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ST62T03CB6

STMicroelectronics

ST62T03CB6 by STMicroelectronics

ST62T03CB6 by STMicroelectronics is an 8-bit microcontroller with 64 bytes of RAM and 1036 ROM words. It operates at a max clock frequency of 8 MHz, suitable for industrial applications requiring a CPU family of ST6200. The package style is in-line with a rectangular shape, making it ideal for through-hole terminal forms.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

ComSIT Distribution GmbH

Germany . 14,550 parts In-Stock

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14,550

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ComSIT USA

USA . 14,450 parts In-Stock

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14,450

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Vyrian

USA . 7,970 parts In-Stock

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7,970

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Digiode

USA . 1,979 parts In-Stock

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1,979

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Anansix

USA . 1,457 parts In-Stock

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1,457

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 440 parts In-Stock

1+ parts

$7.476

100+ parts

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440

$7.476

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AZTECH Wire

Italy . 103 parts In-Stock

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$17.580

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103

$17.580

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$31.565

100+ parts

$28.724

1k+ parts

$25.883

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-

3,000

$31.565

$28.724

$25.883

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IDEA Electronic Components Group

UK . 583 parts In-Stock

1+ parts

$58.697

100+ parts

-

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$52.827

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583

$58.697

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$52.827

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MKK Technologies

India . 442 parts In-Stock

1+ parts

$110.376

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442

$110.376

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DigiPath Technology Company

USA . 442 parts In-Stock

1+ parts

$110.376

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442

$110.376

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Corphita

USA . 4,683 parts In-Stock

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4,683

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Vigor

Singapore . 2,500 parts In-Stock

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2,500

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Parana Technologies

USA . 873 parts In-Stock

1+ parts

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100+ parts

$70.181

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873

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$70.181

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A-Z Elektronik GmbH

Germany . 161 parts In-Stock

1+ parts

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161

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Assy Fe

Spain . 28 parts In-Stock

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28

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Overview

Unlock the power of innovation with the ST62T03CB6 microcontroller by STMicroelectronics. This high-quality, versatile device offers a multitude of applications in various industries, providing exceptional performance and reliability. With its advanced technology and robust design, this microcontroller delivers unmatched value and benefits to customers, making it the ideal choice for your next project. Experience the difference with STMicroelectronics and take your designs to new heights with the ST62T03CB6.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY is a durable and lightweight material, making the microcontroller easy to handle and resistant to damage during handling and use.

Maximum Supply Voltage: 6 V

The high maximum supply voltage of 6V provides flexibility in powering the microcontroller, allowing for a wider range of voltage sources to be used.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to integrate the microcontroller into various electronic designs and layouts, optimizing space efficiency.

Bit Size: 8

The 8-bit architecture of the microcontroller allows for efficient processing of data and instructions, making it suitable for a wide range of applications.

Power Supplies (V): 3.3/5

Support for both 3.3V and 5V power supplies gives flexibility in power input options, making the microcontroller compatible with different types of circuits and systems.

No. of Terminals: 16

Having 16 terminals provides a sufficient number of connections for interfacing with other components and peripherals, enhancing the microcontroller's functionality.

Package Style (Meter): IN-LINE

The in-line package style allows for easy integration and placement of the microcontroller on a PCB, enabling a streamlined and organized circuit design.

Minimum Supply Voltage: 3.6 V

The minimum supply voltage of 3.6V ensures stable operation and reliable performance, even under lower voltage conditions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the microcontroller can withstand harsh environmental conditions and maintain optimal functionality.

CPU Family: ST6200

Being part of the ST6200 CPU family signifies a reliable and established brand, ensuring quality performance and compatibility with related products.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows the microcontroller to function effectively in cold environments without sacrificing performance.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish on the terminals provides excellent conductivity and resistance to corrosion, ensuring reliable connections and long-term durability.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to convert analog signals into digital data, expanding its capabilities for various sensing and measurement applications.

Terminal Position: DUAL

Having dual terminal positions enables flexibility in mounting and connection options, accommodating different PCB layouts and integration requirements.

ROM Words: 1036

With 1036 ROM words, the microcontroller has sufficient memory for storing program instructions and data, supporting complex algorithms and operations.

Maximum Seated Height: 5.33 mm

The compact maximum seated height of 5.33 mm allows for a low-profile design, ideal for space-constrained applications and compact electronic devices.

Width: 7.62 mm

The moderate width of 7.62 mm strikes a balance between compactness and ease of handling, making the microcontroller suitable for a variety of board sizes and layouts.

Maximum Clock Frequency: 8 MHz

The high maximum clock frequency of 8 MHz enables fast processing and execution of instructions, improving overall performance and responsiveness.

Length: 19.18 mm

The length of 19.18 mm provides a compact form factor for the microcontroller, ensuring efficient use of space in electronic designs while maintaining functionality.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades means the microcontroller can operate reliably in demanding industrial environments with fluctuating temperatures.

Peripheral IC Type: MICROCONTROLLER

This microcontroller comes with integrated peripheral ICs, reducing the need for additional components and simplifying the design process for embedded systems.

RAM Bytes: 64

Having 64 bytes of RAM provides temporary storage for data and variables during program execution, facilitating efficient processing and manipulation of information.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for secure and robust connections to a PCB, ensuring stability and durability in various operating conditions.

Maximum Supply Current: 3.5 mA

The low maximum supply current of 3.5 mA helps in conserving power and reducing energy costs, making the microcontroller environmentally friendly and cost-effective.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a common standard in electronics, ensuring compatibility with a wide range of power sources and components.

ROM Programmability: OTPROM

The one-time programmable ROM feature allows for permanent storage of essential program code, providing secure and instant access to critical instructions.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54 mm facilitates easy soldering and connection of the microcontroller to a PCB, simplifying assembly and maintenance tasks.

Speed: 8 rpm

The speed of 8 rpm indicates the rotation rate of a motor or mechanical component that can be controlled by the microcontroller, adding versatility to its applications.

No. of I/O Lines: 9

Having 9 I/O lines provides multiple options for input and output connectivity, increasing the versatility and functionality of the microcontroller in interfacing with external devices.

Technical Specifications

Microcontrollers ST62T03CB6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST6200

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.18 mm

No. of I/O Lines:

9

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

64

ROM Words:

1036

ROM Programmability:

OTPROM

Maximum Seated Height:

5.33 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

3.5 mA

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

3.6 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Peripheral IC Type:

Trade Compliance

ST62T03CB6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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