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ST72C254G2M3

STMicroelectronics

ST72C254G2M3 by STMicroelectronics

ST72C254G2M3 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 12 MHz, operating b/w -40 °C to 125°C. It supports I2C/SPI connectivity and includes 6 ADC channels for versatile applications. Ideal for automotive use, it offers robust performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,540 parts In-Stock

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8,540

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Anansix

USA . 1,523 parts In-Stock

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1,523

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J & M Industries LLC

USA . 707 parts In-Stock

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707

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Digiode

USA . 612 parts In-Stock

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612

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Distributors (Availability)

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Microchip USA

USA . 357 parts In-Stock

1+ parts

$12.312

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357

$12.312

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AZTECH Wire

Italy . 788 parts In-Stock

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$15.390

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788

$15.390

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IDEA Electronic Components Group

UK . 2,144 parts In-Stock

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$35.095

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$31.586

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2,144

$35.095

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$31.586

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MKK Technologies

India . 579 parts In-Stock

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$65.994

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579

$65.994

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DigiPath Technology Company

USA . 579 parts In-Stock

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$65.994

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579

$65.994

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Vigor

Singapore . 3,900 parts In-Stock

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3,900

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Authorized Procurement Solutions

USA . 2,700 parts In-Stock

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2,700

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Parana Technologies

USA . 1,006 parts In-Stock

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$41.962

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1,006

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$41.962

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Corphita

USA . 858 parts In-Stock

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858

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Perfect Parts

USA . 780 parts In-Stock

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780

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Overview

Elevate your projects with the ST72C254G2M3 microcontroller from STMicroelectronics, a trusted leader in innovation. Designed for automotive applications, this robust 8-bit controller offers superior performance in extreme temperatures, ensuring reliability and efficiency. With advanced features like multiple ADC channels and versatile connectivity options, it empowers developers to create cutting-edge solutions. Choose STMicroelectronics for quality that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material offers durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient assembly and reduces the overall footprint, making it ideal for compact designs.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with standard power supplies and protects the microcontroller from damage.

Package Shape: RECTANGULAR

The rectangular shape optimizes board space, allowing for easier layout and design in various applications.

Bit Size: 8

An 8-bit architecture is effective for simpler applications while providing sufficient performance for many control tasks.

Power Supplies (V): 3.5/5

Dual supply voltage options (3.5V and 5V) provide flexibility for different operational environments.

No. of Terminals: 28

With 28 terminals, this microcontroller offers a good number of I/O options for connecting peripherals and external devices.

Package Style (Meter): SMALL OUTLINE

Small outline packages reduce space and allow for high-density designs, fitting into compact electronic devices.

Minimum Supply Voltage: 4.5 V

This microcontroller supports a range of supply voltages, ensuring stable operation in varying power conditions.

Maximum Operating Temperature: 125 °C

The high operating temperature limit makes this microcontroller suitable for automotive and demanding industrial environments.

CPU Family: ST72

The ST72 family is known for reliability and efficiency, making it a trusted choice in microcontroller applications.

Minimum Operating Temperature: -40 °C

Support for extreme low temperatures allows this microcontroller to function in harsh environments, suitable for automotive applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances the connection reliability and longevity of the terminals, making for durable assemblies.

ADC Channels: YES

With embedded ADC channels, the microcontroller can interface easily with analog sensors, increasing its versatility.

Terminal Position: DUAL

Dual terminal position facilitates easier PCB design and enhanced connectivity options.

ROM Words: 8192

A total of 8192 ROM words provides ample memory for code storage, accommodating moderate-sized applications.

Maximum Seated Height: 2.65 mm

This low seated height allows for space-efficient designs, making it suitable for portable devices.

Width: 7.5 mm

A compact width aids in space-constrained applications, allowing for more efficient PCB layouts.

Peripherals: TIMER(3)

With three timers, the microcontroller can handle various timing and control tasks simultaneously, enhancing its functionality.

Maximum Clock Frequency: 12 MHz

A higher maximum clock frequency leads to faster processing capabilities, which is crucial for real-time applications.

Length: 17.9 mm

The short length contributes to the compact nature of the design, making it an excellent fit for tight spaces.

Temperature Grade: AUTOMOTIVE

Rated for automotive use, this microcontroller is designed to endure harsh conditions and provide reliable performance in vehicles.

Peripheral IC Type: MICROCONTROLLER

Being a dedicated microcontroller, it is optimized for control applications, making it ideal for embedded systems.

RAM Bytes: 256

256 bytes of RAM provides enough temporary storage for handling various tasks and operations efficiently.

Technology: CMOS

CMOS technology enables low power consumption, which is essential for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals allow for easier soldering and manufacturing processes, enhancing production efficiency.

Analog To Digital Converters: 6-Ch 8-Bit

The inclusion of a 6-channel, 8-bit ADC enables the microcontroller to process multiple analog signals, increasing versatility.

Maximum Supply Current: 10 mA

A low maximum supply current ensures energy efficiency, making this microcontroller suitable for low-power applications.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V makes it compatible with common logic levels, simplifying integration into existing systems.

PWM Channels: YES

Having PWM channels allows for easy control of motors and LED brightness, enhancing the control capabilities of the system.

Connectivity: I2C, SPI

Support for I2C and SPI protocols facilitates easy communication with other devices, making it suitable for complex systems.

ROM Programmability: FLASH

Flash programmability allows for in-field updates and reprogramming, providing flexibility in application development.

Terminal Pitch: 1.27 mm

A standard terminal pitch provides compatibility with various PCB designs and reduces manufacturing complexity.

Speed: 6 rpm

The operational speed of 6 rpm is crucial for specific applications like motor control, providing adequate responsiveness.

On Chip Program ROM Width: 8

An 8-bit program ROM width aligns with industry standards, increasing compatibility with existing software tools.

No. of I/O Lines: 22

With 22 I/O lines, the microcontroller supports connections to multiple inputs and outputs, enhancing overall system flexibility.

Technical Specifications

Microcontrollers ST72C254G2M3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES FROM 3.2 TO 5.5V SUUPLY

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

12 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

No. of I/O Lines:

22

No. of Terminals:

28

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.5/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

6 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI

Peripherals:

TIMER(3)

Analog To Digital Convertors:

6-Ch 8-Bit

Trade Compliance

ST72C254G2M3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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