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ST72C254G1B6

STMicroelectronics

ST72C254G1B6 by STMicroelectronics

ST72C254G1B6 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating b/w -40 °C to 85°C. It supports up to 22 I/O lines and includes ADC and PWM channels. Ideal for industrial applications, it operates at a nominal voltage of 5V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,616 parts In-Stock

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7,616

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Digiode

USA . 2,667 parts In-Stock

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2,667

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Anansix

USA . 1,482 parts In-Stock

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1,482

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LWI Electronics Inc

India . 414 parts In-Stock

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414

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Distributors (Availability)

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Microchip USA

USA . 320 parts In-Stock

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$5.102

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320

$5.102

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AZTECH Wire

Italy . 698 parts In-Stock

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$18.640

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698

$18.640

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IDEA Electronic Components Group

UK . 1,885 parts In-Stock

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$58.971

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$53.074

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1,885

$58.971

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$53.074

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MKK Technologies

India . 1,445 parts In-Stock

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$110.891

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1,445

$110.891

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DigiPath Technology Company

USA . 1,445 parts In-Stock

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$110.891

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1,445

$110.891

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Vigor

Singapore . 2,250 parts In-Stock

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2,250

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Corphita

USA . 1,927 parts In-Stock

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1,927

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Parana Technologies

USA . 321 parts In-Stock

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$70.509

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321

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Perfect Parts

USA . 28 parts In-Stock

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Overview

Unlock your project's potential with the ST72C254G1B6 from STMicroelectronics, a leader in high-quality microcontrollers. This reliable 8-bit powerhouse is designed for diverse applications, offering unmatched performance in industrial environments. Its compact design and robust features, like ADC and PWM channels, empower engineers to innovate with confidence. Elevate your solutions with a product that combines excellence and value—choose STMicroelectronics for quality that lasts.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material ensures reliability and longevity in various application environments.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V allows for flexibility in power supply design, making this microcontroller suitable for various systems.

Package Shape: RECTANGULAR

The rectangular package shape is space-efficient, making it easier to integrate into various electronic designs.

Bit Size: 8

An 8-bit architecture provides a good balance of cost and performance for low-to-medium complexity applications.

Power Supplies (V): 3.5/5

Support for multiple voltage power supplies (3.5 to 5V) enhances compatibility with different power systems and devices.

No. of Terminals: 32

With 32 terminals, the microcontroller offers ample connectivity options for peripheral devices, enhancing functionality.

Package Style (Meter): IN-LINE, SHRINK PITCH

In-line and shrink pitch packaging is ideal for space-constrained designs, optimizing layout and reducing board space usage.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures stable operation while allowing for a range of typical power supply options.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this microcontroller can function reliably in industrial and high-temperature applications.

CPU Family: ST72

Part of the ST72 CPU family, known for its portability and performance in automotive, industrial, and consumer applications.

Minimum Operating Temperature: -40 °C

The ability to operate at a minimum temperature of -40 °C makes this product suitable for extreme environmental conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish enhances solderability and ensures a good electrical connection, which is crucial for reliability.

ADC Channels: YES

Integrated ADC channels facilitate easy analog-to-digital conversions, expanding the microcontroller's application range.

Terminal Position: DUAL

Dual terminal positioning allows for versatile mounting options, simplifying PCB design and assembly.

ROM Words: 4096

With 4096 ROM words, this microcontroller provides sufficient program memory for more complex applications.

Maximum Seated Height: 5.08 mm

A compact seated height of 5.08 mm contributes to space-saving designs in small form factor applications.

Width: 10.16 mm

A width of 10.16 mm supports compact PCB designs without compromising performance.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz ensures adequate processing speed for real-time applications.

Length: 27.94 mm

A length of 27.94 mm provides a balanced form factor for a variety of application layouts.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature grading, this microcontroller is built for reliability in demanding environments.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates processing, memory, and peripheral functionalities in a single chip, simplifying designs.

RAM Bytes: 256

With 256 bytes of RAM, it supports basic data storage needs for small applications without excessive complexity.

Technology: CMOS

CMOS technology provides low power consumption, making this microcontroller energy-efficient.

Terminal Form: THROUGH-HOLE

Through-hole terminal form enables easy handling and soldering, ensuring secure connections on the PCB.

Maximum Supply Current: 10 mA

With a maximum supply current of 10 mA, it's suitable for low-power applications, preserving battery life in portable devices.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is a standard in the industry, ensuring compatibility with common power supplies.

PWM Channels: YES

Support for PWM channels allows for efficient control of motor speed and light dimming, broadening its application range.

ROM Programmability: FLASH

Flash programmability enables quick updates and flexibility in firmware changes, making it ideal for iterative development.

Terminal Pitch: 1.778 mm

A terminal pitch of 1.778 mm strikes a balance between compact design and easy solderability.

Speed: 8 rpm

A speed of 8 rpm allows for measurements involving slower processes, suitable for specific automation applications.

No. of I/O Lines: 22

With 22 I/O lines, this microcontroller provides ample connectivity options for various input and output devices.

Technical Specifications

Microcontrollers ST72C254G1B6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES FROM 3.2 TO 5.5V SUUPLY

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T32

JESD-609 Code:

e3

Length:

27.94 mm

No. of I/O Lines:

22

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP32,.4

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

3.5/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

5.08 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

10.16 mm

Peripheral IC Type:

Trade Compliance

ST72C254G1B6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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