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ST72F262G1B6

STMicroelectronics

ST72F262G1B6 by STMicroelectronics

ST72F262G1B6 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating voltage range of 3.3-5.5 V, and 4096 ROM words. Ideal for industrial applications, it includes ADC channels and PWM capabilities. Its compact design ensures efficient performance in various embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,327 parts In-Stock

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Anansix

USA . 2,115 parts In-Stock

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2,115

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Digiode

USA . 74 parts In-Stock

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74

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Microchip USA

USA . 166 parts In-Stock

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$4.798

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166

$4.798

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AZTECH Wire

Italy . 1,220 parts In-Stock

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$10.710

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$10.710

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IDEA Electronic Components Group

UK . 511 parts In-Stock

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$25.757

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$23.182

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511

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$23.182

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MKK Technologies

India . 1,855 parts In-Stock

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$48.435

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1,855

$48.435

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DigiPath Technology Company

USA . 1,855 parts In-Stock

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$48.435

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$48.435

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Corphita

USA . 2,804 parts In-Stock

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Vigor

Singapore . 2,300 parts In-Stock

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2,300

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Parana Technologies

USA . 1,320 parts In-Stock

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$30.797

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1,320

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$30.797

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Overview

Discover the ST72F262G1B6 microcontroller from STMicroelectronics, a trusted leader in high-quality semiconductor solutions. Designed for versatility, this 8-bit MCU excels in industrial applications, bringing robust performance with low power consumption. Its compact design and advanced features, such as multiple ADC channels and timers, make it ideal for innovative projects. Elevate your designs with reliability and efficiency that only STMicroelectronics can deliver!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides a robust and lightweight design, making it suitable for various applications.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of power supplies.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient layout and integration into PCB designs.

Bit Size: 8

An 8-bit architecture caters to simpler control applications, making it easier to handle basic tasks.

Power Supplies (V): 3/5

The versatility of supporting both 3V and 5V power supplies enhances compatibility with various systems.

No. of Terminals: 32

32 terminals provide ample connectivity options for external devices, allowing for complex interfacing.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line shrink pitch design optimizes space and facilitates efficient manufacturers' processes.

Minimum Supply Voltage: 3.3 V

A minimum supply voltage of 3.3 V allows for lower power consumption in battery-operated applications.

Maximum Operating Temperature: 85 °C

An operating temperature up to 85 °C ensures reliable operation in various environmental conditions.

CPU Family: ST72

The ST72 CPU family combines performance and efficiency, providing stability for embedded systems.

Minimum Operating Temperature: -40 °C

A wide temperature range from -40 °C ensures suitability for industrial and outdoor applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish enhances solderability and resistance to oxidation.

ADC Channels: YES

Availability of ADC channels allows for direct reading of analog signals, useful in sensor applications.

Terminal Position: DUAL

Dual terminal position facilitates easier circuit design and improved layout options.

ROM Words: 4096

With 4096 words of ROM, this microcontroller can store a significant amount of program code.

Maximum Seated Height: 5.08 mm

The compact seated height aids in space-saving designs and compatibility with low-profile systems.

Width: 10.16 mm

A width of 10.16 mm allows for efficient use of board space in compact designs.

Peripherals: TIMER(4)

Four integrated timers provide timing functions and precise control for various applications.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz allows for responsive processing in control tasks and applications.

Length: 27.94 mm

At 27.94 mm long, the microcontroller supports integration into compact devices.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliability in harsher environments and extended operating life.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller makes it suitable for controlling a variety of hardware applications.

RAM Bytes: 256

256 bytes of RAM enables temporary data storage for processing tasks, suitable for simple applications.

Technology: CMOS

CMOS technology allows for low power consumption, making it efficient for battery-operated devices.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides robust connections and is ideal for prototyping.

Analog To Digital Convertors: 6-Ch 10-Bit

Having a 6-channel 10-bit ADC enables multiple sensors to be read, enhancing versatility in applications.

Maximum Supply Current: 11 mA

A maximum supply current of 11 mA indicates low energy consumption, suitable for power-sensitive applications.

Nominal Supply Voltage: 5 V

Operating at a nominal voltage of 5 V is widely accepted, facilitating easy deployment in various projects.

PWM Channels: YES

PWM channels enable precise control of devices like motors and lights, making this microcontroller highly functional.

Connectivity: SPI

SPI connectivity allows for fast communication with other devices, enhancing data transfer rates.

ROM Programmability: FLASH

Flash ROM programmability means users can easily update programs, allowing for flexibility and adaptability.

Terminal Pitch: 1.778 mm

A terminal pitch of 1.778 mm offers a good compromise between space-saving and ease of soldering.

Speed: 16 rpm

Operating at 16 rpm makes it suitable for low-speed applications, ensuring precision in control.

On Chip Program ROM Width: 8

An 8-bit program ROM width is ideal for handling simpler computations and control tasks.

No. of I/O Lines: 22

Having 22 I/O lines supports multiple interfacing, providing flexibility in various application scenarios.

Technical Specifications

Microcontrollers ST72F262G1B6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T32

JESD-609 Code:

e3

Length:

27.94 mm

No. of I/O Lines:

22

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP32,.4

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

5.08 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

10.16 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI

Peripherals:

TIMER(4)

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

ST72F262G1B6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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