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M95040-RMB6TG

STMicroelectronics

M95040-RMB6TG by STMicroelectronics

M95040-RMB6TG from STMicroelectronics is a compact EEPROM with a 512x8 organization, operating at 2.5V and supporting SPI communication. It features a max clock frequency of 5 MHz and offers hardware/software write protection. Ideal for industrial applications, it withstands temperatures from -40 °C to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,405 parts In-Stock

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6,405

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Corel Iberica Componentes, S.L.

Spain . 5,600 parts In-Stock

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5,600

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Digiode

USA . 2,996 parts In-Stock

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2,996

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ComSIT Distribution GmbH

Germany . 2,500 parts In-Stock

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2,500

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ComSIT USA

USA . 2,500 parts In-Stock

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2,500

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Anansix

USA . 176 parts In-Stock

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176

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,139 parts In-Stock

1+ parts

$3.379

100+ parts

-

1k+ parts

$3.041

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1,139

$3.379

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$3.041

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MKK Technologies

India . 1,751 parts In-Stock

1+ parts

$6.354

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1,751

$6.354

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DigiPath Technology Company

USA . 1,751 parts In-Stock

1+ parts

$6.354

100+ parts

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1,751

$6.354

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AZTECH Wire

Italy . 313 parts In-Stock

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$8.370

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313

$8.370

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Component Stockers USA

USA . 413 parts In-Stock

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$99.990

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413

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 20,975 parts In-Stock

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20,975

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A-Z Elektronik GmbH

Germany . 5,799 parts In-Stock

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5,799

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Alle Elektronik GmbH

Germany . 3,866 parts In-Stock

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3,866

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Microchip USA

USA . 2,978 parts In-Stock

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2,978

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Parana Technologies

USA . 1,627 parts In-Stock

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$4.040

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1,627

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$4.040

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Corphita

USA . 592 parts In-Stock

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592

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Overview

Elevate your designs with the M95040-RMB6TG EEPROM from STMicroelectronics, a trusted leader in innovation and quality. This ultra-thin, high-performance memory solution is built for reliability across a wide temperature range, ensuring optimal performance in diverse applications such as industrial automation, consumer electronics, and automotive systems. Enjoy enhanced data integrity with hardware/software write protection, empowering your projects with unmatched durability and efficiency.

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability ensures easier integration into modern electronic circuits and space-efficient designs.

Package Shape: RECTANGULAR

The rectangular package shape is optimal for PCB layout, allowing for efficient use of board space.

Operating Mode: SYNCHRONOUS

Synchronous operation provides faster data access times, making it suitable for high-performance applications.

Nominal Supply Voltage / Vsup: 2.5 V

A nominal supply voltage of 2.5 V highlights low power consumption, making it ideal for battery-powered devices.

Power Supplies (V): 2/5 V

The capability to operate within a range of 2 to 5 volts ensures compatibility with various applications and power requirements.

No. of Terminals: 8

With 8 terminals, this component allows for a compact design while enabling necessary connections.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The small outline and thin profile make it suitable for space-constrained applications and portable devices.

Maximum Operating Temperature: 85 °C

An operational temperature of up to 85 °C makes this EEPROM reliable for industrial applications in harsh environments.

Organization: 512X8

The memory organization allows for efficient data storage and retrieval, making it suitable for a variety of applications.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C ensures reliability in extreme cold environments, fitting for industrial or outdoor applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish provides excellent solderability and corrosion resistance, enhancing longevity and performance.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB design, aiding in layout optimization.

Write Protection: HARDWARE/SOFTWARE

Dual write protection options enhance security and data integrity, making it a solid choice for critical applications.

Maximum Seated Height: 0.6 mm

A low seated height facilitates compatibility with other low-profile components, essential for modern device designs.

Maximum Clock Frequency (fCLK): 5 MHz

High clock frequency allows for faster data transfer rates, improving overall device performance.

Width: 2 mm

A compact width supports the design of smaller, more efficient electronic devices.

Minimum Supply Voltage (Vsup): 1.8 V

The capability to operate down to 1.8 V expands its applicability in low-power environments.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds indicates compatibility with standard PCB assembly processes.

Peak Reflow Temperature (°C): 260

A peak reflow temperature of 260 °C ensures robustness during soldering processes.

Length: 3 mm

A compact length is beneficial for integration into small devices without compromising performance.

Temperature Grade: INDUSTRIAL

Industrial temperature grading guarantees reliability and performance in challenging environments.

Technology: CMOS

CMOS technology enables low power consumption and high density, suitable for a wide range of applications.

Parallel or Serial: SERIAL

Serial communication allows for simpler connections and reduced pin requirements, ideal for compact boards.

Terminal Form: NO LEAD

No-lead terminals reduce solder joint failure risks, enhancing reliability in electronic assemblies.

Maximum Supply Current: 2 mA

Low supply current usage contributes to energy efficiency, making it excellent for energy-sensitive applications.

No. of Words: 512 words

512 words of memory capacity is adequate for many embedded applications, allowing for useful data storage.

Memory Width: 8

With an 8-bit memory width, it supports efficiency in data handling and compatibility with various microcontrollers.

Minimum Data Retention Time: 40 years

A minimum data retention of 40 years ensures long-term data reliability, essential for critical applications.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch supports modern PCB designs with high density, facilitating integration into compact layouts.

No. of Words Code: 512

Supporting 512 word codes maximizes efficient data usage, making it suitable for various applications.

Maximum Supply Voltage (Vsup): 5.5 V

A higher maximum supply voltage expands compatibility, allowing it to work seamlessly with various power supply configurations.

Endurance: 1000000 Write/Erase Cycles

An endurance of 1,000,000 cycles ensures durability and reliability in applications requiring frequent data changes.

Serial Bus Type: SPI

SPI bus type allows for high-speed communication, making it suitable for real-time applications.

Maximum Write Cycle Time (tWC): 5 ms

A maximum write cycle time of 5 ms ensures quick data updates, enhancing overall system responsiveness.

Memory Density: 4096 bit

A memory density of 4096 bits provides a sufficient balance of space and performance for various applications.

Memory IC Type: EEPROM

As an EEPROM, it allows for non-volatile data storage, ensuring data retention even without power.

Maximum Standby Current: 0.000002 Amp

Extremely low standby current contributes to energy efficiency, beneficial for portable and battery-operated devices.

Technical Specifications

EEPROM M95040-RMB6TG attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

5 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-XDSO-N8

JESD-609 Code:

e4

Length:

3 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512X8

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000002 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M95040-RMB6TG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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