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M93C66-MN6

STMicroelectronics

M93C66-MN6 by STMicroelectronics

M93C66-MN6 by STMicroelectronics is a 4096-bit EEPROM with 256x16 organization, operating at 2MHz clock frequency. It features software write protection, synchronous operation, and MICROWIRE serial bus type. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,771 parts In-Stock

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7,771

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Bristol Electronics

USA . 2,500 parts In-Stock

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2,500

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Digiode

USA . 2,354 parts In-Stock

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2,354

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Anansix

USA . 1,940 parts In-Stock

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Lantek

USA . 1,800 parts In-Stock

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1,800

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ComSIT Distribution GmbH

Germany . 395 parts In-Stock

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395

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Holdelec - ElecDif-Pro

France . 91 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 91 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 90 parts In-Stock

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Zilex Electronics Inc.

Canada . 30 parts In-Stock

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Carlin Systems, Inc.

USA . 14 parts In-Stock

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LittleDiode

UK . 1 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,082 parts In-Stock

1+ parts

$4.329

100+ parts

-

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$3.896

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1,082

$4.329

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$3.896

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MKK Technologies

India . 20 parts In-Stock

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$8.140

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20

$8.140

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DigiPath Technology Company

USA . 20 parts In-Stock

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$8.140

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20

$8.140

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AZTECH Wire

Italy . 1,120 parts In-Stock

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$15.020

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$15.020

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Microchip USA

USA . 321 parts In-Stock

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$21.220

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321

$21.220

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Lixinc

USA . 6,027 parts In-Stock

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Assy Fe

Spain . 4,953 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,908 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,272 parts In-Stock

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Corphita

USA . 3,078 parts In-Stock

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Parana Technologies

USA . 1,952 parts In-Stock

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$5.176

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$5.176

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GreenTree Electronics

Israel . 1,800 parts In-Stock

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Perfect Parts

USA . 448 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 400 parts In-Stock

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400

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Cyclops Electronics Ltd (Excess)

UK . 200 parts In-Stock

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Authorized Procurement Solutions

USA . 80 parts In-Stock

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Overview

Experience the superior quality and reliability of the M93C66-MN6 by STMicroelectronics, a leading manufacturer in the industry. This EEPROM offers exceptional value with its versatility and durability, making it ideal for a wide range of applications. Whether you need to store data securely or enhance the functionality of your electronic devices, this product delivers on performance and efficiency. Trust STMicroelectronics to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the M93C66-MN6 and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects the internals of the EEPROM, ensuring a long lifespan.

Surface Mount: YES

Allows for easy integration onto circuit boards without the need for additional hardware.

Operating Mode: SYNCHRONOUS

Enables synchronized data transfers, improving overall efficiency and performance.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage requirement for many electronic devices, ensuring compatibility.

Write Protection: SOFTWARE

Provides security against unauthorized data modification, enhancing data integrity.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with a wide operating temperature range, ensuring reliability in harsh environments.

Memory Density: 4096 bit

Offers ample storage capacity for storing data and program code.

Endurance: 1000000 Write/Erase Cycles

High endurance level ensures longevity and reliability for frequent read/write operations.

Technical Specifications

EEPROM M93C66-MN6 attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Alternate Memory Width:

8

Maximum Clock Frequency (fCLK):

2 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

MICROWIRE

Maximum Standby Current:

.000015 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

SOFTWARE

Trade Compliance

M93C66-MN6 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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