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M24128S-FCU6T/TF

STMicroelectronics

M24128S-FCU6T/TF by STMicroelectronics

M24128S-FCU6T/TF by STMicroelectronics is a 16Kx8 EEPROM with a compact square package, ideal for space-constrained applications. It operates at a nominal voltage of 1.8V and supports I2C serial communication. With an industrial temperature range of -40 °C to 85 °C, it's perfect for robust environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,819 parts In-Stock

1+ parts

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2,819

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Vyrian

USA . 2,064 parts In-Stock

1+ parts

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2,064

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Anansix

USA . 401 parts In-Stock

1+ parts

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401

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 792 parts In-Stock

1+ parts

$4.807

100+ parts

-

1k+ parts

$4.326

10k+ parts

-

792

$4.807

-

$4.326

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MKK Technologies

India . 504 parts In-Stock

1+ parts

$9.039

100+ parts

-

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504

$9.039

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DigiPath Technology Company

USA . 504 parts In-Stock

1+ parts

$9.039

100+ parts

-

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504

$9.039

-

-

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AZTECH Wire

Italy . 630 parts In-Stock

1+ parts

$13.260

100+ parts

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630

$13.260

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Microchip USA

USA . 374 parts In-Stock

1+ parts

$28.860

100+ parts

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374

$28.860

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Corphita

USA . 3,403 parts In-Stock

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3,403

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Parana Technologies

USA . 199 parts In-Stock

1+ parts

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$5.748

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199

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$5.748

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Overview

Unlock the potential of your projects with the M24128S-FCU6T/TF EEPROM from STMicroelectronics—where quality meets reliability. Engineered for industrial applications, this compact memory solution operates within an impressive temperature range, ensuring performance in diverse environments. With seamless integration and superior durability, it’s perfect for smart devices, automotive systems, and IoT innovations. Experience unmatched efficiency and dependability that elevate your designs to the next level!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic and epoxy materials provide protection and reliability in various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easier integration into compact circuit designs, saving space on PCBs.

Package Shape: SQUARE

Square package shape optimizes space efficiency and facilitates uniform placement on circuit boards.

Operating Mode: SYNCHRONOUS

Synchronous operation enhances speed and efficiency in communication, making data transfer more reliable.

Nominal Supply Voltage / Vsup: 1.8V

Low nominal supply voltage reduces overall power consumption, making it ideal for battery-operated devices.

No. of Terminals: 4

A minimal number of terminals simplifies connection and layout, reducing potential points of failure.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Thin profile and fine pitch allow for high-density packaging, suitable for modern space-constrained applications.

Maximum Operating Temperature: 85 °C

An extended maximum operating temperature range ensures reliable performance in industrial environments.

Organization: 16KX8

This memory organization provides a good balance between capacity and accessibility for various applications.

Minimum Operating Temperature: -40 °C

Able to function in very low temperatures, making this product suitable for outdoor and harsh settings.

Terminal Position: BOTTOM

Bottom terminal position can facilitate better thermal performance and ease of soldering on PCBs.

Maximum Seated Height: 0.33 mm

A low seated height reduces overall component height, contributing to compact designs and low-profile assemblies.

Maximum Clock Frequency (fCLK): 1 MHz

With a maximum clock frequency of 1 MHz, the product is capable of handling moderate-speed operations effectively.

Width: 0.833 mm

Compact width allows for a high-density layout while fitting into small form factor designs.

Minimum Supply Voltage (Vsup): 1.7V

A low minimum supply voltage enhances versatility for different applications, especially in low-power circuits.

Length: 0.833 mm

The short length also supports space-saving strategies in PCB designs, allowing for more components in limited areas.

Temperature Grade: INDUSTRIAL

Industrial temperature grade certification ensures long-term reliability in challenging conditions.

Technology: CMOS

CMOS technology offers low static power consumption, making it power-efficient for embedded systems.

Parallel or Serial: SERIAL

Serial communication reduces pin count and simplifies connectivity, particularly advantageous in complex designs.

Terminal Form: BALL

Ball terminal form provides strong connections and ensures effective solderability in assembly processes.

No. of Words: 16384 words

A significant number of words allows for ample data storage for many applications without requiring extensive component count.

Memory Width: 8

An 8-bit memory width is advantageous for standard byte-oriented access required in many digital applications.

Terminal Pitch: 0.4 mm

A tighter terminal pitch allows for more components on a PCB, enhancing design flexibility and compactness.

No. of Words Code: 16K

This specification provides sufficient memory capacity for a broad range of applications including firmware and configuration storage.

Maximum Supply Voltage (Vsup): 5.5V

A higher maximum supply voltage extends compatibility with diverse systems, especially legacy hardware.

Serial Bus Type: I2C

I2C protocol simplifies connectivity with multiple devices on the same bus, making system integration easier.

Maximum Write Cycle Time (tWC): 5 ms

A quick write cycle time ensures efficient data handling, making this EEPROM suitable for responsive applications.

Memory Density: 131072 bit

High memory density allows for storing larger amounts of data, making it ideal for complex applications.

Memory IC Type: EEPROM

As an EEPROM, it retains data without power, making it essential for non-volatile memory applications.

Technical Specifications

EEPROM M24128S-FCU6T/TF attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

1 MHz

JESD-30 Code:

S-PBGA-B4

Length:

.833 mm

Memory Density:

131072 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

4

No. of Words:

16384 words

No. of Words Code:

16K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.33 mm

Serial Bus Type:

I2C

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

.833 mm

Maximum Write Cycle Time (tWC):

5 ms

Trade Compliance

M24128S-FCU6T/TF Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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