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ST72C334J4B6

STMicroelectronics

ST72C334J4B6 by STMicroelectronics

ST72C334J4B6 microcontroller from STMicroelectronics features an 8-bit CPU, operates b/w -40 °C to 85 °C, and includes 16KB of FLASH ROM. With a power supply range of 3.5V to 5.5V and 42 terminals, it's ideal for industrial applications requiring reliability. Its compact design ensures efficient integration in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,521 parts In-Stock

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3,521

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Vyrian

USA . 2,767 parts In-Stock

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2,767

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Anansix

USA . 974 parts In-Stock

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974

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LittleDiode

UK . 3 parts In-Stock

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Distributors (Availability)

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Benley Electronics

USA . 2 parts In-Stock

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$2.000

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2

$2.000

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IDEA Electronic Components Group

UK . 1,069 parts In-Stock

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$14.515

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$13.063

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1,069

$14.515

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$13.063

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AZTECH Wire

Italy . 1,084 parts In-Stock

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$16.570

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$16.570

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MKK Technologies

India . 1,025 parts In-Stock

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$27.294

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1,025

$27.294

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DigiPath Technology Company

USA . 1,025 parts In-Stock

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$27.294

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$27.294

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Component Stockers USA

USA . 703 parts In-Stock

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$99.990

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703

$99.990

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Microchip USA

USA . 159 parts In-Stock

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$135.926

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Corphita

USA . 4,924 parts In-Stock

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Vigor

Singapore . 2,790 parts In-Stock

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2,790

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Parana Technologies

USA . 1,974 parts In-Stock

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$17.355

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1,974

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$17.355

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Overview

Unlock the potential of your projects with the ST72C334J4B6 microcontroller from STMicroelectronics, a leader in innovative technology. Designed for reliability and performance across diverse applications, this versatile 8-bit MCU excels in industrial environments, functioning seamlessly from -40 °C to 85 °C. With robust flash programmability and exceptional power efficiency, elevate your designs, reduce costs, and ensure lasting success with STMicroelectronics—where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides a durable and lightweight design, making the microcontroller suitable for a wide range of applications.

Package Shape: RECTANGULAR

A rectangular shape enables efficient use of PCB space and an organized design, facilitating easier manufacturing and assembly.

Bit Size: 8

An 8-bit size is ideal for applications requiring basic data processing without complexity, enabling simpler programming and design.

Power Supplies (V): 3.5/5.5

Flexible power supply options allow for compatibility with various power sources, enhancing the product’s versatility in different designs.

No. of Terminals: 42

With 42 terminals, this microcontroller supports extensive interfacing capabilities for multiple peripherals, enhancing functionality.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line, shrink pitch design allows for compact layouts, saving space on circuit boards and improving overall design efficiency.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in various environments, making it suitable for industrial applications.

CPU Family: ST72

Being part of the ST72 family indicates robust performance and extensive support, with a proven track record in the industry.

Minimum Operating Temperature: -40 °C

The capability to function at -40 °C makes this microcontroller ideal for harsh environments, enhancing its reliability for outdoor and industrial use.

Terminal Finish: Tin (Sn)

Tin terminal finish ensures good solderability and resistance to corrosion, which enhances durability in various applications.

Terminal Position: DUAL

Dual terminal position allows for flexible PCB layout, enabling better connectivity and ease of installation.

ROM Words: 16384

With 16384 ROM words, it supports complex programming needs, providing sufficient storage for applications while maintaining simplicity.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature grades ensures reliability in demanding environments, meeting the needs of rugged applications.

RAM Bytes: 512

512 bytes of RAM provides adequate workspace for application processing, allowing for efficient operation in various tasks.

Technology: CMOS

CMOS technology ensures low power consumption, which is essential for battery-powered devices and prolongs operational life.

Terminal Form: THROUGH-HOLE

Through-hole design offers strong mechanical support and is ideal for prototyping, where robustness is necessary.

ROM Programmability: FLASH

Flash programmability allows for easy updating and upgrades to application firmware, enhancing longevity and flexibility.

Terminal Pitch: 1.78 mm

A terminal pitch of 1.78 mm balances compact size with ease of soldering, facilitating complex circuit designs while ensuring reliability.

Speed: 8 rpm

Speed of 8 RPM makes it suitable for applications requiring modest processing speeds, which enhances efficiency in controlled environments.

Technical Specifications

Microcontrollers ST72C334J4B6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

Bit Size:

8

CPU Family:

ST72

JESD-30 Code:

R-PDIP-T42

JESD-609 Code:

e3

No. of Terminals:

42

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP42,.6

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

3.5/5.5

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

16384

ROM Programmability:

FLASH

Speed:

8 rpm

Sub-Category:

Microcontrollers

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

1.78 mm

Terminal Position:

DUAL

Trade Compliance

ST72C334J4B6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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