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SPC560P50L3BEABY

STMicroelectronics

SPC560P50L3BEABY by STMicroelectronics

SPC560P50L3BEABY by STMicroelectronics is a 32-bit microcontroller designed for industrial applications, featuring a max supply voltage of 3.465V and operating temp range from -40 °C to 105 °C. It supports ADC and PWM channels, making it ideal for automation tasks. With a compact flatpack design and 100 terminals, it's perfect for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,889 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,889

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-

-

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Digiode

USA . 3,602 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,602

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Anansix

USA . 2,842 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,842

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 3,800 parts In-Stock

1+ parts

$4.850

100+ parts

-

1k+ parts

-

10k+ parts

-

3,800

$4.850

-

-

-

AZTECH Wire

Italy . 713 parts In-Stock

1+ parts

$14.070

100+ parts

-

1k+ parts

-

10k+ parts

-

713

$14.070

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-

-

IDEA Electronic Components Group

UK . 2,065 parts In-Stock

1+ parts

$27.739

100+ parts

-

1k+ parts

$24.965

10k+ parts

-

2,065

$27.739

-

$24.965

-

MKK Technologies

India . 873 parts In-Stock

1+ parts

$52.161

100+ parts

-

1k+ parts

-

10k+ parts

-

873

$52.161

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-

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DigiPath Technology Company

USA . 873 parts In-Stock

1+ parts

$52.161

100+ parts

-

1k+ parts

-

10k+ parts

-

873

$52.161

-

-

-

Component Stockers USA

USA . 705 parts In-Stock

1+ parts

$57.040

100+ parts

-

1k+ parts

-

10k+ parts

-

705

$57.040

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 22,908 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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22,908

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Corphita

USA . 4,544 parts In-Stock

1+ parts

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4,544

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Microchip USA

USA . 2,924 parts In-Stock

1+ parts

-

100+ parts

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2,924

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,000

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-

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Parana Technologies

USA . 176 parts In-Stock

1+ parts

-

100+ parts

$33.166

1k+ parts

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10k+ parts

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176

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$33.166

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Overview

Unlock the potential of your projects with the SPC560P50L3BEABY microcontroller from STMicroelectronics. Renowned for its reliability and innovation, STMicroelectronics ensures superior performance in demanding applications, from automotive to industrial automation. With a robust design that thrives in extreme temperatures, this microcontroller offers seamless integration and extensive connectivity options, empowering you to create efficient, cutting-edge solutions that stand out in today’s competitive landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy material contributes to the longevity and reliability of the microcontroller in various environments.

Surface Mount: YES

Surface mount design allows for compact placement on PCBs, making it suitable for space-constrained applications.

Maximum Supply Voltage: 3.465 V

Generous maximum supply voltage ensures compatibility with a wide range of power sources, enhancing flexibility in designs.

Address Bus Width: 32

The 32-bit address bus width supports larger memory addressing, making it suitable for applications requiring extensive memory.

Package Shape: SQUARE

Square package shape aids in efficient space utilization on PCBs and enables easier thermal management.

Bit Size: 32

The 32-bit architecture enables high-level computing capabilities and efficient processing for demanding applications.

No. of Terminals: 100

A high number of terminals provides versatile connectivity options for peripherals and external devices.

Package Style (Meter): FLATPACK

Flatpack design simplifies assembly and ensures secure mounting for reliability in device operation.

Minimum Supply Voltage: 2.97 V

Lower minimum supply voltage increases the range of operational power sources, facilitating battery-powered applications.

Maximum Operating Temperature: 105 °C

High temperature tolerance makes this microcontroller suitable for industrial applications subject to harsh operating conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range (-40 °C to 105 °C) allows for operation in extreme environments, enhancing the product’s versatility.

Terminal Finish: TIN

Tin terminal finish provides good solderability and enhances the reliability of electrical connections.

ADC Channels: YES

Integrated analog-to-digital converters (ADCs) enable real-time data acquisition, making it ideal for sensor applications.

DMA Channels: YES

Direct Memory Access (DMA) channels improve data handling efficiency, allowing for smoother operation in data-intensive applications.

Terminal Position: QUAD

Quad terminal positioning enhances connectivity and simplifies the routing process on printed circuit boards.

Width: 14 mm

Compact width allows for efficient space management in design layouts, making it suitable for portable devices.

External Data Bus Width: 32

32-bit external data bus supports high-speed data processing, enhancing performance in complex applications.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz ensures sufficient processing speed for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Tolerance to peak reflow temperature allows for robust soldering processes, ensuring durability in assembly.

Peak Reflow Temperature °C: 260

Supports high-temperature soldering processes, making it ideal for automated assembly lines.

Length: 14 mm

Compact length enhances PCB layout efficiency, allowing for more devices to be integrated into small spaces.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and stability in demanding environments, suitable for various applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture allows for optimized performance and lower power consumption, making it ideal for embedded systems.

Technology: CMOS

CMOS technology ensures low power consumption while delivering high-speed performance, suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and reliable electrical connections.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V aligns with modern digital electronics, promoting compatibility with current technologies.

PWM Channels: YES

Pulse Width Modulation (PWM) channels enable efficient motor control and signal modulation, beneficial for a variety of applications.

ROM Programmability: FLASH

Flash ROM allows for easy updates and programming changes, providing flexibility in product development.

Terminal Pitch: 0.5 mm

Fine terminal pitch enhances the potential for higher pin counts and compact designs in your project.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level enables safe storage and handling, ensuring integrity of the microcontroller.

Speed: 64 rpm

Operating at 64 rpm indicates that this microcontroller can handle specific low-speed tasks efficiently.

No. of I/O Lines: 67

A high number of I/O lines offers extensive interfacing capabilities, supporting diverse application needs.

Technical Specifications

Microcontrollers SPC560P50L3BEABY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

ROM Programmability:

FLASH

Speed:

64 rpm

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC560P50L3BEABY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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