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M74HC153TTR

STMicroelectronics

M74HC153TTR by STMicroelectronics

M74HC153TTR by STMicroelectronics is a CMOS multiplexer/demultiplexer with 4 inputs and 2 functions. It features a propagation delay of 35 ns, operates b/w 2-6 V, and supports military-grade temperatures from -55 °C to 125 °C. Ideal for compact electronic applications requiring efficient signal routing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,393 parts In-Stock

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Digiode

USA . 3,872 parts In-Stock

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Anansix

USA . 1,251 parts In-Stock

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IDEA Electronic Components Group

UK . 626 parts In-Stock

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$14.168

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$12.751

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626

$14.168

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MKK Technologies

India . 305 parts In-Stock

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$26.642

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305

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DigiPath Technology Company

USA . 305 parts In-Stock

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$26.642

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305

$26.642

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A-Z Elektronik GmbH

Germany . 5,232 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,488 parts In-Stock

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Perfect Parts

USA . 2,393 parts In-Stock

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Corphita

USA . 2,323 parts In-Stock

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Parana Technologies

USA . 1,050 parts In-Stock

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$16.940

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Overview

Unlock unmatched performance with the M74HC153TTR from STMicroelectronics, a leader in semiconductor innovation. This versatile multiplexer/demultiplexer excels in numerous applications, delivering reliable data routing while ensuring low power consumption. With its compact design and superior quality, it’s perfect for space-constrained environments. Experience enhanced efficiency and robust functionality that empower your next project—innovate confidently with STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy material provides reliability and resistance to environmental stress, making it suitable for various applications.

Propagation Delay At Nominal Supply: 35 ns

A short propagation delay enhances the switching speed, contributing to better performance in high-speed digital circuits.

Surface Mount: YES

Surface mount technology allows for a smaller footprint on PCBs, facilitating compact designs and automated assembly.

No. of Functions: 2

With two functions, this multiplexer/demultiplexer efficiently handles multiple signals, optimizing circuit design and reducing component count.

No. of Inputs: 4

Four inputs provide flexibility in signal routing, allowing for versatile applications in complex circuits.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient space utilization on PCB layouts, making it easier to integrate into existing designs.

Nominal Supply Voltage / Vsup (V): 4.5

An optimal nominal supply voltage ensures stable operation across a range of applications, enhancing compatibility with different systems.

Load Capacitance (CL): 50 pF

A low load capacitance enables faster signal transition times, improving overall performance in high-frequency applications.

Power Supplies (V): 2/6

Supports a wide range of supply voltages, allowing for flexibility in design by accommodating various power requirements.

No. of Terminals: 16

With 16 terminals, the device offers numerous connection options, allowing for versatility in multi-channel applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile helps save space and contributes to improved thermal performance.

Maximum I (ol): 4 Amp

The ability to handle up to 4 Amps makes it suitable for power applications, providing both signal and power switching capabilities.

Propagation Delay (tpd): 175 ns

Though a bit higher than the nominal supply condition, this delay is still adequate for many applications, ensuring effective signal management.

Maximum Operating Temperature: 125 °C

High operating temperature capability increases reliability in challenging environments, such as aerospace and industrial applications.

Minimum Operating Temperature: -55 °C

Able to function in very low temperatures, this component is suitable for extreme conditions, enhancing its versatility in diverse applications.

Terminal Finish: NICKEL PALLADIUM GOLD

A high-quality finish ensures excellent connectivity and corrosion resistance, which is pivotal in ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position provides flexibility in design, allowing for easier routing of signals.

Maximum Seated Height: 1.2 mm

A low profile allows for compact designs and can fit in space-constrained applications effectively.

Width: 4.4 mm

Narrow width enables denser PCB layouts, which is ideal for sophisticated electronic devices.

Output Polarity: TRUE

True output polarity ensures direct compatibility with standard digital signals, simplifying integration in circuits.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage enhances versatility, allowing use in battery-operated devices and lower-power applications.

Length: 5 mm

Short length contributes to compact designs, enabling use in small form-factor applications.

Temperature Grade: MILITARY

MILITARY grade ensures robust operation under harsh conditions, making it suitable for high-reliability applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, advantageous for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide better mechanical stability on PCBs.

Packing Method: TR

Tape and reel packing method allows for automated assembly and efficient handling of components during manufacturing.

Terminal Pitch: 0.65 mm

A small terminal pitch enables higher density designs, making it ideal for modern compact electronic devices.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, allowing for standard handling procedures during manufacturing.

Maximum Supply Voltage (Vsup): 6 V

A maximum supply voltage of 6 V provides flexibility for various circuit requirements, accommodating different power needs.

Technical Specifications

Multiplexer & Demultiplexer M74HC153TTR attributes and parameters. Explore more Multiplexer & Demultiplexer devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

35 ns

Propagation Delay (tpd):

175 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

M74HC153TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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