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M74HC112RM13TR

STMicroelectronics

M74HC112RM13TR by STMicroelectronics

M74HC112RM13TR by STMicroelectronics is a dual negative edge-triggered flip-flop in a compact 16-terminal SO package. It operates b/w 2-6V, with a max frequency of 27MHz and propagation delay of 190ns, ideal for high-speed digital applications. Its military-grade specs ensure reliability in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Cyclops Electronics Ltd

UK . 3,386 parts In-Stock

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Digiode

USA . 3,276 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,727 parts In-Stock

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Vyrian

USA . 2,435 parts In-Stock

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Bristol Electronics

USA . 2,274 parts In-Stock

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Atlantic Semiconductor

USA . 1,288 parts In-Stock

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Anansix

USA . 1,027 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 498 parts In-Stock

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$20.790

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498

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IDEA Electronic Components Group

UK . 1,476 parts In-Stock

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$27.004

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$24.303

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MKK Technologies

India . 2,243 parts In-Stock

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$50.779

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DigiPath Technology Company

USA . 2,243 parts In-Stock

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$50.779

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Component Stockers USA

USA . 396 parts In-Stock

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$99.990

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Microchip USA

USA . 4,399 parts In-Stock

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Corphita

USA . 4,191 parts In-Stock

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Kepictronics

USA . 2,252 parts In-Stock

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Parana Technologies

USA . 587 parts In-Stock

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$32.287

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Overview

Elevate your designs with the M74HC112RM13TR from STMicroelectronics, a top-tier choice in latches and flip-flops. Built with exceptional quality and reliability, this versatile component is engineered for optimal performance in various applications, ensuring seamless integration into your projects. Enjoy peace of mind with ST's renowned expertise, knowing you're backed by a leader in innovation that delivers efficiency and durability—all at an unbeatable value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy construction ensures reliability and protection against environmental damage.

Surface Mount: YES

Surface mount technology facilitates efficient assembly and saves space on printed circuit boards.

No. of Functions: 2

Dual functionality offers versatility in applications, allowing for more complex designs within a single component.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space usage on circuit boards, making it easier to implement in various designs.

No. of Bits: 2

Supports operations on two bits, enhancing processing capabilities for more advanced logic implementations.

Nominal Supply Voltage / Vsup: 4.5 V

An optimal nominal supply voltage ensures energy efficiency while maintaining performance.

Load Capacitance (CL): 50 pF

Low load capacitance enhances speed and performance in high-frequency applications.

Power Supplies (V): 2/6

Operating range from 2 to 6 volts offers flexibility in various circuit designs and power management.

No. of Terminals: 16

Offers multiple terminals for greater connectivity options and better integration into complex systems.

Package Style (Meter): SMALL OUTLINE

Small outline design helps in compact layouts, ideal for space-constrained applications.

Maximum I (ol): 4 Amp

High output current capability allows for driving more substantial loads directly from the device.

Propagation Delay (tpd): 190 ns

Fast propagation delay enables quick signal processing, crucial for high-speed applications.

Maximum Operating Temperature: 125 °C

High operational temperature tolerance indicates robustness for extreme environments and reliability.

Trigger Type: NEGATIVE EDGE

Negative edge triggering is suitable for synchronous designs, reducing unpredictable behavior in circuits.

Minimum Operating Temperature: -55 °C

Can operate in a wide range of temperatures, making it ideal for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Quality terminal finish ensures excellent electrical connectivity and long-term durability.

Terminal Position: DUAL

Dual terminal positions facilitate better layout flexibility in circuit designs.

Maximum Seated Height: 1.75 mm

Low seated height helps maintain a slim profile in electronic assemblies.

Width: 3.9 mm

Compact width allows for high-density packaging within modern electronic designs.

Output Polarity: COMPLEMENTARY

Complementary output polarity improves performance in signal processing applications by reducing noise.

Minimum Supply Voltage (Vsup): 2 V

Low minimum supply voltage increases design flexibility and power efficiency.

Length: 9.9 mm

Compact length makes integration into tight spaces easier while maintaining performance.

Temperature Grade: MILITARY

Military-grade specifications ensure reliability in harsh conditions, suitable for defense applications.

Maximum Frequency At Nominal Supply: 27 MHz

Supports high frequency, which is essential for fast-paced applications and advanced signal processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for modern applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and facilitate easy soldering in mass production.

Packing Method: TR

Tape and reel packing simplifies the manufacturing process by allowing for efficient handling and placement.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows compatibility with a variety of PCB layouts, enhancing design adaptability.

Minimum fmax: 32 MHz

Minimum operational frequency of 32 MHz ensures adequate processing speed for most applications.

Maximum Supply Voltage (Vsup): 6 V

Allows for use in a variety of power supply scenarios, providing designers with greater flexibility.

Technical Specifications

Latches & Flip-Flops M74HC112RM13TR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

27000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

2/6

Propagation Delay (tpd):

190 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

NEGATIVE EDGE

Width:

3.9 mm

Minimum fmax:

32 MHz

Trade Compliance

M74HC112RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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