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MJD13005-1

STMicroelectronics

MJD13005-1 by STMicroelectronics

MJD13005-1 by STMicroelectronics is an NPN RF Power BJT transistor with a max collector-emitter voltage of 400V and max current of 4A. It has a power dissipation of 30W, making it suitable for switching applications in various electronic circuits. The package style is in-line with a rectangular shape and matte tin terminal finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,513 parts In-Stock

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2,513

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Anansix

USA . 1,621 parts In-Stock

1+ parts

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1,621

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Vyrian

USA . 479 parts In-Stock

1+ parts

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479

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 580 parts In-Stock

1+ parts

$1.436

100+ parts

-

1k+ parts

$1.293

10k+ parts

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580

$1.436

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$1.293

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MKK Technologies

India . 142 parts In-Stock

1+ parts

$2.701

100+ parts

-

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142

$2.701

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DigiPath Technology Company

USA . 142 parts In-Stock

1+ parts

$2.701

100+ parts

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142

$2.701

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Corphita

USA . 4,813 parts In-Stock

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4,813

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Parana Technologies

USA . 460 parts In-Stock

1+ parts

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$1.717

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460

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$1.717

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Overview

Upgrade your electronic projects with the MJD13005-1 by STMicroelectronics, a reliable RF Power BJT transistor that promises top-notch performance. With a trusted manufacturer like STMicroelectronics, you can expect nothing but quality and durability. This transistor is perfect for switching applications, offering a maximum collector-emitter voltage of 400V and a maximum collector current of 4A. The MJD13005-1 is designed to handle up to 30W of power dissipation, ensuring efficient operation even in demanding conditions. Trust in this NPN transistor to deliver seamless functionality and enhanced performance for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, making the transistor durable and long-lasting.

Polarity or Channel Type: NPN

NPN transistors are commonly used in switching applications, making this transistor suitable for various switching tasks.

Configuration: SINGLE

Simplified design with single configuration makes the transistor easy to integrate into circuits.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in such scenarios.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement on PCBs and easy mounting in electronic devices.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer stability and ease of soldering during assembly.

No. of Terminals: 3

Simple 3-terminal design for easy connectivity in circuits.

Maximum Power Dissipation (Abs): 30 W

High power dissipation capability allows the transistor to handle high loads without overheating.

Package Style (Meter): IN-LINE

In-line package style for streamlined and space-saving integration in circuit layouts.

Minimum DC Current Gain (hFE): 8

A minimum DC current gain of 8 ensures sufficient amplification for signal processing.

Maximum Operating Temperature: 150 °C

Capable of operating at high temperatures, making it suitable for a wide range of operating environments.

Maximum Collector-Emitter Voltage: 400 V

High collector-emitter voltage rating allows the transistor to withstand high voltages in circuits.

Transistor Element Material: SILICON

Silicon-based transistor element provides stable and reliable performance over the long term.

Maximum Collector Current (IC): 4 A

With a maximum collector current of 4 A, the transistor can handle moderate to high current loads.

Terminal Finish: MATTE TIN

Matte tin finish on terminals ensures good solderability and long-term connectivity.

Terminal Position: SINGLE

Single terminal position for easy integration and connectivity in circuits.

Technical Specifications

RF Power Bipolar Junction Transistors (BJT) MJD13005-1 attributes and parameters. Explore more RF Power Bipolar Junction Transistors (BJT) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY, HIGH VOLTAGE

Maximum Collector Current (IC):

4 A

Maximum Collector-Emitter Voltage:

400 V

Configuration:

Minimum DC Current Gain (hFE):

8

JEDEC-95 Code:

TO-251

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MJD13005-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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