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ST72F321AR9TCTXS

STMicroelectronics

ST72F321AR9TCTXS by STMicroelectronics

ST72F321AR9TCTXS microcontroller from STMicroelectronics features a 16 MHz clock, operates b/w 3.8V and 5.5V, and includes ADC & PWM channels. With 64 terminals in a low-profile flatpack package, it's ideal for compact embedded applications. Its 48 I/O lines enhance versatility in designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,727 parts In-Stock

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4,727

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Anansix

USA . 2,735 parts In-Stock

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2,735

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Digiode

USA . 2,185 parts In-Stock

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2,185

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 1,963 parts In-Stock

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$1.000

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1,963

$1.000

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AZTECH Wire

Italy . 307 parts In-Stock

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$12.480

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307

$12.480

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IDEA Electronic Components Group

UK . 1,059 parts In-Stock

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$36.183

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$32.564

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1,059

$36.183

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$32.564

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MKK Technologies

India . 529 parts In-Stock

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$68.039

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529

$68.039

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DigiPath Technology Company

USA . 529 parts In-Stock

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$68.039

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529

$68.039

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Corphita

USA . 1,528 parts In-Stock

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1,528

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Parana Technologies

USA . 586 parts In-Stock

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$43.262

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586

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$43.262

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Overview

Unlock unparalleled performance with the ST72F321AR9TCTXS microcontroller from STMicroelectronics. Renowned for its superior quality and reliability, this low-profile device is perfect for a wide array of applications, from consumer electronics to industrial automation. With flexible power options, advanced ADC and PWM capabilities, it empowers developers to innovate while ensuring energy efficiency and optimal functionality. Elevate your projects with ST's trusted technology—where excellence meets affordability!

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for a compact design, making it ideal for space-constrained applications.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage provides flexibility for various power supply configurations.

Package Shape: SQUARE

A square package shape ensures balanced thermal and electrical performance, suitable for diverse applications.

Bit Size: 8

The 8-bit architecture is sufficient for a wide range of control applications, offering simplicity and efficiency.

No. of Terminals: 64

With 64 terminals, it offers ample connectivity options for peripherals and sensors.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile flatpack design enhances heat dissipation and is suitable for compact PCBs.

Minimum Supply Voltage: 3.8 V

The low minimum supply voltage helps to ensure compatibility with a wide range of power sources.

ADC Channels: YES

Integrated ADC channels enable direct sensor interfacing, simplifying the design process.

Terminal Position: QUAD

Quad terminal position maximizes space efficiency on the PCB while allowing easy accessibility.

Width: 10 mm

A compact width of 10 mm is suitable for fitting in tight spaces without sacrificing functionality.

Maximum Clock Frequency: 16 MHz

With a maximum clock frequency of 16 MHz, this microcontroller can efficiently handle various tasks.

Length: 10 mm

The compact length of 10 mm makes it ideal for multi-functional devices without occupying excessive space.

Peripheral IC Type: MICROCONTROLLER

As a dedicated microcontroller, it is optimized for control tasks, making it a reliable choice for embedded applications.

Terminal Form: GULL WING

Gull wing terminals provide good mechanical strength and are easy to solder, which enhances reliability.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V is the standard for many electronic components, ensuring compatibility with common circuits.

PWM Channels: YES

With PWM channels, it can be used for motor control applications, allowing for efficient speed modulation.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch is suitable for high-density designs, allowing for more terminals in a smaller area.

Speed: 8 rpm

The speed specification indicates its capability for low-speed applications, making it suitable for precise control mechanisms.

No. of I/O Lines: 48

Having 48 I/O lines provides flexibility for connecting multiple devices and functionalities, enhancing versatility.

Technical Specifications

Microcontrollers ST72F321AR9TCTXS attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DMA Channels:

NO

External Data Bus Width:

0

Length:

10 mm

No. of I/O Lines:

48

No. of Terminals:

64

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

8 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

ST72F321AR9TCTXS Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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