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M74HC273RM13TR

STMicroelectronics

M74HC273RM13TR by STMicroelectronics

M74HC273RM13TR by STMicroelectronics is an 8-bit CMOS latch with a max supply voltage of 6V and operates at temperatures from -55 °C to 125°C. It features a fast propagation delay of 220 ns and supports frequencies up to 20 MHz. Ideal for military applications, it comes in a compact SO package.

Median Price

$1.150

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

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Component Electronics Inc.

Canada . 73 parts In-Stock

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$1.150

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$0.870

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$0.750

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73

$1.150

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Pegasus Components GmbH

Germany . 34,573 parts In-Stock

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Martec Srl

Italy . 27,000 parts In-Stock

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Vyrian

USA . 8,862 parts In-Stock

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MISTER SPROCKETS

USA . 4,000 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,293 parts In-Stock

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Anansix

USA . 1,319 parts In-Stock

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Digiode

USA . 552 parts In-Stock

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J & M Industries LLC

USA . 500 parts In-Stock

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500

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Corel Iberica Componentes, S.L.

Spain . 325 parts In-Stock

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PC Components Company LLC

USA . 63 parts In-Stock

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Bristol Electronics

USA . 63 parts In-Stock

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Ashlea Components Ltd

UK . 57 parts In-Stock

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Prism Electronics

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Distributors (Availability)

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Microchip USA

USA . 357 parts In-Stock

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$6.453

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357

$6.453

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IDEA Electronic Components Group

UK . 989 parts In-Stock

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$14.581

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$13.123

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989

$14.581

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AZTECH Wire

Italy . 962 parts In-Stock

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$19.920

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MKK Technologies

India . 47 parts In-Stock

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$27.419

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$27.419

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DigiPath Technology Company

USA . 47 parts In-Stock

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$27.419

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Component Stockers USA

USA . 272 parts In-Stock

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$99.990

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Perfect Parts

USA . 61,944 parts In-Stock

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GreenTree Electronics

Israel . 15,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,616 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,744 parts In-Stock

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Corphita

USA . 2,807 parts In-Stock

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Parana Technologies

USA . 2,066 parts In-Stock

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$17.434

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Authorized Procurement Solutions

USA . 1,600 parts In-Stock

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Legend Electronics Inc. (Excess)

USA . 746 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 746 parts In-Stock

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Assy Fe

Spain . 325 parts In-Stock

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Overview

Unlock the potential of your designs with the M74HC273RM13TR from STMicroelectronics—a reliable, high-performance latch that sets new standards in quality and efficiency. Crafted with precision, this 8-bit CMOS device ensures rapid response times and robust operation across a wide temperature range, perfect for demanding applications in automotive and industrial sectors. Experience unparalleled durability and superior signal integrity, making it the smart choice for innovative engineers seeking excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials contributes to durability and resistance against environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for automated assembly and supports high-density circuit board designs.

Package Shape: RECTANGULAR

The rectangular shape maximizes space efficiency on circuit boards, facilitating compact designs.

No. of Bits: 8

An 8-bit configuration is versatile for a wide range of digital applications, providing a balance between performance and efficiency.

Nominal Supply Voltage / Vsup: 4.5 V

Operating at a nominal supply voltage of 4.5 V optimizes power consumption while still supporting robust performance.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF ensures compatibility with a variety of circuit designs, enabling reliable signal integrity.

Power Supplies (V): 2/6

Supports a wide voltage range (2 to 6 V), making it adaptable for various power supply configurations.

No. of Terminals: 20

With 20 terminals, this component offers multiple connectivity options for versatile integration into systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style is space-efficient, ideal for modern, compact electronic devices.

Maximum I (ol): 4 Amp

A maximum output current of 4 Amp supports high-load applications, enhancing its performance in demanding environments.

Propagation Delay (tpd): 220 ns

A propagation delay of 220 ns ensures fast switching, making this product suitable for high-speed applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature makes it suitable for use in harsh environments and industrial applications.

Trigger Type: POSITIVE EDGE

Positive edge triggering provides a reliable response to inputs, increasing precision in digital circuits.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55 °C, this component is suitable for extreme cold environments, ensuring reliable performance.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish enhances corrosion resistance and provides reliable connectivity over time.

Terminal Position: DUAL

The dual terminal position enhances flexibility for mounting and integration into diverse circuit layouts.

Maximum Seated Height: 2.65 mm

A low seated height allows for thinner PCB designs, contributing to compact electronic assemblies.

Width: 7.5 mm

A width of 7.5 mm offers a good balance between size and connectivity options, making it easy to fit in various applications.

Output Polarity: TRUE

True output polarity indicates reliability in signal representation, crucial for accurate digital circuit operation.

Minimum Supply Voltage (Vsup): 2 V

Supports a low minimum supply voltage of 2 V, enabling battery-operated and low-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand a maximum of 30 seconds at peak reflow temperature, ensuring it can be used in typical soldering processes without damage.

Peak Reflow Temperature °C: 260 °C

A high peak reflow temperature shows suitability for modern assembly techniques, ensuring compatibility with advanced manufacturing processes.

Length: 12.8 mm

The length of 12.8 mm provides a balance of size and terminal availability, ensuring ample connectivity options.

Temperature Grade: MILITARY

Rated as military-grade, this component is designed for high reliability and endurance in extreme conditions.

Maximum Frequency At Nominal Supply: 20 MHz

Supports a maximum frequency of 20 MHz, making it suitable for applications that require moderate-speed processing.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making it an efficient choice for modern digital circuits.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and are a standard form for surface-mounted devices, enhancing assembly efficiency.

Packing Method: TR

Packaged with a TR method, ensuring ease of handling and reliable delivery for large volume applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard for many applications, allowing for flexible layout designs on PCBs.

Minimum fmax: 24 MHz

With a minimum frequency capability of 24 MHz, this product is effective for applications requiring moderate-speed operations.

Moisture Sensitivity Level (MSL): 3

An MSL rating of 3 indicates careful handling during assembly, ensuring reliability in humid environments.

Maximum Supply Voltage (Vsup): 6 V

Supporting a maximum supply voltage of 6 V allows for compatibility with a broad range of electronic circuits and devices.

Technical Specifications

Latches & Flip-Flops M74HC273RM13TR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

220 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Minimum fmax:

24 MHz

Trade Compliance

M74HC273RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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