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SPC560P40L1BEABY

STMicroelectronics

SPC560P40L1BEABY by STMicroelectronics

STMicroelectronics SPC560P40L1BEABY is a 32-bit microcontroller with 3.3V power supply, 262144 ROM words, and 20480 RAM bytes. It features DMA(16), PWM, TIMER(6) peripherals and operates at up to 40 MHz clock frequency. Ideal for industrial applications requiring CAN(3), CRC, LIN, UART connectivity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,574 parts In-Stock

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Digiode

USA . 1,582 parts In-Stock

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Anansix

USA . 1,551 parts In-Stock

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Microchip USA

USA . 244 parts In-Stock

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$6.404

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244

$6.404

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AZTECH Wire

Italy . 1,204 parts In-Stock

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$21.910

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$21.910

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IDEA Electronic Components Group

UK . 969 parts In-Stock

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$79.586

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$71.627

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969

$79.586

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$71.627

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Component Stockers USA

USA . 235 parts In-Stock

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$99.990

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235

$99.990

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MKK Technologies

India . 1,566 parts In-Stock

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$149.655

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$149.655

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DigiPath Technology Company

USA . 1,566 parts In-Stock

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$149.655

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$149.655

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QUARKTWIN TECHNOLOGY LTD

USA . 17,357 parts In-Stock

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Vigor

Singapore . 2,481 parts In-Stock

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Corphita

USA . 1,106 parts In-Stock

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Parana Technologies

USA . 728 parts In-Stock

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$95.157

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Overview

Unlock the power of innovation with the SPC560P40L1BEABY microcontroller by STMicroelectronics. Designed with precision and expertise, this cutting-edge technology offers unparalleled performance and reliability in a compact package. Ideal for a wide range of applications, from automotive to industrial automation, this microcontroller boasts advanced features like DMA channels, PWM capabilities, and multiple timers. Experience seamless connectivity with CAN, LIN, UART interfaces, and unleash your creativity with customizable ROM programmability. Elevate your projects with the SPC560P40L1BEABY and witness the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides lightweight and durable packaging for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

Provides a wide voltage range for flexibility in power supply options.

Address Bus Width: 32

Allows for efficient memory addressing and data transfer within the microcontroller.

Package Shape: SQUARE

Ensures compactness and efficient use of PCB space.

Bit Size: 32

Offers high processing capability and performance for demanding tasks.

Power Supplies (V): 3.3

Standard voltage supply for compatibility with common power sources.

No. of Terminals: 64

Provides ample connectivity options for peripherals and external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables easy integration into compact electronic devices with a low profile design.

Minimum Supply Voltage: 3 V

Ensures reliable operation even at lower voltage levels.

Maximum Operating Temperature: 105 °C

Suitable for industrial environments with high temperature requirements.

CPU Family: E200Z0H

Belongs to a powerful and efficient CPU family for optimal performance.

Minimum Operating Temperature: -40 °C

Ensures operation in extreme cold environments.

ADC Channels: YES

Enables analog to digital conversion for sensor interface and data acquisition.

DMA Channels: YES

Allows for efficient data transfer between peripherals and memory without CPU intervention.

Terminal Position: QUAD

Facilitates easy and organized connection of external components.

ROM Words: 262144

Provides ample storage for program memory and data storage.

Width: 10 mm

Compact size for space-constrained applications.

External Data Bus Width: 32

Efficient data transfer between external devices and the microcontroller.

Peripherals: DMA(16), PWM, TIMER(6)

Offers a range of peripheral options for versatile functionality.

Maximum Clock Frequency: 40 MHz

High clock speed for fast processing and efficient operation.

Length: 10 mm

Compact size for space-saving integration.

Temperature Grade: INDUSTRIAL

Suitable for rugged industrial environments with wide temperature ranges.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller architecture optimized for embedded applications.

No. of Timers: 6

Multiple timers for precise timing control and scheduling tasks.

RAM Bytes: 20480

Adequate random access memory for data storage and temporary processing.

Technology: CMOS

Low power consumption and high noise immunity for reliable operation.

Terminal Form: GULL WING

Facilitates easy soldering and connection to the PCB.

Maximum Supply Current: 65 mA

Low power consumption for energy-efficient operation.

Nominal Supply Voltage: 3.3 V

Standard voltage supply for compatibility with common power sources.

No. of DMA Channels: 16

Multiple DMA channels for efficient data transfer and system performance.

PWM Channels: YES

Pulse Width Modulation for precise control of digital signals and devices.

Connectivity: CAN(3), CRC, LIN, UART

Various communication interfaces for connecting to external devices and networks.

ROM Programmability: FLASH

Flash memory for reprogramming and updating firmware easily.

Terminal Pitch: 0.5 mm

Fine pitch for compact PCB layout and space-saving design.

Speed: 64 rpm

High speed operation for efficient processing and performance.

No. of I/O Lines: 37

Sufficient I/O lines for interfacing with external devices and sensors.

Technical Specifications

Microcontrollers SPC560P40L1BEABY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

CPU Family:

E200Z0H

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of DMA Channels:

16

No. of I/O Lines:

37

No. of Terminals:

64

No. of Timers:

6

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

262144

ROM Programmability:

FLASH

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Connectivity:

CAN(3), CRC, LIN, UART,

Peripherals:

DMA(16), PWM, TIMER(6)

Trade Compliance

SPC560P40L1BEABY Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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