Loading...

ST2G3236

STMicroelectronics

ST2G3236 by STMicroelectronics

ST2G3236 by STMicroelectronics is a CMOS bus driver featuring a 1.8V nominal voltage, 2 bits, and a propagation delay of just 6.2 ns. Its compact design (1.4mm x 1.8mm) suits industrial applications requiring high-speed data transfer in tight spaces. Operating b/w -40 °C to 85°C ensures reliability in diverse environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,341 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,341

-

-

-

-

Digiode

USA . 2,304 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,304

-

-

-

-

Anansix

USA . 1,248 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,248

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,205 parts In-Stock

1+ parts

$5.373

100+ parts

-

1k+ parts

$5.158

10k+ parts

$5.158

3,205

$5.373

-

$5.158

$5.158

IDEA Electronic Components Group

UK . 2,378 parts In-Stock

1+ parts

$8.716

100+ parts

-

1k+ parts

$7.844

10k+ parts

-

2,378

$8.716

-

$7.844

-

MKK Technologies

India . 2,131 parts In-Stock

1+ parts

$16.390

100+ parts

-

1k+ parts

-

10k+ parts

-

2,131

$16.390

-

-

-

DigiPath Technology Company

USA . 2,131 parts In-Stock

1+ parts

$16.390

100+ parts

-

1k+ parts

-

10k+ parts

-

2,131

$16.390

-

-

-

Parana Technologies

USA . 1,158 parts In-Stock

1+ parts

-

100+ parts

$10.421

1k+ parts

-

10k+ parts

-

1,158

-

$10.421

-

-

Corphita

USA . 982 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

982

-

-

-

-

Overview

Unlock superior performance and reliability with the ST2G3236 from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for seamless data transmission in compact applications, this robust bus driver ensures swift signal integrity while thriving in temperatures from -40 °C to 85°C. Experience enhanced design flexibility, reduced footprint, and exceptional power efficiency that elevate your projects, making them future-ready and competitive.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for efficient use of PCB space and enables automated assembly processes, making it ideal for compact electronic devices.

Package Shape: SQUARE

The square package shape contributes to a compact footprint, allowing for higher density placements on the circuit board.

No. of Bits: 2

With 2 bits, this product can handle basic data transmission, providing essential functionality for simple applications.

Nominal Supply Voltage / Vsup: 1.8 V

A nominal supply voltage of 1.8 V makes it suitable for modern low-voltage systems, ensuring lower power consumption and compatibility with battery-operated devices.

No. of Terminals: 10

Having 10 terminals offers versatility in connections, making it adaptable for various circuit configurations.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The very thin profile of the chip carrier design aids in applications where space is at a premium, contributing to a sleek overall design.

Propagation Delay (tpd): 6.2 ns

A low propagation delay of 6.2 ns ensures rapid data transmission, making it suitable for high-speed applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can perform reliably in industrial environments without failure.

Output Characteristics: 3-STATE

The 3-state output capability allows for effective bus management in multi-device communication setups, enhancing overall system functionality.

Minimum Operating Temperature: -40 °C

The ability to operate down to -40 °C makes this product suitable for harsh environmental conditions, ensuring durability and reliability.

Terminal Position: QUAD

The quad terminal position allows for efficient packaging and enhances the signal integrity while minimizing interference.

No. of Ports: 2

Having 2 ports makes this product versatile for use in dual-channel applications, allowing for increased communication capabilities.

Maximum Seated Height: 0.55 mm

A maximum seated height of 0.55 mm ensures a low-profile design, ideal for slim devices and tight layouts.

Width: 1.4 mm

The width of 1.4 mm contributes to the compact nature of the device, facilitating integration into size-restricted applications.

Output Polarity: TRUE

True output polarity simplifies circuit design and ensures compatibility with standard logical levels, enhancing ease of use.

Minimum Supply Voltage (Vsup): 1.4 V

Supports a minimum supply voltage of 1.4 V, allowing operation in low-power applications, thus extending battery life in portable devices.

Length: 1.8 mm

At a length of 1.8 mm, this compact design facilitates easier integration into densely populated PCBs.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ratings ensures reliable performance across varying thermal conditions in demanding environments.

Technology: CMOS

Utilizing CMOS technology offers benefits such as lower static power consumption and reduced heat generation, making it energy efficient.

Terminal Form: NO LEAD

The no-lead terminal form enhances this product's environmental compliance, making it suitable for RoHS applications.

Terminal Pitch: 0.4 mm

A terminal pitch of 0.4 mm allows for high-density mounting solutions, fitting seamlessly into modern electronic designs.

Maximum Supply Voltage (Vsup): 3.6 V

This wide supply voltage range (up to 3.6 V) permits versatility in different applications while ensuring operational flexibility.

Technical Specifications

Bus Driver & Transceivers ST2G3236 attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

2G

JESD-30 Code:

S-XQCC-N10

Length:

1.8 mm

Logic IC Type:

No. of Bits:

2

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Propagation Delay (tpd):

6.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.4 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

1.4 mm

Trade Compliance

ST2G3236 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 1