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M74HC151TTR

STMicroelectronics

M74HC151TTR by STMicroelectronics

M74HC151TTR from STMicroelectronics is an 8-input multiplexer with a propagation delay of just 38 ns, ideal for high-speed applications. It operates b/w 2V and 6V, featuring a compact SOIC package. This CMOS device supports military-grade temperatures from -55 °C to 125 °C.

Median Price

$0.740

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 14,959 parts In-Stock

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$0.740

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$0.740

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Vyrian

USA . 6,725 parts In-Stock

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6,725

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Bristol Electronics

USA . 5,000 parts In-Stock

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Digiode

USA . 2,899 parts In-Stock

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2,899

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Anansix

USA . 2,162 parts In-Stock

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Connector Distribution Corp

USA . 100 parts In-Stock

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100

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Right Parts Inc.

USA . 100 parts In-Stock

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100

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 679 parts In-Stock

1+ parts

$16.596

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$14.936

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679

$16.596

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$14.936

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Microchip USA

USA . 183 parts In-Stock

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$16.751

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183

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AZTECH Wire

Italy . 437 parts In-Stock

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$21.710

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437

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MKK Technologies

India . 1,940 parts In-Stock

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$31.207

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DigiPath Technology Company

USA . 1,940 parts In-Stock

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$31.207

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Perfect Parts

USA . 18,458 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,792 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,861 parts In-Stock

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Parana Technologies

USA . 1,082 parts In-Stock

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$19.843

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Corphita

USA . 248 parts In-Stock

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Overview

Unlock the power of efficiency with the M74HC151TTR multiplexer from STMicroelectronics! Renowned for their commitment to quality, STMicroelectronics delivers unparalleled reliability and performance in this compact device. With its low propagation delay and robust design, the M74HC151TTR is perfect for optimizing data routing in applications ranging from telecommunications to automotive systems. Elevate your projects with a trusted solution that ensures seamless operation and long-lasting durability!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures lightweight construction and excellent moisture resistance, making it suitable for various environments.

Propagation Delay At Nominal Supply: 38 ns

A low propagation delay makes this multiplexer/demultiplexer ideal for high-speed applications, ensuring quick signal transmission.

Surface Mount: YES

Surface mount capability allows for efficient PCB design and high-density layouts, facilitating modern electronic device manufacturing.

No. of Inputs: 8

With 8 input channels, this device provides versatility in switching multiple signals, making it ideal for complex circuitry.

Package Shape: RECTANGULAR

The rectangular shape is advantageous for efficient space utilization on circuit boards.

Nominal Supply Voltage / Vsup (V): 4.5

This nominal supply voltage fits well within common voltage levels, making it compatible with a wide range of systems.

Load Capacitance (CL): 50 pF

A manageable load capacitance ensures compatibility with various circuit designs, reducing the likelihood of signal integrity issues.

Power Supplies (V): 2/6

The flexible voltage range of power supplies (2V to 6V) increases adaptability in different applications.

No. of Terminals: 16

Having 16 terminals allows for multiple configurations and connections, enhancing the versatility of the device.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make this product space-efficient, ideal for compact applications.

Maximum I (ol): 4 Amp

A high output current capability of 4 Amps allows this device to drive heavier loads, broadening its application potential.

Propagation Delay (tpd): 190 ns

While this propagation delay is higher than the nominal value, it indicates versatility for different operational speeds.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature makes this device suitable for environments with elevated thermal conditions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature expands application in extreme conditions, enhancing its suitability for military and aerospace uses.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish offers superior conductivity and resistance to corrosion, which improves reliability over time.

Terminal Position: DUAL

Dual terminal positioning allows for flexible PCB layouts and simplifies the routing of signals.

Maximum Seated Height: 1.2 mm

A low seated height is beneficial for low-profile applications, enhancing design flexibility.

Width: 4.4 mm

A compact width aids in minimizing board space usage, accommodating smaller electronic devices.

Output Polarity: COMPLEMENTARY

Complementary output polarity enhances the versatility of this multiplexer/demultiplexer in signal processing applications.

Minimum Supply Voltage (Vsup): 2 V

Low minimum supply voltage makes it compatible with low-power applications, increasing its applicability.

Length: 5 mm

The short length supports design efficiency, allowing for close component placement on PCBs.

Temperature Grade: MILITARY

MILITARY grade temperature classification assures reliability and performance in extreme environments.

Technology: CMOS

CMOS technology ensures low power consumption and high efficiency, making it suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy handling and soldering during assembly, enhancing manufacturability.

Packing Method: TR

Tape and reel packing style improves ease of handling and assembly in automated processes.

Terminal Pitch: 0.65 mm

A small terminal pitch allows for reduced space on PCBs while maintaining signal integrity.

Maximum Supply Voltage (Vsup): 6 V

The capability to operate at a maximum supply voltage of 6V provides flexibility for various circuit designs.

Technical Specifications

Multiplexer & Demultiplexer M74HC151TTR attributes and parameters. Explore more Multiplexer & Demultiplexer devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

38 ns

Propagation Delay (tpd):

190 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

M74HC151TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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