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M74HC132TTR

STMicroelectronics

M74HC132TTR by STMicroelectronics

M74HC132TTR by STMicroelectronics is a CMOS logic gate with a 32 ns propagation delay and operates b/w 2-6 V. It features four functions with dual inputs, ideal for high-speed applications in compact designs. Its military-grade specs ensure reliability in extreme conditions.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,675 parts In-Stock

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Ashlea Components Ltd

UK . 2,442 parts In-Stock

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Digiode

USA . 2,297 parts In-Stock

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Anansix

USA . 807 parts In-Stock

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AZTECH Wire

Italy . 1,103 parts In-Stock

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$9.860

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$9.860

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IDEA Electronic Components Group

UK . 2,088 parts In-Stock

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$10.829

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$9.746

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2,088

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$9.746

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MKK Technologies

India . 2,158 parts In-Stock

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$20.364

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$20.364

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DigiPath Technology Company

USA . 2,158 parts In-Stock

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$20.364

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Component Stockers USA

USA . 774 parts In-Stock

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$99.990

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Microchip USA

USA . 5,571 parts In-Stock

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Perfect Parts

USA . 2,938 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,451 parts In-Stock

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Parana Technologies

USA . 400 parts In-Stock

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$12.948

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Corphita

USA . 272 parts In-Stock

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Overview

Unlock unparalleled performance with the M74HC132TTR from STMicroelectronics, a leader in high-quality semiconductor solutions. This versatile logic gate delivers rapid response times and robust functionality, making it ideal for a range of applications—from automotive systems to industrial automation. With its compact design and reliable operation even in extreme temperatures, this product ensures your projects run smoothly and efficiently, maximizing value every step of the way. Choose STMicroelectronics for quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance against environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 32 ns

A low propagation delay enhances the speed and responsiveness of circuits, ideal for high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of board space, which is beneficial in modern electronics.

No. of Functions: 4

Supporting four functions increases versatility, allowing designers to implement multiple logic operations within a single component.

No. of Inputs: 2

With two inputs, this component is versatile and can be utilized in various logic configurations for different applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space usage on PCBs, making it easier to integrate into various designs.

Nominal Supply Voltage / Vsup (V): 4.5

This nominal supply voltage is compatible with a wide range of applications, providing flexibility in circuit design.

Load Capacitance (CL): 50 pF

A relatively low load capacitance allows for faster switching speeds and efficient performance in high-frequency applications.

Power Supplies (V): 2/6

Supports a range of supply voltages (2V to 6V), making it flexible for various applications and power supply configurations.

No. of Terminals: 14

The 14 terminals provide ample connections for complex circuits while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This compact package style allows for greater integration density, beneficial for space-constrained applications.

Maximum I (ol): 4 Amp

A maximum output current of 4 Amps enables this component to drive substantial loads, making it suitable for demanding applications.

Propagation Delay (tpd): 160 ns

While the tpd is higher than nominal supply delay, it still provides adequate speed for many standard applications.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures ensures reliability in various environments, making it suitable for industrial applications.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature, this product is suitable for extreme conditions, providing added reliability.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This high-quality terminal finish enhances conductivity and ensures long-term reliability in connections.

Terminal Position: DUAL

Dual terminal positioning allows for design flexibility in PCB layouts, accommodating different space and configuration needs.

Maximum Seated Height: 1.2 mm

A low seated height aids in achieving a slim profile for the overall device design, crucial for compact electronics.

Width: 4.4 mm

The compact width allows for higher integration density on PCBs, making it ideal for space-sensitive applications.

Minimum Supply Voltage (Vsup): 2 V

This low minimum supply voltage allows for compatibility with low-power applications, contributing to energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds indicates compatibility with standard soldering processes, simplifying manufacturing.

Peak Reflow Temperature °C: 260

Being able to withstand high peak reflow temperatures ensures robustness during assembly processes.

Length: 5 mm

A short length helps conserve space in circuit boards, also allowing for higher density component placement.

Temperature Grade: MILITARY

The military-grade temperature classification ensures high reliability and performance in harsh environments.

Schmitt Trigger: YES

The inclusion of a Schmitt trigger provides improved noise immunity and faster response times, beneficial for signal processing.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making it an energy-efficient option.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve reliability of connections on PCBs.

Packing Method: TR

Tape and reel packaging allows for efficient automated assembly processes, optimizing production speed.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for dense packing of components, maximizing the usability of PCB real estate.

Maximum Supply Voltage (Vsup): 6 V

Supporting a maximum supply voltage of 6V increases the range of applications and allows for versatility in circuit design.

Technical Specifications

Logic Gates M74HC132TTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

32 ns

Propagation Delay (tpd):

160 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

M74HC132TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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