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M24128-BFMB6TG

STMicroelectronics

M24128-BFMB6TG by STMicroelectronics

M24128-BFMB6TG by STMicroelectronics is a 16Kx8 EEPROM with a synchronous operating mode, ideal for industrial applications. It operates at a nominal voltage of 1.8V and supports I2C communication. With a max temp of 85 °C and endurance of 1M write/erase cycles, it's reliable for data storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Cyclops Electronics Ltd

UK . 15,000 parts In-Stock

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15,000

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Vyrian

USA . 7,025 parts In-Stock

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7,025

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Digiode

USA . 4,874 parts In-Stock

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4,874

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Anansix

USA . 439 parts In-Stock

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439

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,104 parts In-Stock

1+ parts

$4.001

100+ parts

-

1k+ parts

$3.601

10k+ parts

-

2,104

$4.001

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$3.601

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MKK Technologies

India . 584 parts In-Stock

1+ parts

$7.524

100+ parts

-

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584

$7.524

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DigiPath Technology Company

USA . 584 parts In-Stock

1+ parts

$7.524

100+ parts

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584

$7.524

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AZTECH Wire

Italy . 1,021 parts In-Stock

1+ parts

$18.080

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1,021

$18.080

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Component Stockers USA

USA . 291 parts In-Stock

1+ parts

$99.990

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291

$99.990

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Microchip USA

USA . 5,606 parts In-Stock

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5,606

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A-Z Elektronik GmbH

Germany . 5,562 parts In-Stock

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5,562

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Alle Elektronik GmbH

Germany . 3,708 parts In-Stock

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3,708

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Kepictronics

USA . 2,500 parts In-Stock

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2,500

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Assy Fe

Spain . 2,500 parts In-Stock

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2,500

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Parana Technologies

USA . 1,140 parts In-Stock

1+ parts

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$4.784

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1,140

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$4.784

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Corphita

USA . 713 parts In-Stock

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713

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Overview

Unlock unparalleled performance with the M24128-BFMB6TG from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality EEPROM is designed for industrial applications, ensuring reliability even in extreme temperatures. With its ultra-thin profile and robust features, it offers exceptional data retention and endurance, making it ideal for smart devices, automotive systems, and more. Elevate your projects with ST’s commitment to excellence and experience the power of advanced technology!

Feature Benefit Bullets

Surface Mount: YES

The surface mount package provides a compact design, allowing for efficient use of space on the PCB.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy placement and soldering on circuit boards in automated assembly processes.

Operating Mode: SYNCHRONOUS

Synchronous operation enables faster data transfer rates and improves efficiency in communication.

Nominal Supply Voltage / Vsup: 1.8 V

A lower nominal supply voltage helps in power consumption reduction, making the product suitable for battery-operated devices.

Power Supplies: 1.8/5 V

Dual power supply support allows flexibility in application integration and compatibility with various systems.

No. of Terminals: 8

Having 8 terminals allows for an adequate number of connections for a variety of interface demands.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline and very thin profile optimize space, making it ideal for compact electronic devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature rating ensures reliability in diverse environments, especially in industrial applications.

Organization: 16KX8

This memory organization provides a great balance of density and speed for various EEPROM applications.

Minimum Operating Temperature: -40 °C

With a wide temperature range, this EEPROM is suitable for use in harsh environments, making it highly reliable.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The premium terminal finish provides excellent corrosion resistance and enhances solderability for better connections.

I2C Control Byte: 1010DDDR

I2C control makes interfacing with microcontrollers straightforward, simplifying integration into existing systems.

Terminal Position: DUAL

Dual terminal positioning allows for flexible design and easier routing on modern PCBs.

Write Protection: HARDWARE

Hardware write protection ensures data integrity and security, making it suitable for critical applications.

Maximum Seated Height: 0.6 mm

The low seated height is advantageous for low-profile designs in compact electronic products.

Maximum Clock Frequency (fCLK): 0.4 MHz

A 0.4 MHz clock frequency balances performance and power consumption, ideal for numerous applications.

Width: 2 mm

The compact width aids in space-efficient designs, particularly in portable electronic devices.

Minimum Supply Voltage (Vsup): 1.7 V

A low minimum supply voltage expands the device's versatility across various power rail environments.

Maximum Time At Peak Reflow Temperature: 30 s

A longer peak reflow time allows for more flexible manufacturing processes and better solder joint reliability.

Peak Reflow Temperature: 260 °C

High reflow temperature capability ensures compatibility with widely used surface mount assembly processes.

Length: 3 mm

The short length contributes to an overall smaller footprint on the PCB, enabling dense component layouts.

Temperature Grade: INDUSTRIAL

Industrial temperature grading means the device is suited for commercial and rugged environments.

Technology: CMOS

CMOS technology facilitates low power consumption and high efficiency, enhancing battery life in applications.

Parallel or Serial: SERIAL

Serial configuration simplifies wiring and PCB layout, making it suitable for complex designs.

Terminal Form: NO LEAD

No-lead form provides a smaller footprint and improves performance due to reduced parasitic inductance and capacitance.

Maximum Supply Current: 3 mA

A low maximum supply current contributes to prolonged battery life in portable applications.

No. of Words: 16384 words

With a total of 16384 words, it offers a significant amount of data storage for a variety of applications.

Memory Width: 8

An 8-bit memory width suits a range of applications, ensuring compatibility with common data buses.

Minimum Data Retention Time: 40 years

Extended data retention makes it a reliable choice for applications where data integrity over long periods is crucial.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch aids in space savings and compatibility with high-density boards.

No. of Words Code: 16K

Having 16K words can accommodate various data storage needs, making it versatile for different applications.

Maximum Supply Voltage (Vsup): 5.5 V

Supporting up to 5.5 V ensures compatibility with a wide range of electronic systems and protects against voltage spikes.

Endurance: 1,000,000 Write/Erase Cycles

High endurance rating suggests robustness, making it ideal for applications requiring frequent updates to stored data.

Serial Bus Type: I2C

I2C serial bus type simplifies connections and allows for multiple devices on the same bus, enhancing design flexibility.

Maximum Write Cycle Time (tWC): 5 ms

A short write cycle time improves responsiveness, benefiting high-performance applications requiring quick data updates.

Memory Density: 131072 bit

A substantial density of 131072 bits provides ample storage capacity, making it suitable for larger data needs.

Memory IC Type: EEPROM

As an EEPROM, it allows for non-volatile storage of data that does not require power to maintain.

Maximum Standby Current: 0.000001 Amp

Ultra-low standby current optimizes power consumption, making it ideal for energy-sensitive applications.

Technical Specifications

EEPROM M24128-BFMB6TG attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-XDSO-N8

JESD-609 Code:

e4

Length:

3 mm

Memory Density:

131072 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

16384 words

No. of Words Code:

16K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16KX8

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24128-BFMB6TG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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