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M74HCT132TTR

STMicroelectronics

M74HCT132TTR by STMicroelectronics

M74HCT132TTR by STMicroelectronics is a CMOS Schmitt Trigger logic gate with a 45 ns propagation delay and operates at a nominal voltage of 5V. It features 4 functions, dual inputs, and is ideal for high-speed digital applications. Its compact design ensures efficient space utilization in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,991 parts In-Stock

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Anansix

USA . 1,666 parts In-Stock

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Digiode

USA . 345 parts In-Stock

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345

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Microchip USA

USA . 147 parts In-Stock

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$0.916

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147

$0.916

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AZTECH Wire

Italy . 511 parts In-Stock

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$13.740

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511

$13.740

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IDEA Electronic Components Group

UK . 2,187 parts In-Stock

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$29.353

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$26.417

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$29.353

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MKK Technologies

India . 43 parts In-Stock

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$55.196

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$55.196

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DigiPath Technology Company

USA . 43 parts In-Stock

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$55.196

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43

$55.196

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Component Stockers USA

USA . 487 parts In-Stock

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$99.990

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Perfect Parts

USA . 2,259 parts In-Stock

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Parana Technologies

USA . 2,059 parts In-Stock

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$35.096

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Corphita

USA . 798 parts In-Stock

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Overview

Unlock the power of precision with the M74HCT132TTR from STMicroelectronics, a leader in high-quality logic gate solutions. Designed for reliability and versatility, this compact gem excels in a variety of applications, from industrial automation to consumer electronics. Its fast propagation delay ensures seamless performance, while the rugged build withstands extreme conditions. Trust STMicroelectronics to deliver exceptional value and innovation tailored to elevate your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body ensures reliable performance and longevity, making it suitable for various applications.

Propagation Delay At Nominal Supply: 45 ns

A moderate propagation delay allows for effective signal processing in applications where speed is essential, striking a good balance between performance and power consumption.

Surface Mount: YES

Surface mount technology enables efficient PCB design, facilitating automated assembly and saving space.

No. of Functions: 4

Having multiple functions allows for versatility in design, enabling more complex logic operations in a compact form factor.

No. of Inputs: 2

With dual inputs, this logic gate can handle essential binary operations, making it useful for a wide range of logical applications.

Package Shape: RECTANGULAR

The rectangular package shape promotes easy integration into various circuit designs while maximizing space efficiency.

Nominal Supply Voltage / Vsup (V): 5

A standard nominal supply voltage of 5V ensures compatibility with a wide range of electronic circuits and existing systems.

Load Capacitance (CL): 50 pF

Low load capacitance is favorable for high-speed operations, contributing to improved switching performance.

Power Supplies (V): 5

5V power supply compatibility makes this device ideal for use in everyday digital circuits and systems.

No. of Terminals: 14

With 14 terminals, this component provides ample connectivity options for various applications, enhancing its flexibility.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and shrink pitch design allow for space-saving in PCBs, crucial for compact electronic products.

Maximum I (ol): 4 Amp

A maximum output current of 4 Amps enables the driving of loads directly, making it suitable for high-current applications.

Propagation Delay (tpd): 45 ns

Consistent propagation delay signifies reliable performance across different conditions, enhancing overall system stability.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures increases reliability in demanding environments, suitable for industrial and automotive applications.

Minimum Operating Temperature: -55 °C

Wide temperature tolerance ensures functionality in extreme conditions, making it ideal for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finishes improve durability and conductivity, ensuring reliable connections in electronic assemblies.

Terminal Position: DUAL

Dual terminal positioning allows for flexible mounting options, simplifying PCB design and enhancing layout versatility.

Maximum Seated Height: 1.2 mm

A low seated height is beneficial for compact designs, accommodating tighter packaging requirements.

Width: 4.4 mm

The compact width allows efficient use of PCB space, favoring designs where area is limited.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage requirement makes it compatible with a range of applications that may not always provide exact voltage.

Length: 5 mm

A short length maximizes layout flexibility, helping designers fit the chip into tight spaces on PCBs.

Temperature Grade: MILITARY

Military-grade classification ensures reliability and performance under severe conditions, making it suitable for high-stakes applications.

Schmitt Trigger: YES

Incorporating a Schmitt Trigger provides enhanced noise immunity and improved signal integrity, crucial for reliable digital operations.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and assembly, ensuring strong connections during manufacturing.

Packing Method: TR

Tape and reel packing allows for efficient handling and automated assembly, streamlining the manufacturing process.

Terminal Pitch: 0.65 mm

A fine terminal pitch is suited for high-density designs, maximizing component placement on PCBs.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V provides flexibility in design, allowing for easy integration in various electronic applications.

Technical Specifications

Logic Gates M74HCT132TTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

45 ns

Propagation Delay (tpd):

45 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

M74HCT132TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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