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SPC58EC80C3Q0C0X

STMicroelectronics

SPC58EC80C3Q0C0X by STMicroelectronics

SPC58EC80C3Q0C0X microcontroller by STMicroelectronics features a 32-bit E200Z4 CPU, operates at a max temp of 125 °C, and supports up to 64 DMA channels. Ideal for automotive applications, it offers integrated cache and multiple connectivity options. Its compact design ensures efficient performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,285 parts In-Stock

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9,285

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Digiode

USA . 2,522 parts In-Stock

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2,522

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Anansix

USA . 751 parts In-Stock

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751

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Distributors (Availability)

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AZTECH Wire

Italy . 292 parts In-Stock

1+ parts

$21.730

100+ parts

-

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292

$21.730

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Vigor

Singapore . 1,352 parts In-Stock

1+ parts

$22.750

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1,352

$22.750

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IDEA Electronic Components Group

UK . 1,715 parts In-Stock

1+ parts

$75.035

100+ parts

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$67.532

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1,715

$75.035

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$67.532

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MKK Technologies

India . 1,388 parts In-Stock

1+ parts

$141.099

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1,388

$141.099

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DigiPath Technology Company

USA . 1,388 parts In-Stock

1+ parts

$141.099

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1,388

$141.099

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Microchip USA

USA . 4,828 parts In-Stock

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4,828

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Corphita

USA . 2,595 parts In-Stock

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2,595

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Parana Technologies

USA . 2,133 parts In-Stock

1+ parts

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$89.716

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2,133

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$89.716

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Overview

Unlock unparalleled performance with the SPC58EC80C3Q0C0X microcontroller from STMicroelectronics, a leader in cutting-edge technology. Designed for automotive and industrial applications, this powerhouse combines robust reliability with advanced features like integrated cache and multiple I/O options. Experience exceptional efficiency and flexibility while ensuring compliance with stringent AEC-Q100 standards. Elevate your projects with a solution that delivers quality, longevity, and innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The sturdy plastic/epoxy material ensures durability and protection against environmental factors, making the microcontroller suitable for various applications.

Integrated Cache: YES

The presence of an integrated cache enhances data processing speeds and efficiency, leading to improved overall system performance.

Surface Mount: YES

Surface mount technology optimizes space and allows for a more compact design, making it ideal for modern electronic devices.

Maximum Supply Voltage: 1.26 V

A low maximum supply voltage contributes to reduced power consumption, promoting energy efficiency in battery-operated devices.

On Chip Data RAM Width: 8

With an 8-bit RAM width, this microcontroller is effective for handling various tasks and implementing complex algorithms.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures high reliability and performance in automotive applications, making it suitable for critical systems.

Package Shape: SQUARE

The square shape simplifies PCB layout and placement, leading to easier integration in electronic designs.

Bit Size: 32

A 32-bit architecture allows for processing larger data types and improved computational capabilities compared to 8- and 16-bit microcontrollers.

No. of Terminals: 292

With 292 terminals, this microcontroller provides ample connectivity options, accommodating a wide range of peripherals and interfaces.

Package Style (Meter): GRID ARRAY, FINE PITCH

Fine pitch grid array style minimizes space on the PCB, enhancing the design's compactness without compromising performance.

Minimum Supply Voltage: 1.14 V

A low minimum supply voltage supports a variety of power sources, making it adaptable for different voltage requirements.

Maximum Operating Temperature: 125 °C

Operating up to 125 °C ensures reliability in high-temperature settings, making it suitable for harsh environments.

CPU Family: E200Z4

The E200Z4 CPU family is known for its high performance and low power consumption, ideal for efficient processing in embedded systems.

Minimum Operating Temperature: -40 °C

A wide temperature range from -40 °C allows operation in extreme conditions, enhancing versatility in applications.

ADC Channels: YES

The inclusion of ADC channels enables effective conversion from analog to digital signals, essential for interfacing with a variety of sensors.

DMA Channels: YES

DMA channels facilitate efficient data transfers without CPU intervention, increasing system performance and reducing bottlenecks.

Terminal Position: BOTTOM

Bottom terminal positioning is conducive for low-profile designs and provides better thermal performance on the PCB.

ROM Words: 4,194,304

A large ROM capacity allows for extensive program storage, crucial for complex applications requiring significant firmware.

Maximum Seated Height: 1.8 mm

A compact height aids in space-constrained designs, offering flexibility for thin devices.

Width: 17 mm

The standardized width ensures compatibility with various PCB layouts, simplifying the manufacturing process.

Data EEPROM Size: 128K

A sizable EEPROM enables effective storage of user settings and non-volatile data, enhancing application functionality.

Boundary Scan: YES

The boundary scan feature aids in efficient debugging and testing, streamlining the development process.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

Rich peripheral set enhances flexibility and functionality, enabling a wide range of applications from simple to advanced.

Maximum Clock Frequency: 40 MHz

A high clock frequency allows for faster processing speeds, improving the responsiveness of applications.

Length: 17 mm

A defined length ensures uniformity in PCB design, easing assembly and component placement.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture provides enhanced performance and efficiency, making it suitable for demanding embedded applications.

No. of Timers: 12

Multiple timers support various timing functions, which are essential for precise control in applications like motor control.

RAM Bytes: 393216

Ample RAM ensures smooth operation for multiple tasks or processes, allowing for complex applications to run seamlessly.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, crucial for battery-powered devices.

Terminal Form: BALL

Ball-terminal packaging enhances soldering reliability and allows for better thermal management.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

High-resolution ADCs enable accurate signal processing, critical for applications that rely on sensor data.

Maximum Supply Current: 50 mA

Low supply current contributes to energy efficiency, extending device battery life and reducing overall power costs.

Nominal Supply Voltage: 1.2 V

A nominal supply voltage of 1.2 V supports a variety of low-power designs, appealing for modern electronics.

No. of DMA Channels: 64

An extensive number of DMA channels allows for efficient data management, reducing CPU load during intensive operations.

No. of Serial I/Os: 26

A high number of serial I/Os makes it flexible for interfacing with multiple devices, enhancing application connectivity.

PWM Channels: YES

PWM channels enable precise control for applications such as motor speed control, enhancing performance capabilities.

Connectivity: CAN(8), I2C, SPI(8), UART(18)

Diverse connectivity options support a variety of communication protocols, permitting integration into complex systems.

ROM Programmability: FLASH

FLASH programmability allows for easy updates and reprogramming, ensuring longevity and flexibility in application development.

Terminal Pitch: 0.8 mm

A compact terminal pitch is advantageous in creating dense layouts, which is crucial for modern electronic designs.

Format: FLOATING POINT

The floating-point format allows for handling of complex calculations, beneficial in applications requiring high precision.

Speed: 180 rpm

An operational speed of 180 rpm signifies suitability for applications requiring controlled motion, particularly in actuators.

Low Power Mode: YES

The availability of low power mode extends battery life in portable applications, enhancing energy savings during idle states.

On Chip Program ROM Width: 8

An 8-bit ROM width is effective for storing programs efficiently, supporting various embedded applications.

Technical Specifications

Microcontrollers SPC58EC80C3Q0C0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B292

Length:

17 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

26

No. of Terminals:

292

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA292,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

393216

ROM Words:

4194304

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.8 mm

Speed:

180 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

17 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

CAN(8), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58EC80C3Q0C0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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