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ST72C215G2B6

STMicroelectronics

ST72C215G2B6 by STMicroelectronics

ST72C215G2B6 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating voltage range of 4.5-5.5 V, and 8192 ROM words. It’s ideal for industrial applications requiring reliable performance in harsh environments. With 22 I/O lines and ADC/PWM capabilities, it supports versatile control tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,761 parts In-Stock

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Digiode

USA . 3,819 parts In-Stock

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Anansix

USA . 2,339 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,600 parts In-Stock

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1,600

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ComSIT Distribution GmbH

Germany . 107 parts In-Stock

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Zilex Electronics Inc.

Canada . 56 parts In-Stock

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Inventory MP

USA . 27 parts In-Stock

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Bristol Electronics

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Distributors (Availability)

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AZTECH Wire

Italy . 127 parts In-Stock

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$11.620

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127

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IDEA Electronic Components Group

UK . 1,915 parts In-Stock

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$26.123

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$23.511

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MKK Technologies

India . 348 parts In-Stock

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$49.123

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DigiPath Technology Company

USA . 348 parts In-Stock

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$49.123

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QUARKTWIN TECHNOLOGY LTD

USA . 15,590 parts In-Stock

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Authorized Procurement Solutions

USA . 10,384 parts In-Stock

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Vigor

Singapore . 7,500 parts In-Stock

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Microchip USA

USA . 5,962 parts In-Stock

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Metaverse IC Inc.

Canada . 1,600 parts In-Stock

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Corphita

USA . 733 parts In-Stock

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Parana Technologies

USA . 655 parts In-Stock

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Kepictronics

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Assy Fe

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Overview

Unlock the potential of your projects with the ST72C215G2B6 microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for flexibility and reliability, this 8-bit gem excels in industrial applications, offering robust performance with low power consumption. Its compact form factor and advanced features empower developers to create efficient systems while ensuring longevity and quality you can trust—perfect for demanding environments. Experience the difference with STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures the microcontroller is protected from environmental factors, making it suitable for various applications.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this microcontroller operates safely within a common voltage range for many electronic applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on PCBs, making it easy to integrate into different designs.

Bit Size: 8

An 8-bit architecture strikes a balance between performance and power consumption, fitting well in simple control applications.

Power Supplies (V): 3.3/5

Support for both 3.3V and 5V supplies gives flexibility for various interfacing options in mixed-voltage environments.

No. of Terminals: 32

With 32 terminals, this microcontroller provides ample I/O for handling multiple peripherals and functionalities.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line shrink pitch design reduces footprint and enables easier PCB assembly, ideal for compact designs.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V allows for stable performance while consuming less power, beneficial in battery-operated devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this microcontroller is suitable for industrial applications where higher thermal limits are required.

CPU Family: ST72

Using the ST72 family CPU ensures compatibility with established software and development environments, enhancing ease of use.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this microcontroller ideal for harsh environments, such as automotive or outdoor applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish allows for better solderability and reliability in connections, reducing potential failures over time.

ADC Channels: YES

ADC channels facilitate analog signal processing, making this microcontroller suitable for applications that require sensor interfacing.

Terminal Position: DUAL

Dual terminal positioning allows for versatile mounting options, making integration into varied designs easier.

ROM Words: 8192

With 8192 ROM words, there is sufficient memory for application code, enabling complex functionalities.

Maximum Seated Height: 5.08 mm

A maximum seated height of 5.08 mm ensures compact design while allowing easy integration into low-profile assemblies.

Width: 10.16 mm

The 10.16 mm width provides a balance between size and functionality, contributing to efficient layout designs on PCBs.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz provides sufficient speed for most tasks in small embedded applications.

Length: 27.94 mm

The length of 27.94 mm makes it suitable for most embedded systems, allowing for efficient use of PCB space.

Temperature Grade: INDUSTRIAL

The industrial temperature grade guarantees reliable operation in challenging environments, enhancing the longevity of the microcontroller.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it supports various peripherals, making it highly adaptable for an array of applications.

RAM Bytes: 256

256 bytes of RAM provides enough temporary storage for processing tasks, beneficial for simple applications.

Technology: CMOS

CMOS technology ensures low power consumption, making this microcontroller suitable for battery-operated designs.

Terminal Form: THROUGH-HOLE

Through-hole terminal form simplifies assembly for prototyping and ensures strong mechanical connections.

Maximum Supply Current: 9 mA

A maximum supply current of 9 mA allows for power-efficient operation, extending battery life in portable applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V is standard for many applications, providing ease of availability and design.

PWM Channels: YES

PWM channels enable precise control over motors and lighting applications, making this microcontroller versatile for control tasks.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates to code, facilitating rapid development and deployment cycles.

Terminal Pitch: 1.778 mm

A terminal pitch of 1.778 mm is standard for ease of soldering and PCB layout design, ensuring compatibility with existing boards.

Speed: 8 rpm

A speed of 8 rpm indicates suitable performance for certain low-speed applications, providing precise control in the necessary contexts.

No. of I/O Lines: 22

Having 22 I/O lines allows for extensive interfacing options, enabling connection to numerous devices and sensors.

Technical Specifications

Microcontrollers ST72C215G2B6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES FROM 3.2 TO 5.5V SUUPLY

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T32

JESD-609 Code:

e3

Length:

27.94 mm

No. of I/O Lines:

22

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP32,.4

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

5.08 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

10.16 mm

Peripheral IC Type:

Trade Compliance

ST72C215G2B6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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