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M95080-RMB6TG

STMicroelectronics

M95080-RMB6TG by STMicroelectronics

M95080-RMB6TG by STMicroelectronics is a 1Kx8 EEPROM with a synchronous SPI interface, operating b/w 1.8V and 5.5V. It features a max clock frequency of 5 MHz and offers hardware/software write protection. Ideal for industrial applications, it endures up to 1M write/erase cycles.

Median Price

$0.823

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 600 parts In-Stock

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$0.823

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600

$0.823

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Chip Stock

USA . 130,766 parts In-Stock

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Vyrian

USA . 8,696 parts In-Stock

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8,696

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Prism Electronics

USA . 4,109 parts In-Stock

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4,109

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Digiode

USA . 3,292 parts In-Stock

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3,292

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Anansix

USA . 2,582 parts In-Stock

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SPM Sales

USA . 220 parts In-Stock

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220

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,805 parts In-Stock

1+ parts

$2.983

100+ parts

-

1k+ parts

$2.684

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-

1,805

$2.983

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$2.684

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MKK Technologies

India . 1,881 parts In-Stock

1+ parts

$5.609

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1,881

$5.609

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DigiPath Technology Company

USA . 1,881 parts In-Stock

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$5.609

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1,881

$5.609

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AZTECH Wire

Italy . 56 parts In-Stock

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$14.580

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56

$14.580

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Microchip USA

USA . 177 parts In-Stock

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$40.706

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177

$40.706

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A-Z Elektronik GmbH

Germany . 6,728 parts In-Stock

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Perfect Parts

USA . 4,602 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,485 parts In-Stock

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Corphita

USA . 2,807 parts In-Stock

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Kepictronics

USA . 340 parts In-Stock

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340

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Parana Technologies

USA . 269 parts In-Stock

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$3.566

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269

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$3.566

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Overview

Unlock a world of innovation with the M95080-RMB6TG from STMicroelectronics, a leader in high-quality semiconductor solutions. This compact EEPROM offers unparalleled reliability and flexibility for diverse applications ranging from industrial automation to consumer electronics. With its robust performance in extreme temperatures and efficient power management, customers benefit from enhanced product longevity and superior data integrity, making it the smart choice for future-proof designs.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact circuit layouts, making it ideal for space-constrained applications.

Package Shape: RECTANGULAR

A rectangular package shape optimizes board space utilization and allows for efficient routing of traces.

Operating Mode: SYNCHRONOUS

Synchronous operation improves data transfer rates, making it suitable for high-speed applications.

Nominal Supply Voltage / Vsup: 5 V

Standard voltage requirement makes it easy to integrate into existing systems without needing additional voltage regulation.

Power Supplies: 2/5 V

The flexibility in supply voltage can accommodate a wider range of devices and power sources.

No. of Terminals: 8

Eight terminals provide sufficient connectivity for a variety of applications while remaining compact.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Thin profile allows for low-profile designs that are beneficial in portable and compact devices.

Maximum Operating Temperature: 85 °C

High-temperature tolerance enables stable performance in industrial environments and harsh conditions.

Organization: 1KX8

1K x 8 organization strikes a great balance between density and access speed, fitting numerous applications.

Minimum Operating Temperature: -40 °C

Wide temperature range (-40 °C to 85 °C) ensures reliable operation in extreme environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Durable terminal finish enhances reliability and prevents corrosion, ensuring consistent performance over time.

Terminal Position: BOTTOM

Bottom terminal positioning allows for effective heat dissipation and makes it suitable for surface-mount applications.

Write Protection: HARDWARE/SOFTWARE

Flexible write protection methods help secure data integrity, which is critical for applications in sensitive areas.

Maximum Seated Height: 0.6 mm

Low seated height is ideal for thin designs and contributes to a compact overall design.

Maximum Clock Frequency (fCLK): 5 MHz

Higher clock frequency allows for faster data processing and communication, enhancing overall system performance.

Width: 2 mm

Narrow width is beneficial for high-density circuit board layouts by saving valuable space.

Minimum Supply Voltage (Vsup): 1.8 V

Low minimum supply voltage allows for operation with lower power devices, increasing energy efficiency.

Length: 3 mm

Short length aids in compact PCB designs, allowing for the development of smaller devices.

Temperature Grade: INDUSTRIAL

Industrial grade specification ensures reliability and durability in demanding environments.

Technology: CMOS

CMOS technology delivers low power consumption and high integration capability, making it suitable for battery-operated devices.

Parallel or Serial: SERIAL

Serial communication simplifies connections and reduces pin counts, ideal for compact designs.

Terminal Form: NO LEAD

No-lead design allows for a more environmentally friendly option and simplifies the assembly process.

Maximum Supply Current: 1 mA

Low supply current contributes to energy efficiency, extending battery life in portable applications.

No. of Words: 1024 words

Sufficient memory capacity for moderate data storage needs in various applications.

Memory Width: 8

An 8-bit memory width is effective for typical data requirements in consumer and industrial products.

Minimum Data Retention Time: 40 years

Long data retention is essential for critical data storage, ensuring reliability and confidence in data integrity.

Terminal Pitch: 0.5 mm

Fine terminal pitch is perfect for high-density applications and helps in reducing PCB space.

No. of Words Code: 1K

1K word memory capacity is ideal for a variety of applications, providing flexibility to developers.

Maximum Supply Voltage (Vsup): 5.5 V

Supports a range of power supply voltages, ensuring compatibility with various systems.

Endurance: 1,000,000 Write/Erase Cycles

High endurance makes this EEPROM suitable for applications that require frequent data updates, enhancing longevity.

Serial Bus Type: SPI

SPI bus communication allows for fast data transfer speeds and ease of implementation in modern systems.

Maximum Write Cycle Time (tWC): 5 ms

Fast write cycle time improves efficiency, reducing latency in applications that require rapid data updates.

Memory Density: 8192 bit

Adequate memory density for a wide range of applications, balancing space and performance needs.

Memory IC Type: EEPROM

EEPROM type offers non-volatile memory capabilities, allowing data retention even without power.

Maximum Standby Current: 0.0000005 Amp

Extremely low standby current maximizes energy efficiency, making it suitable for battery-powered devices.

Technical Specifications

EEPROM M95080-RMB6TG attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

5 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-XBCC-N8

JESD-609 Code:

e4

Length:

3 mm

Memory Density:

8192 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1KX8

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.11,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.0000005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

1 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

2 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M95080-RMB6TG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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