this versatile microcontroller delivers exceptional value with its robust features and innovative design. Experience seamless connectivity, efficient power management, and superior functionality with the ST72F321BJ9T6. Embrace the future of technology with this cutting-edge solution from a trusted leader in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability in various environments.

Surface Mount: YES

Surface mount design allows for easier integration onto circuit boards.

Maximum Supply Voltage: 5.5 V

Can handle higher supply voltages for versatile applications.

Package Shape: SQUARE

Square shape saves space and allows for efficient layout on PCBs.

Bit Size: 8

8-bit architecture provides a good balance of performance and cost efficiency.

Power Supplies (V): 3.3/5

Supports multiple power supply options for flexibility in design.

No. of Terminals: 44

Sufficient terminals for interfacing with external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE

Low profile package design saves space and allows for compact device designs.

Minimum Supply Voltage: 3.8 V

Can operate at lower supply voltages for energy efficiency.

Maximum Operating Temperature: 85 °C

High operating temperature range makes it suitable for industrial applications.

CPU Family: ST72

ST72 CPU family provides reliable performance and compatibility.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures for use in harsh environments.

Terminal Finish: MATTE TIN

Matte Tin finish provides good solderability and corrosion resistance.

ADC Channels: YES

Built-in ADC channels for analog sensor interfacing and data acquisition.

Terminal Position: QUAD

Quad terminal position facilitates easy PCB layout and connectivity.

ROM Words: 61440

Large ROM capacity for program and data storage.

Maximum Seated Height: 1.6 mm

Low seated height for space-constrained designs.

Width: 10 mm

Compact width for easy integration into devices.

Peripherals: TIMER(5)

Multiple timer peripherals for event timing and control.

Maximum Clock Frequency: 16 MHz

High clock frequency for fast processing and response times.

Length: 10 mm

Compact length for space-efficient PCB layout.

Temperature Grade: INDUSTRIAL

Industrial grade temperature range for robust operation in harsh conditions.

Peripheral IC Type: MICROCONTROLLER

Microcontroller IC type for versatile control and processing capabilities.

RAM Bytes: 2048

Sufficient RAM for data storage and processing.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form for reliable solder connections.

Analog To Digital Converters: 12-Ch 10-Bit

12-channel, 10-bit ADC converters for precise analog-to-digital conversion.

Maximum Supply Current: 8 mA

Low supply current for energy-efficient operation.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage for compatibility with common power sources.

PWM Channels: YES

Support for PWM channels for precise control of digital signals.

Connectivity: I2C, SCI, SPI

Multiple connectivity options for communication with other devices.

ROM Programmability: FLASH

Flash ROM programmability for flexible firmware updates and customization.

Terminal Pitch: 0.8 mm

Small terminal pitch for high-density PCB layouts.

Speed: 8 rpm

Operates at speed of 8 rpm for timely processing.

On Chip Program ROM Width: 8

On-chip ROM width of 8 bits for data storage and program execution.

No. of I/O Lines: 30

Sufficient I/O lines for interfacing with external peripherals and devices.

Technical Specifications

Microcontrollers ST72F321BJ9T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

30

No. of Terminals:

44

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SCI, SPI

Peripherals:

TIMER(5)

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

ST72F321BJ9T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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