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M74HCT157B1R

STMicroelectronics

M74HCT157B1R by STMicroelectronics

M74HCT157B1R by STMicroelectronics is a 4-function multiplexer with 2 inputs, operating at a supply voltage of 5V. It features a propagation delay of 38ns and can handle a load capacitance of 50pF. This CMOS technology device is ideal for military-grade applications requiring high-speed signal switching in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,376 parts In-Stock

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Digiode

USA . 3,224 parts In-Stock

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3,224

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ComSIT Distribution GmbH

Germany . 1,325 parts In-Stock

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Anansix

USA . 1,102 parts In-Stock

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First Choice Components Inc.

USA . 150 parts In-Stock

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150

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Distributors (Availability)

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Microchip USA

USA . 466 parts In-Stock

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$0.531

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466

$0.531

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AZTECH Wire

Italy . 863 parts In-Stock

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$8.710

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863

$8.710

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IDEA Electronic Components Group

UK . 1,634 parts In-Stock

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$17.878

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$16.091

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$17.878

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$16.091

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MKK Technologies

India . 1,691 parts In-Stock

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$33.619

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$33.619

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DigiPath Technology Company

USA . 1,691 parts In-Stock

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$33.619

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$33.619

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Component Stockers USA

USA . 237 parts In-Stock

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$99.990

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 17,547 parts In-Stock

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Corphita

USA . 3,670 parts In-Stock

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Parana Technologies

USA . 1,749 parts In-Stock

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$21.376

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Overview

Elevate your electronic designs with the M74HCT157B1R by STMicroelectronics, a top-tier manufacturer known for quality and innovation. This multiplexer & demultiplexer offers unparalleled performance in a compact package, making it ideal for a wide range of applications. With fast propagation delay and reliable operation at both high and low temperatures, this versatile component delivers exceptional value and benefits to customers looking for precision and efficiency in their projects. Explore new possibilities with the M74HCT157B1R and experience the difference that superior technology can make in your creations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making the product reliable for long-term use.

Propagation Delay At Nominal Supply: 38 ns

Low propagation delay ensures quick data transfer, making the product efficient for high-speed applications.

No. of Functions: 4

Having multiple functions in one device saves space and cost, making the product versatile for different applications.

No. of Inputs: 2

With multiple input options, the product can handle diverse input sources, increasing its usability.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes the product compatible with many existing systems and easy to integrate.

Load Capacitance (CL): 50 pF

Having a specified load capacitance helps in designing and optimizing the system for better performance.

Power Supplies (V): 5

Consistent power supply voltage ensures stable operation of the product, reducing the risk of malfunctions.

No. of Terminals: 16

Having multiple terminals allows for easy connectivity and integration with other components, enhancing the product's functionality.

Maximum I (ol): 4 Amp

A high maximum output current rating indicates the product can handle heavy loads without overheating or damage.

Minimum Operating Temperature: -55 °C

Wide operating temperature range makes the product suitable for use in extreme environmental conditions.

Technical Specifications

Multiplexer & Demultiplexer M74HCT157B1R attributes and parameters. Explore more Multiplexer & Demultiplexer devices from STMicroelectronics

Specs

Family:

HCT

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

38 ns

Propagation Delay (tpd):

38 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.1 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

M74HCT157B1R Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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