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ST62T03CM6

STMicroelectronics

ST62T03CM6 by STMicroelectronics

ST62T03CM6 by STMicroelectronics is an 8-bit microcontroller with a max clock frequency of 8 MHz. It operates in industrial temperature range (-40 to 85 °C) and has 64 bytes of RAM. Suitable for applications requiring low power consumption, such as IoT devices and embedded systems.

Median Price

$2.310

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 25 parts In-Stock

1+ parts

$2.310

100+ parts

$1.730

1k+ parts

$1.500

10k+ parts

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25

$2.310

$1.730

$1.500

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Vyrian

USA . 3,268 parts In-Stock

1+ parts

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3,268

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Anansix

USA . 2,447 parts In-Stock

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2,447

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Infinite Electronics LLP

India . 649 parts In-Stock

1+ parts

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649

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Bristol Electronics

USA . 225 parts In-Stock

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225

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Digiode

USA . 183 parts In-Stock

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183

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LWI Electronics Inc

India . 110 parts In-Stock

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110

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J2 Sourcing AB

Sweden . 41 parts In-Stock

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41

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 442 parts In-Stock

1+ parts

$1.606

100+ parts

-

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442

$1.606

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AZTECH Wire

Italy . 79 parts In-Stock

1+ parts

$8.110

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-

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79

$8.110

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IDEA Electronic Components Group

UK . 1,999 parts In-Stock

1+ parts

$67.746

100+ parts

-

1k+ parts

$60.971

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1,999

$67.746

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$60.971

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MKK Technologies

India . 1,847 parts In-Stock

1+ parts

$127.392

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1,847

$127.392

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DigiPath Technology Company

USA . 1,847 parts In-Stock

1+ parts

$127.392

100+ parts

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1,847

$127.392

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Corphita

USA . 4,823 parts In-Stock

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4,823

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Parana Technologies

USA . 1,374 parts In-Stock

1+ parts

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$81.001

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1,374

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$81.001

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Perfect Parts

USA . 1,068 parts In-Stock

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1,068

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Kepictronics

USA . 128 parts In-Stock

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128

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Overview

Unleash the power of innovation with the ST62T03CM6 microcontroller by STMicroelectronics. This cutting-edge device offers unparalleled quality and reliability, backed by a trusted manufacturer with decades of experience in the industry. Ideal for a wide range of applications, this microcontroller delivers exceptional value and performance to customers seeking seamless integration and optimal functionality. Experience the difference with the ST62T03CM6 and revolutionize your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost during production.

Maximum Supply Voltage: 6 V

Ability to handle a maximum supply voltage of 6V provides flexibility in power supply options for the device.

Package Shape: RECTANGULAR

Rectangular shape allows for compact and efficient PCB layout, saving space in the overall design.

Bit Size: 8

8-bit architecture offers a good balance between performance and cost, making it suitable for a wide range of applications.

Power Supplies (V): 3.3/5

Support for multiple power supply voltages allows for compatibility with different power sources and energy efficiency.

No. of Terminals: 16

Having 16 terminals provides sufficient connectivity options for interfacing with external components and peripherals.

Package Style (Meter): SMALL OUTLINE

Small outline package style offers space-saving benefits and ease of integration into compact electronic devices.

Minimum Supply Voltage: 3.6 V

Ensuring a stable operation at a minimum supply voltage of 3.6V enables reliable performance under varying power conditions.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance of 85 °C allows for operation in harsh environmental conditions without compromising performance.

CPU Family: ST6200

Belonging to the ST6200 CPU family indicates reliable performance and compatibility with other devices in the same family for seamless integration.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, the microcontroller can function effectively in cold environments without risk of failure.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal finish with Nickel, Palladium, and Gold offers excellent conductivity, corrosion resistance, and reliability for long-term usage.

ADC Channels: YES

Having ADC channels allows for analog signals to be converted to digital data, enabling a wider range of input options for the microcontroller.

Terminal Position: DUAL

Dual terminal position provides stability during soldering and PCB mounting, ensuring a secure connection for efficient operation.

ROM Words: 1036

With 1036 ROM words, the microcontroller can store essential program instructions and data, enhancing its processing capabilities.

Maximum Seated Height: 2.65 mm

Low maximum seated height of 2.65mm allows for slim and compact device designs without sacrificing performance.

Width: 7.5 mm

Narrow width of 7.5mm facilitates space-efficient PCB layout and integration into small electronic devices.

Maximum Clock Frequency: 8 MHz

Support for a maximum clock frequency of 8MHz enables fast data processing and improved overall system performance.

Maximum Time At Peak Reflow Temperature (s): 30

Being able to withstand a peak reflow temperature for up to 30 seconds ensures reliable soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260 °C allows for efficient and durable soldering connections for long-term device reliability.

Length: 10.3 mm

Compact length of 10.3mm provides flexibility in device placement and layout, optimizing space usage in electronic designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environments with extreme temperature variations, making it suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it offers integrated peripherals and processing capabilities in a single package, simplifying system design and reducing component count.

RAM Bytes: 64

64 bytes of RAM provide temporary storage for data processing, enhancing the microcontroller's ability to handle complex algorithms and tasks.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and noise immunity, making the microcontroller energy-efficient and reliable for various applications.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and ease of soldering during PCB assembly, ensuring a secure and durable connection.

Maximum Supply Current: 3.5 mA

Low maximum supply current of 3.5mA reduces power consumption and heat generation, contributing to energy efficiency and prolonged device lifespan.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage of 5V ensures consistent performance and compatibility with standard power sources for easy integration.

ROM Programmability: OTPROM

One-Time Programmable ROM allows for permanent storage of firmware and data, ensuring reliability and security of critical information.

Terminal Pitch: 1.27 mm

Narrow terminal pitch of 1.27mm enables high-density PCB layouts and minimizes signal interference, enhancing overall system efficiency.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate susceptibility to moisture damage, requiring proper handling and storage to maintain product integrity.

Speed: 8 rpm

Operating at a speed of 8 rotations per minute ensures efficient data processing and system responsiveness for real-time applications.

No. of I/O Lines: 9

Having 9 I/O lines allows for versatile connectivity options for input and output signals, enhancing the microcontroller's flexibility in interfacing with external devices.

Technical Specifications

Microcontrollers ST62T03CM6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST6200

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

9

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

64

ROM Words:

1036

ROM Programmability:

OTPROM

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

3.5 mA

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

3.6 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

ST62T03CM6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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