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ST72F262G2M6

STMicroelectronics

ST72F262G2M6 by STMicroelectronics

ST72F262G2M6 microcontroller from STMicroelectronics features an 8-bit CPU, operates at 3.3-5.5V, and supports up to 16 MHz clock frequency. With 8192 ROM words and 256 RAM bytes, it's ideal for industrial applications requiring reliable performance in harsh environments. Its integrated ADC and PWM channels enhance versatility for various control tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,882 parts In-Stock

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Digiode

USA . 3,232 parts In-Stock

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ComSIT Distribution GmbH

Germany . 3,000 parts In-Stock

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Anansix

USA . 1,882 parts In-Stock

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J2 Sourcing AB

Sweden . 723 parts In-Stock

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723

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R&J Components

USA . 431 parts In-Stock

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Chip Stock

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Distributors (Availability)

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Microchip USA

USA . 355 parts In-Stock

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$16.033

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355

$16.033

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AZTECH Wire

Italy . 1,085 parts In-Stock

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$22.070

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$22.070

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IDEA Electronic Components Group

UK . 737 parts In-Stock

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$36.385

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$32.747

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737

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$32.747

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MKK Technologies

India . 866 parts In-Stock

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$68.420

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866

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DigiPath Technology Company

USA . 866 parts In-Stock

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$68.420

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866

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Kepictronics

USA . 14,200 parts In-Stock

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Vigor

Singapore . 7,850 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,809 parts In-Stock

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Parana Technologies

USA . 1,070 parts In-Stock

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$43.504

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Corphita

USA . 152 parts In-Stock

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Perfect Parts

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Overview

Unlock your project's potential with the ST72F262G2M6 microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for reliability and performance, this versatile 8-bit MCU excels in industrial applications, offering robust functionality with exceptional power efficiency. With advanced features like multiple peripherals and A/D conversion, it ensures seamless integration and high-quality output, empowering you to create smarter, more efficient systems. Choose STMicroelectronics for unmatched quality, support, and a commitment to excellence that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable and cost-effective material ensures robustness and reliability in various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easy PCB assembly, making it ideal for modern electronics.

Maximum Supply Voltage: 5.5 V

The versatility of operating at a maximum voltage of 5.5 V ensures compatibility with a wide range of power supplies.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient use of board space, enabling more components to fit in smaller designs.

Bit Size: 8

An 8-bit architecture is beneficial for many simple control applications, offering a good balance of performance and complexity.

Power Supplies (V): 3/5

Supports both 3V and 5V power supplies, enhancing flexibility in various applications.

No. of Terminals: 28

A higher number of terminals allows for increased connectivity options, enhancing the microcontroller's versatility.

Package Style (Meter): SMALL OUTLINE

The small outline design is conducive to compact circuit board layouts, saving space in final product designs.

Minimum Supply Voltage: 3.3 V

This low minimum voltage helps in power-sensitive applications, improving energy efficiency.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures makes this microcontroller suitable for industrial environments.

CPU Family: ST72

Utilizing the robust ST72 family ensures stable performance and reliability across a range of applications.

Minimum Operating Temperature: -40 °C

The wide temperature range makes it suitable for harsh environments and applications that require extended operation.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish enhances conductivity and corrosion resistance, ensuring a longer lifespan.

ADC Channels: YES

Integrated ADC channels allow for direct interfacing with analog sensors, streamlining data acquisition.

Terminal Position: DUAL

Dual terminal positioning simplifies PCB layout and improves assembly processes.

ROM Words: 8192

The ample ROM capacity allows for extensive program storage, providing flexibility in application development.

Maximum Seated Height: 2.65 mm

A low seated height is beneficial for low-profile designs, making it easier to fit into compact enclosures.

Width: 7.5 mm

A narrow profile enables efficient use of PCB space, complementing advanced compact designs.

Peripherals: TIMER(4)

The inclusion of multiple timers enhances the capability to manage timing processes efficiently.

Maximum Clock Frequency: 16 MHz

High clock frequency ensures faster execution of instructions, leading to improved application performance.

Maximum Time At Peak Reflow Temperature (s): 30

Designed to withstand high-temperature soldering processes ensures reliability in mass production.

Peak Reflow Temperature °C: 250

The ability to tolerate high temperatures during manufacturing increases production flexibility.

Length: 17.9 mm

A compact length contributes to space-efficient designs, making it suitable for a variety of applications.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures the microcontroller can handle demanding applications reliably.

Peripheral IC Type: MICROCONTROLLER

As a dedicated microcontroller, it is optimized for control tasks, making it a natural choice for embedded systems.

RAM Bytes: 256

The onboard RAM supports efficient variable storage, enhancing performance for complex applications.

Technology: CMOS

CMOS technology provides low power consumption, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals ensure reliable solder joints and simplify assembly on PCBs.

Analog To Digital Converters: 6-Ch 10-Bit

Multiple ADCs with high resolution enable precise data measurement from sensors, enhancing overall system performance.

Maximum Supply Current: 11 mA

Low supply current helps to reduce energy costs and increase battery life in portable applications.

Nominal Supply Voltage: 5 V

The standard nominal voltage simplifies design requirements and integration with existing systems.

PWM Channels: YES

The presence of PWM channels allows for flexible control of motors and actuators in various applications.

Connectivity: SPI

SPI connectivity enables high-speed data transfer between components, increasing the overall system efficiency.

ROM Programmability: FLASH

Flash ROM allows for easy updates and reprogramming, making it adaptable to evolving project needs.

Terminal Pitch: 1.27 mm

A standard terminal pitch simplifies PCB design and component placement, reducing manufacturing complexity.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, the microcontroller is suitable for standard handling and storage procedures, ensuring reliability.

Speed: 16 rpm

Offers adequate processing speed for many control applications without excessive power consumption.

On Chip Program ROM Width: 8

A width of 8 bits optimizes data handling and processing, balancing performance for a variety of tasks.

No. of I/O Lines: 22

A high number of I/O lines provides greater interaction capabilities with other components and systems.

Technical Specifications

Microcontrollers ST72F262G2M6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

22

No. of Terminals:

28

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI

Peripherals:

TIMER(4)

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

ST72F262G2M6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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