Loading...

ST2G3236QTR

STMicroelectronics

ST2G3236QTR by STMicroelectronics

ST2G3236QTR from STMicroelectronics is a bidirectional bus driver with a 5.8 ns propagation delay, supporting voltage translation b/w 1.8V and 3.3V. It features a compact chip carrier package and operates in industrial temperatures from -40 °C to 85°C. Ideal for low-power applications, it ensures efficient data transfer in tight spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,626 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,626

-

-

-

-

Digiode

USA . 4,526 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,526

-

-

-

-

Semi Source

USA . 2,176 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,176

-

-

-

-

Netsource Technology, Inc.

USA . 1,642 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,642

-

-

-

-

Anansix

USA . 1,370 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,370

-

-

-

-

EMSNET

USA . 37 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

37

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 5,119 parts In-Stock

1+ parts

$5.530

100+ parts

-

1k+ parts

$5.309

10k+ parts

$5.309

5,119

$5.530

-

$5.309

$5.309

Microchip USA

USA . 367 parts In-Stock

1+ parts

$7.207

100+ parts

-

1k+ parts

-

10k+ parts

-

367

$7.207

-

-

-

IDEA Electronic Components Group

UK . 1,363 parts In-Stock

1+ parts

$15.244

100+ parts

-

1k+ parts

$13.720

10k+ parts

-

1,363

$15.244

-

$13.720

-

AZTECH Wire

Italy . 1,055 parts In-Stock

1+ parts

$20.710

100+ parts

-

1k+ parts

-

10k+ parts

-

1,055

$20.710

-

-

-

MKK Technologies

India . 1,484 parts In-Stock

1+ parts

$28.666

100+ parts

-

1k+ parts

-

10k+ parts

-

1,484

$28.666

-

-

-

DigiPath Technology Company

USA . 1,484 parts In-Stock

1+ parts

$28.666

100+ parts

-

1k+ parts

-

10k+ parts

-

1,484

$28.666

-

-

-

Kepictronics

USA . 54,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

54,000

-

-

-

-

Perfect Parts

USA . 6,196 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,196

-

-

-

-

Corphita

USA . 3,936 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,936

-

-

-

-

A-Z Elektronik GmbH

Germany . 2,850 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,850

-

-

-

-

Authorized Procurement Solutions

USA . 1,300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,300

-

-

-

-

Parana Technologies

USA . 1,228 parts In-Stock

1+ parts

-

100+ parts

$18.227

1k+ parts

-

10k+ parts

-

1,228

-

$18.227

-

-

Overview

Unlock seamless communication in your designs with the ST2G3236QTR from STMicroelectronics—a trusted leader in high-quality semiconductor solutions. This ultra-reliable bus driver ensures efficient data transfer between different voltage levels, catering to diverse applications from consumer electronics to industrial systems. With its compact design and exceptional performance, it enhances your project’s reliability while minimizing power consumption, delivering unmatched value that sets your innovations apart.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 5.8 ns

A low propagation delay ensures fast signal transmission, making this bus driver suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for compact design and easy integration into modern circuit boards.

Package Shape: SQUARE

The square package shape offers efficient use of PCB space and simplifies layout design.

No. of Bits: 2

Supporting multiple bits means this product can handle data effectively, providing flexibility in applications.

Translation: 1.8/2.5V & 3.3V

The ability to support multiple voltage levels aids in communication between different logic families, enhancing compatibility.

Nominal Supply Voltage / Vsup (V): 1.8

A nominal supply voltage of 1.8V is energy-efficient, reducing power consumption in battery-operated devices.

Power Supplies (V): 1.5/3.3

Flexible power supply options enable it to function in various systems, ensuring versatile applications.

No. of Terminals: 10

Ten terminals provide adequate connectivity for multiple inputs and outputs, facilitating diverse circuit configurations.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

A very thin profile allows for space-saving designs in compact electronic devices.

Maximum I (ol): 2 Amp

The capability of handling up to 2 Amps ensures reliable performance in power-demanding applications.

Propagation Delay (tpd): 6.2 ns

A quick propagation delay supports efficient data transfer, ideal for high-speed signal transmission.

Maximum Operating Temperature: 85 °C

Operating at high temperatures ensures reliability in demanding environments, suitable for industrial applications.

Output Characteristics: 3-STATE

3-state output characteristics allow for better control in bus systems, reducing conflicts when multiple devices communicate.

Minimum Operating Temperature: -40 °C

A wide operating temperature range makes this product suitable for use in harsh conditions, assuring durability.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finishes enhance reliability and longevity, providing strong electrical connections.

Terminal Position: QUAD

Quad terminal position offers an organized layout for connecting various functions, improving design efficiency.

No. of Ports: 2

Two ports allow for simultaneous data communication pathways, increasing the versatility of the device.

Maximum Seated Height: 0.55 mm

A low seated height facilitates low-profile designs, ideal for compact electronic devices.

Width: 1.4 mm

Narrow width contributes to space-saving PCB designs, aligning with modern minimalistic trends.

Output Polarity: TRUE

True output polarity enables straightforward signal interpretation, simplifying circuit design.

Minimum Supply Voltage (Vsup): 1.4 V

Low minimum supply voltage supports low-power applications, making the device energy-efficient.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature supports reliable soldering processes, ensuring solid electrical connections.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures compatibility with a wide range of soldering techniques.

Length: 1.8 mm

Compact length allows for efficient space usage on the PCB, promoting a streamlined design.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures performance in tough environments, making it suitable for industrial applications.

Technology: CMOS

CMOS technology offers high speed and low power consumption, aligning well with modern electronic requirements.

Terminal Form: NO LEAD

No lead design optimizes for minimal environmental impact and is compatible with various manufacturing processes.

Packing Method: TR

Tape and reel packing facilitates automated assembly processes, increasing production efficiency.

Terminal Pitch: 0.4 mm

A small terminal pitch allows for denser packing of components on PCBs, beneficial for compact applications.

Count Direction: BIDIRECTIONAL

Bidirectional capability enhances data flow management, making it versatile for various applications.

Control Type: COMMON CONTROL

Common control enables coordinated management of multiple outputs, simplifying bus communication.

Maximum Supply Voltage (Vsup): 3.6 V

Supporting a max supply voltage of 3.6V allows integration into various circuits, enhancing its application scope.

Technical Specifications

Bus Driver & Transceivers ST2G3236QTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

2G

JESD-30 Code:

S-XQCC-N10

JESD-609 Code:

e4

Length:

1.8 mm

Logic IC Type:

Maximum I (ol):

2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC10,.06X.07,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5/3.3

Propagation Delay At Nominal Supply:

5.8 ns

Propagation Delay (tpd):

6.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Sub-Category:

Bus Driver/Transceiver

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.4 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

1.8/2.5V&3.3V

Width:

1.4 mm

Trade Compliance

ST2G3236QTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 1