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M74HC533TTR

STMicroelectronics

M74HC533TTR by STMicroelectronics

M74HC533TTR by STMicroelectronics is an 8-bit bus driver with a propagation delay of 38 ns and operates b/w 2-6 V. Its compact design features a thin profile, making it ideal for space-constrained applications. This CMOS device supports 3-state outputs and is suitable for military-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 8,551 parts In-Stock

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Anansix

USA . 2,231 parts In-Stock

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Digiode

USA . 626 parts In-Stock

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Andel Nordic

Denmark . 685 parts In-Stock

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$7.038

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$6.757

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$6.757

685

$7.038

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$6.757

AZTECH Wire

Italy . 104 parts In-Stock

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$16.150

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IDEA Electronic Components Group

UK . 2,246 parts In-Stock

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$17.589

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$15.831

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MKK Technologies

India . 1,064 parts In-Stock

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$33.076

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$33.076

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DigiPath Technology Company

USA . 1,064 parts In-Stock

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$33.076

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$33.076

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QUARKTWIN TECHNOLOGY LTD

USA . 10,925 parts In-Stock

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Microchip USA

USA . 7,999 parts In-Stock

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Corphita

USA . 3,245 parts In-Stock

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Parana Technologies

USA . 91 parts In-Stock

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Overview

Unlock seamless data flow with the M74HC533TTR from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This high-quality bus driver & transceiver delivers exceptional performance and reliability, ideal for automotive, industrial, and communication applications. Experience optimal power efficiency, compact design, and robust temperature resilience, ensuring your projects thrive under any conditions. Elevate your designs and empower your innovations with ST’s unmatched expertise!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy offers durability and reliability, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 38 ns

The low propagation delay indicates fast switching times, which enhances the overall performance of the device.

Surface Mount: YES

Being surface mount compatible allows for easier integration into modern PCB designs, saving space and improving manufacturability.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on the PCB, making it suitable for compact designs.

No. of Bits: 8

With 8 bits, the device can handle a significant amount of data, making it ideal for a range of applications.

Nominal Supply Voltage / Vsup (V): 4.5

A nominal supply voltage of 4.5V makes this device versatile for various power supply configurations.

Load Capacitance (CL): 50 pF

Low load capacitance ensures efficient signal transmission and reduces power consumption.

Power Supplies (V): 2/6

The ability to operate within a wide voltage range (2V to 6V) allows for compatibility with different systems.

No. of Terminals: 20

With 20 terminals, the device provides ample connections for flexible circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline design with a thin profile saves space on PCBs and is ideal for compact applications.

Maximum I (ol): 6 Amp

A maximum output current of 6A enables the device to drive significant loads, suitable for power applications.

Propagation Delay (tpd): 265 ns

This propagation delay is effective for applications needing moderate speed, ensuring stable data transfers.

Maximum Operating Temperature: 125 °C

High operating temperature tolerance makes the device suitable for harsh environments.

Output Characteristics: 3-STATE

3-state output allows multiple devices to connect on the same bus, improving circuit flexibility.

Minimum Operating Temperature: -55 °C

The ability to operate at extremely low temperatures makes the device suitable for aerospace and military applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Quality terminal finish ensures excellent conductivity and resistance to corrosion, enhancing product longevity.

Terminal Position: DUAL

Dual terminal positioning improves connectivity options on circuits, adding design flexibility.

No. of Ports: 2

Two ports facilitate bi-directional communication in bus systems, increasing its utility.

Maximum Seated Height: 1.2 mm

Low seated height allows for integration in low-profile designs, fitting into compact spaces.

Width: 4.4 mm

Compact width helps in designing miniaturized devices, beneficial for space-constrained applications.

Output Polarity: INVERTED

Inverted output can simplify interfacing with certain logic families or circuits.

Minimum Supply Voltage (Vsup): 2 V

Minimum supply voltage of 2V allows for use in battery-powered devices, enhancing energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 40

Max reflow time indicates compatibility with standard soldering processes, easing manufacturing.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance ensures reliability during assembly processes.

Length: 6.5 mm

Compact length contributes to space-saving designs in electronic assemblies.

Temperature Grade: MILITARY

MIL-STD grade ensures high reliability and durability under extreme conditions, suitable for defense applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it efficient for digital applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering properties and can be easily inspected for quality.

Packing Method: TR

Tape and reel packing facilitates automated placement during manufacturing, improving production efficiency.

Terminal Pitch: 0.65 mm

Compact terminal pitch supports dense packing on PCBs, beneficial for small form factor designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates reasonable moisture protection, suitable for controlled environments and standard handling.

Maximum Supply Voltage (Vsup): 6 V

Max supply voltage of 6V ensures compatibility with a wide range of electronic systems.

Technical Specifications

Bus Driver & Transceivers M74HC533TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

38 ns

Propagation Delay (tpd):

265 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Trade Compliance

M74HC533TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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