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ST72F264G2B6

STMicroelectronics

ST72F264G2B6 by STMicroelectronics

ST72F264G2B6 microcontroller from STMicroelectronics features an 8-bit CPU, operates at 3.3-5.5V, and supports up to 16 MHz clock frequency. With 8192 ROM words and 256 RAM bytes, it's ideal for industrial applications requiring reliable performance in harsh environments. Connectivity options include I2C, SCI, and SPI for versatile integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,481 parts In-Stock

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Digiode

USA . 4,597 parts In-Stock

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4,597

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Anansix

USA . 975 parts In-Stock

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975

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Distributors (Availability)

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Microchip USA

USA . 342 parts In-Stock

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$16.273

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342

$16.273

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AZTECH Wire

Italy . 41 parts In-Stock

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$17.140

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41

$17.140

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IDEA Electronic Components Group

UK . 1,649 parts In-Stock

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$52.768

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$47.492

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1,649

$52.768

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$47.492

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MKK Technologies

India . 1,209 parts In-Stock

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$99.228

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1,209

$99.228

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DigiPath Technology Company

USA . 1,209 parts In-Stock

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$99.228

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$99.228

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Component Stockers USA

USA . 323 parts In-Stock

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$99.990

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Perfect Parts

USA . 6,433 parts In-Stock

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Corphita

USA . 3,240 parts In-Stock

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3,240

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Parana Technologies

USA . 2,293 parts In-Stock

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$63.093

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$63.093

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Vigor

Singapore . 1,050 parts In-Stock

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Overview

Unlock unparalleled performance with the ST72F264G2B6 microcontroller from STMicroelectronics. Renowned for its quality and reliability, STMicroelectronics delivers cutting-edge solutions that empower innovation across diverse applications—from industrial automation to consumer electronics. Experience enhanced efficiency, versatile connectivity options, and robust temperature tolerance. With ST72 series, elevate your projects with a trusted partner dedicated to driving your success in an ever-evolving tech landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures long-term reliability and reduces production costs.

Maximum Supply Voltage: 5.5 V

Allows flexible power supply options, accommodating various system designs.

Package Shape: RECTANGULAR

Space-efficient design suitable for compact applications and PCB layouts.

Bit Size: 8

Ideal for simple control tasks and low-power applications, providing robust performance.

Power Supplies (V): 3/5

Versatile power supply range ensures compatibility with various systems and components.

No. of Terminals: 32

Provides ample connectivity options for interfacing with multiple peripherals.

Package Style (Meter): IN-LINE, SHRINK PITCH

Facilitates easier mounting and soldering process on PCBs, improving production efficiency.

Minimum Supply Voltage: 3.3 V

Supports low-power designs and is compatible with modern electronics.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where reliable operation in higher temperatures is crucial.

CPU Family: ST72

Proven architecture with widespread adoption ensures a wealth of resources and community support.

Minimum Operating Temperature: -40 °C

Enhanced performance in extreme conditions makes it ideal for harsh environments.

Terminal Finish: Matte Tin (Sn)

Improves solderability and protects against corrosion, ensuring long-lasting connections.

ADC Channels: YES

Enables data acquisition from analog sensors, expanding application possibilities.

Terminal Position: DUAL

Supports flexible PCB layout options while maintaining reliable connections.

ROM Words: 8192

Offers sufficient storage for complex applications and program code.

Maximum Seated Height: 5.08 mm

Compact height allows it to fit in space-constrained environments.

Width: 10.16 mm

Narrow width helps optimize PCB space and layout flexibility.

Peripherals: TIMER(4)

Multiple timers enhance control capabilities for time-sensitive applications.

Maximum Clock Frequency: 16 MHz

Sufficient speed for executing various tasks while maintaining power efficiency.

Length: 27.94 mm

Length is optimal for integration into various electronic designs and enclosures.

Temperature Grade: INDUSTRIAL

Designed for use in demanding industrial environments, ensuring robust performance.

Peripheral IC Type: MICROCONTROLLER

Versatile control capabilities make it suitable for a wide range of applications.

RAM Bytes: 256

Adequate memory for handling multiple data operations and processing tasks effectively.

Technology: CMOS

Low power consumption technology enhances battery life and efficiency.

Terminal Form: THROUGH-HOLE

Provides a strong mechanical connection and ease of handling during assembly.

Analog To Digital Converters: 6-Ch 10-Bit

High-resolution ADC channels enhance data accuracy for precision applications.

Maximum Supply Current: 11 mA

Low supply current helps reduce heat generation and increase battery life.

Nominal Supply Voltage: 5 V

Standard supply voltage compatible with most logic devices, simplifying designs.

PWM Channels: YES

Allows for efficient control over motors and other devices requiring variable power.

Connectivity: I2C, SCI, SPI

Multiple communication interfaces enhance connectivity and expand integration options.

ROM Programmability: FLASH

Allows for easy updates and flexibility in application programming.

Terminal Pitch: 1.778 mm

Compact pitch aids in designing smaller form factor PCBs while maintaining layout clarity.

Speed: 16 rpm

Sufficient operational speed for many low-speed applications, ensuring steady performance.

On Chip Program ROM Width: 8

Standard width supports a wide range of programming tools and techniques.

No. of I/O Lines: 22

Provides a good number of I/O lines for various interfacing needs in embedded systems.

Technical Specifications

Microcontrollers ST72F264G2B6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T32

JESD-609 Code:

e3

Length:

27.94 mm

No. of I/O Lines:

22

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP32,.4

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

5.08 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

10.16 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SCI, SPI

Peripherals:

TIMER(4)

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

ST72F264G2B6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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