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ST62T20CB3

STMicroelectronics

ST62T20CB3 by STMicroelectronics

ST62T20CB3 by STMicroelectronics is an 8-bit microcontroller with 4096 ROM words, 64 RAM bytes, and ADC channels. Ideal for automotive applications, it operates at -40 to 125 °C with a max clock frequency of 8 MHz. With a package size of 26.16mm x 7.62mm x 5.33mm, it features TIMER(2) peripherals and HCMOS technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,564 parts In-Stock

1+ parts

-

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4,564

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Vyrian

USA . 3,131 parts In-Stock

1+ parts

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3,131

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Anansix

USA . 2,462 parts In-Stock

1+ parts

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2,462

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,122 parts In-Stock

1+ parts

$15.855

100+ parts

-

1k+ parts

$14.270

10k+ parts

-

1,122

$15.855

-

$14.270

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AZTECH Wire

Italy . 792 parts In-Stock

1+ parts

$17.460

100+ parts

-

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792

$17.460

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MKK Technologies

India . 1,165 parts In-Stock

1+ parts

$29.815

100+ parts

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1,165

$29.815

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DigiPath Technology Company

USA . 1,165 parts In-Stock

1+ parts

$29.815

100+ parts

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1,165

$29.815

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Corphita

USA . 3,998 parts In-Stock

1+ parts

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3,998

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Vigor

Singapore . 2,806 parts In-Stock

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2,806

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Parana Technologies

USA . 977 parts In-Stock

1+ parts

-

100+ parts

$18.957

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977

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$18.957

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Microchip USA

USA . 226 parts In-Stock

1+ parts

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226

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Overview

Unlock endless possibilities with the ST62T20CB3 by STMicroelectronics, a top-tier microcontroller that boasts superior quality and reliability. With a trusted manufacturer like STMicroelectronics behind it, this device is perfect for a wide range of applications in automotive and industrial settings. Offering exceptional value and benefits, this microcontroller provides seamless performance and efficiency to customers seeking cutting-edge technology. Experience innovation at its finest with the ST62T20CB3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material offers good durability and protection for the microcontroller, making it suitable for various environmental conditions.

Maximum Supply Voltage: 6 V

Support for a maximum supply voltage of 6V allows for flexibility in power input options.

Bit Size: 8

8-bit architecture provides a balance between cost, performance, and power efficiency for a wide range of applications.

Power Supplies (V): 3.3/5

Support for multiple power supply options (3.3V and 5V) allows for compatibility with various power sources.

No. of Terminals: 20

Having 20 terminals provides ample connectivity options for interfacing with external devices and components.

Package Style (Meter): IN-LINE

IN-LINE packaging style offers a compact form factor, making it suitable for space-constrained applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it integrates various peripherals like timers and ADCs, reducing the need for external components.

Maximum Clock Frequency: 8 MHz

An 8 MHz clock frequency allows for efficient processing of instructions and data in real-time applications.

RAM Bytes: 64

With 64 bytes of RAM, the microcontroller can store and process data quickly, enhancing overall performance.

Technology: HCMOS

HCMOS technology offers a good balance between speed, power efficiency, and cost-effectiveness in digital circuit design.

Technical Specifications

Microcontrollers ST62T20CB3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST6200

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

26.16 mm

No. of I/O Lines:

12

No. of Terminals:

20

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

64

ROM Words:

4096

ROM Programmability:

OTPROM

Maximum Seated Height:

5.33 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

3.5 mA

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

HCMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

TIMER(2)

Analog To Digital Convertors:

8-Ch 8-Bit

Trade Compliance

ST62T20CB3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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