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M74HC86TTR

STMicroelectronics

M74HC86TTR by STMicroelectronics

M74HC86TTR from STMicroelectronics is a CMOS logic gate with 4 functions and 2 inputs, featuring a propagation delay of just 33 ns. It operates within a supply voltage range of 2-6 V and supports temperatures from -55 °C to 125 °C. Ideal for compact electronic applications, it comes in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 7,760 parts In-Stock

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Digiode

USA . 2,704 parts In-Stock

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Anansix

USA . 1,345 parts In-Stock

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Microchip USA

USA . 473 parts In-Stock

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$12.232

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473

$12.232

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AZTECH Wire

Italy . 188 parts In-Stock

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$13.340

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188

$13.340

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IDEA Electronic Components Group

UK . 742 parts In-Stock

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$21.491

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$19.342

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742

$21.491

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$19.342

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MKK Technologies

India . 758 parts In-Stock

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$40.413

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758

$40.413

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DigiPath Technology Company

USA . 758 parts In-Stock

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$40.413

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758

$40.413

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Ampacity Inc.

Singapore . 651 parts In-Stock

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$44.000

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Kepictronics

USA . 5,000 parts In-Stock

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Corphita

USA . 4,611 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Parana Technologies

USA . 520 parts In-Stock

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$25.696

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Overview

Elevate your designs with the M74HC86TTR from STMicroelectronics, where quality meets innovation. This versatile logic gate excels in efficiency and reliability, making it perfect for a range of applications from consumer electronics to industrial systems. Crafted with precision, its durability ensures peak performance even in demanding environments. Choose the M74HC86TTR for exceptional value and unmatched advantages that keep your projects on the cutting edge!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight body material ensures reliability and ease of handling during assembly.

Propagation Delay At Nominal Supply: 33 ns

Fast response time at nominal supply levels enhances overall circuit performance, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern electronic circuits.

No. of Functions: 4

Multiple functions in a single package increase design flexibility and reduce the need for multiple components.

No. of Inputs: 2

Supports dual input configurations, allowing for versatile logic design options in applications.

Package Shape: RECTANGULAR

Rectangular shape is optimized for space efficiency on PCBs, facilitating compact designs.

Nominal Supply Voltage / Vsup (V): 4.5

Standard operating voltage making it compatible with a wide range of power supply configurations.

Load Capacitance (CL): 50 pF

Appropriate load capacitance enabling effective operation in various digital circuits without signal degradation.

Power Supplies (V): 2/6

Wide supply voltage range makes it adaptable for different applications, providing design flexibility.

No. of Terminals: 14

Offers sufficient terminals for complex connections while keeping pin counts manageable for integration.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Thin profile saves space on the PCB, ideal for compact and high-density designs.

Maximum I (ol): 4 Amp

High output current capability allows this logic gate to drive a variety of loads, supporting robust applications.

Propagation Delay (tpd): 165 ns

Despite the longer propagation delay, it remains effective for applications that do not require ultra-high speed.

Maximum Operating Temperature: 125 °C

High operational temperature rating ensures reliable performance in harsh environments.

Minimum Operating Temperature: -55 °C

Wide temperature tolerance makes it suitable for use in extreme conditions, such as military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Premium finishes enhance the durability and performance of electrical connections, reducing oxidation and wear.

Terminal Position: DUAL

Dual terminal positioning simplifies circuit layout and facilitates efficient PCB design.

Maximum Seated Height: 1.2 mm

Low profile design aids in space conservation on PCBs, contributing to slim product designs.

Width: 4.4 mm

Compact width enhances the versatility of PCB layout, enabling more components in close proximity.

Minimum Supply Voltage (Vsup): 2 V

Low minimum supply voltage allows for operation in battery-powered and low-voltage applications.

Length: 5 mm

Short length contributes to overall compactness, making it ideal for space-constrained designs.

Temperature Grade: MILITARY

Military grade components are designed for high reliability and durability, ideal for defense and aerospace uses.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, increasing efficiency in digital circuits.

Terminal Form: GULL WING

Gull wing leads enhance solder joint reliability, promoting solid connections in surface mount applications.

Packing Method: TR

Taped and reeled packaging allows for efficient handling and automated assembly processes.

Terminal Pitch: 0.65 mm

Suitable pin pitch allows for dense layouts without compromising performance or manufacturing process.

Maximum Supply Voltage (Vsup): 6 V

Supports a higher supply voltage allows for scalability in more powerful circuits while maintaining functionality.

Technical Specifications

Logic Gates M74HC86TTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

33 ns

Propagation Delay (tpd):

165 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

M74HC86TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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