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24LC04BT-I/OTG

Microchip Technology

24LC04BT-I/OTG by Microchip Technology

24LC04BT-I/OTG by Microchip Technology is a 512x8 EEPROM with I2C control byte. It operates at 5V, has 1000000 write/erase cycles, and offers hardware write protection. With a memory density of 4096 bit, it is ideal for industrial applications requiring reliable non-volatile memory storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 691 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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691

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VNN

France . 231 parts In-Stock

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231

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

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150

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 780 parts In-Stock

1+ parts

$2.808

100+ parts

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1k+ parts

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10k+ parts

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780

$2.808

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Aztec Data Supply Inc.

USA . 2,278 parts In-Stock

1+ parts

$3.190

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2,278

$3.190

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Advanced Electronics

New Zealand . 3,414 parts In-Stock

1+ parts

$4.032

100+ parts

$3.831

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$3.831

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3,414

$4.032

$3.831

$3.831

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Semicontronic

India . 654 parts In-Stock

1+ parts

$9.000

100+ parts

$8.775

1k+ parts

$8.730

10k+ parts

-

654

$9.000

$8.775

$8.730

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AZTECH Wire

Italy . 691 parts In-Stock

1+ parts

$16.499

100+ parts

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691

$16.499

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Marpe Global Electronics

Taiwan . 5,166 parts In-Stock

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5,166

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QualityLine Systems

Poland . 5,166 parts In-Stock

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5,166

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XL Components Corporation

Australia . 5,166 parts In-Stock

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5,166

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Argo Parts USA

USA . 3,839 parts In-Stock

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3,839

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Continental Prestige Electronics

USA . 2,718 parts In-Stock

1+ parts

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2,718

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Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Discover the Microchip Technology 24LC04BT-I/OTG, a high-quality EEPROM with a wide range of applications. With a focus on reliability and performance, Microchip Technology delivers a product that offers value and benefits to customers. From industrial settings to consumer electronics, this EEPROM provides storage solutions with endurance up to 1,000,000 write/erase cycles. Trust in Microchip Technology for innovative technology that meets your memory needs while ensuring longevity and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this EEPROM package lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration into circuit boards.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact design, saving space in electronics.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures precise and accurate data transfers.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures stable and reliable performance.

Power Supplies (V): 3/5

The options for 3V or 5V power supplies offer flexibility in compatibility with different systems.

No. of Terminals: 5

The 5 terminals provide secure connections and efficient data transfer.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline, low profile, and shrink pitch package style offers a compact and space-saving solution.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows for reliable performance in various environments.

Organization: 512X8

The 512x8 organization provides ample storage capacity for data storage applications.

Technical Specifications

EEPROM 24LC04BT-I/OTG attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010XXMR

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

5

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Reverse Pinout:

NO

Maximum Seated Height:

1.45 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.55 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

24LC04BT-I/OTG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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