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M40Z300WMQ6F

STMicroelectronics

M40Z300WMQ6F by STMicroelectronics

M40Z300WMQ6F by STMicroelectronics is a dual-channel power management IC with a nominal voltage of 3V and operates in -40 °C to 85 °C. It features a compact SO package (3.9mm x 9.9mm) and supports adjustable thresholds for versatile applications. Ideal for industrial use, it ensures reliable performance with low supply current (4mA).

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,575 parts In-Stock

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8,575

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Anansix

USA . 1,738 parts In-Stock

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1,738

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Digiode

USA . 82 parts In-Stock

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82

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 450 parts In-Stock

1+ parts

$6.445

100+ parts

-

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$5.800

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-

450

$6.445

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$5.800

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MKK Technologies

India . 1,476 parts In-Stock

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$12.119

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1,476

$12.119

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DigiPath Technology Company

USA . 1,476 parts In-Stock

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$12.119

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1,476

$12.119

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$18.611

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$16.936

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$15.261

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-

5,000

$18.611

$16.936

$15.261

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Microchip USA

USA . 310 parts In-Stock

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$18.946

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310

$18.946

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AZTECH Wire

Italy . 1,202 parts In-Stock

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$21.620

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$21.620

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Component Stockers USA

USA . 419 parts In-Stock

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$99.990

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419

$99.990

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Corphita

USA . 632 parts In-Stock

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Parana Technologies

USA . 432 parts In-Stock

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$7.706

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432

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$7.706

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Overview

Elevate your power management solutions with the M40Z300WMQ6F from STMicroelectronics. Known for their unwavering commitment to quality, STMicroelectronics delivers this advanced IC designed for efficiency and reliability in demanding applications. With its rugged temperature range and compact design, this power supply support circuit ensures optimal performance in industrial settings, offering seamless integration, reduced energy consumption, and enhanced system stability. Experience the difference that superior engineering can make for your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material contributes to the durability and reliability of the IC, making it suitable for various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easier integration into compact circuits, enhancing design flexibility and reducing assembly space.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on PCBs, making it suitable for densely packed electronic designs.

Nominal Supply Voltage (Vsup): 3 V

Operating at a nominal supply voltage of 3 V makes this IC ideal for low-voltage applications, ensuring energy efficiency.

Power Supplies (V): 3/3.3

Compatible with both 3 V and 3.3 V power supplies, enhancing versatility in different circuit designs.

No. of Terminals: 16

Having 16 terminals allows for a wide range of connections and functionalities, making the IC highly versatile.

Package Style (Meter): SMALL OUTLINE

The small outline package style facilitates easier handling and placement in automated assembly processes.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability under moderate temperature conditions, suitable for various industrial applications.

Minimum Operating Temperature: -40 °C

This product's ability to function down to -40 °C makes it suitable for use in harsh environments and extreme weather conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish enhances solderability and ensures robustness against corrosion, improving the longevity of connections.

Terminal Position: DUAL

Dual terminal positioning aids in efficient layout planning on PCBs, enabling more design flexibility.

Maximum Seated Height: 1.75 mm

With a maximum seated height of just 1.75 mm, this IC is well-suited for low-profile applications.

Width: 3.9 mm

A compact width of 3.9 mm helps in optimizing space on several PCB layouts, making it an excellent fit for density-sensitive designs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This classification indicates that the IC supports various power supply configurations, broadening its application range.

Minimum Supply Voltage (Vsup): 2.7 V

Supporting a minimum supply voltage of 2.7 V allows for flexibility in low-voltage applications.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow time of 30 seconds ensures reliability during the soldering process and minimizes thermal stress on the device.

Peak Reflow Temperature (°C): 260

This IC can withstand high reflow temperatures, making it compatible with most modern surface-mount soldering processes.

Length: 9.9 mm

At 9.9 mm long, the IC is compact enough to fit in tight spaces without compromising performance.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures this IC can operate reliably in variable and demanding environments.

Maximum Supply Current (Isup): 4 mA

A maximum supply current of just 4 mA supports low-power designs, increasing overall energy efficiency.

No. of Channels: 2

This dual-channel capability allows for a more efficient design and reduces the need for multiple ICs in applications.

Technology: CMOS

CMOS technology ensures lower power consumption and higher speed, making it suitable for a variety of applications.

Terminal Form: GULL WING

Gull wing terminals are designed for easy handling and reliable soldering, enhancing manufacturability.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch optimizes layout flexibility and allows for efficient routing on PCBs.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates standard handling precautions, facilitating practical use in manufacturing environments.

Maximum Supply Voltage (Vsup): 3.6 V

Supporting a maximum supply voltage of 3.6 V allows for compatibility with a range of power supply levels.

Adjustable Threshold: YES

The adjustable threshold feature provides design flexibility, allowing engineers to customize the IC's operation according to specific application needs.

Technical Specifications

Power Management ICs M40Z300WMQ6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

IT CAN ALSO BE OPERATED FROM A 3V TO 3.6V SUPPLY

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

4 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

M40Z300WMQ6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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