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ST62T25CM3

STMicroelectronics

ST62T25CM3 by STMicroelectronics

ST62T25CM3 by STMicroelectronics is an 8-bit microcontroller with 4096 ROM words, 64 RAM bytes, and 16-Ch 8-Bit ADC channels. Ideal for automotive applications, it operates b/w -40 to 125 °C with a max clock frequency of 8 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,700 parts In-Stock

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3,700

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Vyrian

USA . 3,456 parts In-Stock

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3,456

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Anansix

USA . 2,277 parts In-Stock

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2,277

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Distributors (Availability)

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Microchip USA

USA . 203 parts In-Stock

1+ parts

$6.941

100+ parts

-

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203

$6.941

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AZTECH Wire

Italy . 1,207 parts In-Stock

1+ parts

$21.960

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1,207

$21.960

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IDEA Electronic Components Group

UK . 316 parts In-Stock

1+ parts

$30.411

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$27.370

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316

$30.411

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$27.370

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MKK Technologies

India . 1,706 parts In-Stock

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$57.185

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1,706

$57.185

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DigiPath Technology Company

USA . 1,706 parts In-Stock

1+ parts

$57.185

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1,706

$57.185

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Component Stockers USA

USA . 664 parts In-Stock

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$99.990

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664

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 8,692 parts In-Stock

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8,692

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Vigor

Singapore . 6,329 parts In-Stock

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6,329

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Parana Technologies

USA . 983 parts In-Stock

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$36.360

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983

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$36.360

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Corphita

USA . 418 parts In-Stock

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418

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Overview

Unleash the power of innovation with the ST62T25CM3 microcontroller by STMicroelectronics. Designed with precision and reliability, this versatile component is perfect for a wide range of applications in the automotive industry. With advanced features such as 64 bytes of RAM, 16-channel 8-bit ADC, and OTPROM ROM programmability, this microcontroller offers unmatched performance and efficiency. Trust in STMicroelectronics to deliver cutting-edge technology that transforms your projects into success stories. Experience the difference with the ST62T25CM3 - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and reliability for the product, making it suitable for various applications.

Surface Mount: YES

Surface mount design allows for easy and convenient installation of the microcontroller on printed circuit boards.

Maximum Supply Voltage: 6 V

Allows for a higher supply voltage which can accommodate a wider range of power supply options.

Bit Size: 8

8-bit architecture provides a good balance between complexity and cost for many embedded systems applications.

Power Supplies (V): 3.3/5

Supports multiple power supply options, offering flexibility in power management.

No. of Terminals: 28

Sufficient number of terminals for connecting peripheral devices and components in the system.

Maximum Operating Temperature: 125 °C

High operating temperature range makes the microcontroller suitable for automotive and industrial applications where temperature variations are common.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in harsh environmental conditions without compromising performance.

ADC Channels: YES

Built-in Analog to Digital Converters enable the microcontroller to interface with analog sensors and devices.

ROM Words: 4096

Sufficient ROM capacity for storing program instructions, data, and configurations for the embedded system.

Maximum Clock Frequency: 8 MHz

Provides a decent clock speed for real-time processing of data and instructions in embedded applications.

RAM Bytes: 64

Adequate RAM capacity for temporary data storage and manipulation during program execution.

Technology: HCMOS

HCMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Analog To Digital Convertors: 16-Ch 8-Bit

Multiple ADC channels with 8-bit resolution provide accurate analog signal conversion for diverse sensing applications.

Technical Specifications

Microcontrollers ST62T25CM3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST6200

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

No. of I/O Lines:

20

No. of Terminals:

28

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

64

ROM Words:

4096

ROM Programmability:

OTPROM

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

3.5 mA

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

HCMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

TIMER(2)

Analog To Digital Convertors:

16-Ch 8-Bit

Trade Compliance

ST62T25CM3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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