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P0102BN

STMicroelectronics

P0102BN by STMicroelectronics

P0102BN by STMicroelectronics is a single SCR in a rectangular plastic package, ideal for surface mount applications. It features a max on-state current of 0.5 A, non-repetitive peak on-state current of 8 A, and operates b/w -40 °C to 125°C. This device is suitable for controlling power in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,756 parts In-Stock

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3,756

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Digiode

USA . 2,637 parts In-Stock

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2,637

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North Shore Components

USA . 898 parts In-Stock

1+ parts

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898

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Anansix

USA . 693 parts In-Stock

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693

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 93 parts In-Stock

1+ parts

$1.984

100+ parts

-

1k+ parts

$1.785

10k+ parts

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93

$1.984

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$1.785

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MKK Technologies

India . 1,438 parts In-Stock

1+ parts

$3.730

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1,438

$3.730

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DigiPath Technology Company

USA . 1,438 parts In-Stock

1+ parts

$3.730

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1,438

$3.730

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Corphita

USA . 77 parts In-Stock

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77

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Parana Technologies

USA . 26 parts In-Stock

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$2.372

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26

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$2.372

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Overview

Elevate your designs with the P0102BN from STMicroelectronics—a premier Silicon Controlled Rectifier that blends reliability with exceptional performance. Crafted with precision, this surface-mount solution ensures efficient power management across diverse applications, from consumer electronics to industrial automation. Experience the trusted quality of STMicroelectronics, renowned for their innovative technologies, and unlock unparalleled value that enhances your project's efficiency and longevity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental impacts, making the SCR suitable for various applications.

Maximum DC Gate Trigger Current: 0.2 mA

A low gate trigger current requirement enhances energy efficiency and allows for easy interfacing with low-power control circuits.

Configuration: SINGLE

The single configuration simplifies circuit design and integration into electronic systems.

Non Repetitive Peak On-state Current: 8 A

This capability allows the SCR to handle high transient currents, making it suitable for high-power applications.

Surface Mount: YES

Being surface-mounted ensures a compact design and easy integration into modern electronic circuits, facilitating automated assembly.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, promoting an efficient layout and design flexibility.

Terminal Form: GULL WING

Gull wing terminals facilitate automated soldering processes, enhancing manufacturing efficiency.

Maximum On-state Current: 0.5 A

This specification allows the SCR to operate effectively in moderate load applications, ensuring reliable performance.

Maximum Leakage Current: 0.001 mA

A very low leakage current minimizes power loss during operation, contributing to overall system efficiency.

Repetitive Peak Reverse Voltage: 200 V

A high reverse voltage rating increases the versatility of the SCR, allowing it to be used in high-voltage applications.

No. of Terminals: 4

Having four terminals simplifies connections and enables a more flexible circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package allows for density in PCB design, ideal for space-constrained applications.

Maximum Operating Temperature: 125 °C

A high operating temperature rating means the SCR can function in harsh environments without performance degradation.

Trigger Device Type: SCR

As an SCR, the device inherently supports high-efficiency switching and control, making it suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

A wide operating temperature range ensures reliable performance in extreme weather conditions.

Terminal Finish: MATTE TIN

Matte tin finish offers good solderability and corrosion resistance, contributing to the longevity of the connections.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in circuit design and layout, enhancing usability in diverse applications.

Maximum RMS On-state Current: 0.8 A

This RMS current rating enables the SCR to handle varying load conditions, enhancing its application scope.

Maximum DC Gate Trigger Voltage: 0.8 V

A low gate voltage requirement improves compatibility with low-voltage control systems, increasing its versatility.

Case Connection: ANODE

An anode case connection configuration enhances circuit simplicity and effectiveness in various applications.

Repetitive Peak Off-state Voltage: 200 V

A high off-state voltage offers robust performance in circuits requiring reliable voltage management.

Minimum Critical Rate of Rise of Off-state Voltage: 25 V/us

A fast critical rise time helps protect against voltage spikes, ensuring system stability and longevity.

Maximum Holding Current: 5 mA

This low holding current enhances stability and reliability in power control applications.

Nominal Circuit Commutated Turn-off Time: 200 µs

A rapid turn-off time aids in quick switching applications, making this SCR ideal for use in dynamic circuit environments.

Technical Specifications

Silicon Controlled Rectifiers (SCR) P0102BN attributes and parameters. Explore more Silicon Controlled Rectifiers (SCR) devices from STMicroelectronics

Specs

Additional Features:

SENSITIVE GATE

Case Connection:

Nominal Circuit Commutated Turn-off Time:

200 us

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

25 V/us

Maximum DC Gate Trigger Current:

.2 mA

Maximum DC Gate Trigger Voltage:

.8 V

Maximum Holding Current:

5 mA

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Maximum Leakage Current:

.001 mA

Non Repetitive Peak On-state Current:

8 A

No. of Elements:

1

No. of Terminals:

4

Maximum On-state Current:

.5 A

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

.8 A

Repetitive Peak Off-state Voltage:

200 V

Repetitive Peak Reverse Voltage:

200 V

Sub-Category:

Silicon Controlled Rectifiers

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

SCR

Trade Compliance

P0102BN Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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