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M93C66-WMN6T

STMicroelectronics

M93C66-WMN6T by STMicroelectronics

M93C66-WMN6T by STMicroelectronics is a 4096-bit EEPROM with 256x16 organization, operating at up to 2 MHz clock frequency. It features software write protection, MICROWIRE serial bus type, and industrial temperature grade. Ideal for applications requiring low power consumption and reliable non-volatile memory storage in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 43,500 parts In-Stock

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43,500

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Vyrian

USA . 7,536 parts In-Stock

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7,536

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LIBRA Elektronik GmbH

Germany . 4,980 parts In-Stock

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4,980

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Digiode

USA . 4,345 parts In-Stock

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4,345

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Dan-Mar Components

USA . 3,183 parts In-Stock

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3,183

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Anansix

USA . 2,831 parts In-Stock

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2,831

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 2,490 parts In-Stock

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2,490

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ComSIT Distribution GmbH

Germany . 2,359 parts In-Stock

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2,359

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Tectiva GmbH

Germany . 1,497 parts In-Stock

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1,497

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Prism Electronics

USA . 1,310 parts In-Stock

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1,310

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PC Components Company LLC

USA . 341 parts In-Stock

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341

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Bristol Electronics

USA . 341 parts In-Stock

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341

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Connector Distribution Corp

USA . 78 parts In-Stock

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78

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Right Parts Inc.

USA . 78 parts In-Stock

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78

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A2Z Electronics, Inc.

USA . 18 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,308 parts In-Stock

1+ parts

$4.302

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-

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$3.872

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2,308

$4.302

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$3.872

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MKK Technologies

India . 2,008 parts In-Stock

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$8.089

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2,008

$8.089

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DigiPath Technology Company

USA . 2,008 parts In-Stock

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$8.089

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$8.089

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AZTECH Wire

Italy . 148 parts In-Stock

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$9.090

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148

$9.090

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Microchip USA

USA . 414 parts In-Stock

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$10.092

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414

$10.092

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A-Z Elektronik GmbH

Germany . 6,609 parts In-Stock

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Kepictronics

USA . 4,743 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,406 parts In-Stock

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Perfect Parts

USA . 3,772 parts In-Stock

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Corphita

USA . 2,618 parts In-Stock

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Parana Technologies

USA . 1,516 parts In-Stock

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$5.144

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$5.144

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Cyclops Electronics Ltd (Excess)

UK . 1,029 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 548 parts In-Stock

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548

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Overview

Experience the superior quality and performance of STMicroelectronics with the M93C66-WMN6T EEPROM. This versatile memory IC offers a wide range of applications in various industries, providing reliable data storage and retrieval. With a durable plastic/epoxy package body and synchronous operation, this small-outline device ensures efficient functionality in industrial-grade environments. Benefit from the value and benefits of this product, including a high endurance of 1,000,000 write/erase cycles and software write protection. Trust STMicroelectronics for cutting-edge technology that meets your memory needs seamlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body ensures durability and protection of the internal components, making it a reliable choice for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving time and effort in the assembly process.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this EEPROM compatible with standard power supplies, ensuring seamless integration in various electronic systems.

Memory Density: 4096 bit

With a high memory density of 4096 bits, this EEPROM can store a large amount of data in a compact package, making it suitable for applications requiring extensive memory storage.

Endurance: 1000000 Write/Erase Cycles

The high endurance of 1,000,000 write/erase cycles ensures longevity and reliability, making this EEPROM ideal for applications that require frequent data read/write operations.

Serial Bus Type: MICROWIRE

Utilizing the MICROWIRE serial bus type allows for efficient communication with other devices, enabling seamless data transfer and integration in serial communication systems.

Technical Specifications

EEPROM M93C66-WMN6T attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Alternate Memory Width:

8

Maximum Clock Frequency (fCLK):

2 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

MICROWIRE

Maximum Standby Current:

.000002 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

SOFTWARE

Trade Compliance

M93C66-WMN6T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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