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M95020-RMB6TG

STMicroelectronics

M95020-RMB6TG by STMicroelectronics

M95020-RMB6TG by STMicroelectronics is a compact EEPROM with a 256x8 organization, operating at 2.5V and supporting SPI communication. It features a max clock frequency of 5 MHz and offers hardware/software write protection. Ideal for industrial applications, it withstands temperatures from -40 °C to 85 °C.

Median Price

$0.530

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 997 parts In-Stock

1+ parts

$0.530

100+ parts

$0.419

1k+ parts

$0.385

10k+ parts

$0.354

997

$0.530

$0.419

$0.385

$0.354

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 681 parts In-Stock

1+ parts

$0.504

100+ parts

-

1k+ parts

-

10k+ parts

-

681

$0.504

-

-

-

Vyrian

USA . 5,885 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,885

-

-

-

-

Corel Iberica Componentes, S.L.

Spain . 2,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,200

-

-

-

-

Anansix

USA . 139 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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139

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,465 parts In-Stock

1+ parts

$0.477

100+ parts

-

1k+ parts

-

10k+ parts

-

3,465

$0.477

-

-

-

IDEA Electronic Components Group

UK . 108 parts In-Stock

1+ parts

$3.601

100+ parts

-

1k+ parts

$3.241

10k+ parts

-

108

$3.601

-

$3.241

-

Component Stockers USA

USA . 20,030 parts In-Stock

1+ parts

$5.330

100+ parts

-

1k+ parts

-

10k+ parts

-

20,030

$5.330

-

-

-

MKK Technologies

India . 1,874 parts In-Stock

1+ parts

$6.771

100+ parts

-

1k+ parts

-

10k+ parts

-

1,874

$6.771

-

-

-

DigiPath Technology Company

USA . 1,874 parts In-Stock

1+ parts

$6.771

100+ parts

-

1k+ parts

-

10k+ parts

-

1,874

$6.771

-

-

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Perfect Parts

USA . 18,628 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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18,628

-

-

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A-Z Elektronik GmbH

Germany . 6,716 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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6,716

-

-

-

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Kepictronics

USA . 5,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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5,000

-

-

-

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Alle Elektronik GmbH

Germany . 4,477 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,477

-

-

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Microchip USA

USA . 4,292 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,292

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-

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Parana Technologies

USA . 2,016 parts In-Stock

1+ parts

-

100+ parts

$4.305

1k+ parts

-

10k+ parts

-

2,016

-

$4.305

-

-

Overview

Unlock exceptional performance and reliability with the M95020-RMB6TG EEPROM from STMicroelectronics. Renowned for their cutting-edge technology, STMicroelectronics ensures this compact, surface-mount memory solution delivers outstanding endurance and data retention in diverse applications, from industrial automation to consumer electronics. Experience seamless integration and robust write protection, empowering your designs with quality that stands the test of time. Elevate your projects today!

Feature Benefit Bullets

Surface Mount: YES

The surface mount package allows for compact design and efficient use of PCB space, making it ideal for modern electronic applications.

Package Shape: RECTANGULAR

The rectangular shape aids in flexible layout configurations on PCBs, accommodating various design requirements.

Operating Mode: SYNCHRONOUS

Synchronous operation improves data transfer rates and synchronization with other components, enhancing overall system performance.

Nominal Supply Voltage / Vsup: 2.5V

A nominal supply voltage of 2.5V is energy-efficient, making it suitable for battery-powered devices.

Power Supplies: 2/5V

The dual power supply capability supports versatile applications, allowing operation across a range of voltages.

No. of Terminals: 8

Having 8 terminals facilitates simple integration into designs without requiring excessive pin configurations.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The small outline and thin profile are perfectly suited for space-constrained applications such as mobile and wearable devices.

Maximum Operating Temperature: 85 °C

With a max operating temperature of 85 °C, this EEPROM can reliably function in a variety of environmental conditions.

Organization: 256X8

This organization type provides an efficient structure for data storage, ideal for applications requiring moderate memory capacity.

Minimum Operating Temperature: -40 °C

Operating down to -40 °C makes this EEPROM suitable for industrial and harsh environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish ensures reliable connections and durability, enhancing component longevity.

Terminal Position: DUAL

Dual terminal positioning allows for versatile and flexible placement on PCBs, reducing layout design constraints.

Write Protection: HARDWARE/SOFTWARE

This dual write protection feature enhances data integrity and security, making it ideal for critical applications.

Maximum Seated Height: 0.6 mm

A low seated height enables a slimmer profile in designs, promoting compact and sleek product designs.

Maximum Clock Frequency (fCLK): 5 MHz

With a maximum clock frequency of 5 MHz, this EEPROM facilitates faster data access and processing requirements.

Width: 2 mm

A narrow width enhances placement flexibility on PCBs, suited for densely packed electronics.

Minimum Supply Voltage (Vsup): 1.8 V

The ability to operate at a minimum supply voltage of 1.8V provides design flexibility for low-power applications.

Maximum Time At Peak Reflow Temperature: 30 seconds

This specification aligns with standard PCB assembly processes, ensuring compatibility with modern manufacturing techniques.

Peak Reflow Temperature: 260 °C

A peak reflow temperature of 260 °C indicates compatibility with lead-free solder, addressing environmental compliance.

Length: 3 mm

A compact length allows for integration in space-restricted applications, contributing to overall device miniaturization.

Temperature Grade: INDUSTRIAL

Industrial temperature grading signifies robustness, making it suitable for demanding industrial environments.

Technology: CMOS

CMOS technology is known for low power consumption, thus extending battery life in portable applications.

Parallel or Serial: SERIAL

Serial interface simplifies PCB layout by reducing the number of required connections, ideal for smaller devices.

Terminal Form: NO LEAD

No lead design signifies reduced environmental impact while allowing for compact and efficient packaging.

Maximum Supply Current: 2 mA

Low maximum supply current ensures minimal power drain, enhancing energy efficiency particularly in battery-operated devices.

No. of Words: 256 words

A word count of 256 offers a practical balance of data storage, suitable for a range of applications.

Memory Width: 8

An 8-bit memory width is effective for most applications requiring compact data storage solutions.

Minimum Data Retention Time: 40 years

A long data retention time ensures reliability, making it suitable for applications needing long-term data storage.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch enables high-density layouts, allowing for more efficient use of PCB space.

No. of Words Code: 256

Efficient data coding structure aligns with straightforward application requirements, ensuring ease of use.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V offers flexibility in voltage supply options, accommodating varying system designs.

Endurance: 1,000,000 Write/Erase Cycles

High endurance indicates robust performance for write/erase operations, making it well-suited for frequently updated data.

Serial Bus Type: SPI

SPI bus type allows for faster data transfers and simpler communication between components, enhancing system responsiveness.

Maximum Write Cycle Time (tWC): 5 ms

A quick write cycle time enhances efficiency in applications that require rapid data updates.

Memory Density: 2048 bit

With a memory density of 2048 bits, this EEPROM is suitable for applications requiring moderate storage capacity.

Memory IC Type: EEPROM

As an EEPROM, it offers non-volatile storage, retaining data even when power is lost, ideal for critical applications.

Maximum Standby Current: 0.000001 Amp

Extremely low standby current ensures minimal power consumption during idle times, prolonging battery life in portable applications.

Technical Specifications

EEPROM M95020-RMB6TG attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

5 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-XDSO-N8

JESD-609 Code:

e4

Length:

3 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M95020-RMB6TG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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