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L99PM72PXPTR

STMicroelectronics

L99PM72PXPTR by STMicroelectronics

L99PM72PXPTR by STMicroelectronics is a Power Management IC with 36 terminals, operating at power supplies of 4.5-28V. It features a small outline package shape and gull wing terminal form, suitable for power supply management circuits in various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,404 parts In-Stock

1+ parts

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6,404

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Digiode

USA . 3,719 parts In-Stock

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3,719

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Anansix

USA . 1,686 parts In-Stock

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1,686

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ComSIT Distribution GmbH

Germany . 295 parts In-Stock

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295

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 1,373 parts In-Stock

1+ parts

$11.301

100+ parts

-

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1,373

$11.301

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IDEA Electronic Components Group

UK . 32 parts In-Stock

1+ parts

$18.758

100+ parts

-

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$16.882

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32

$18.758

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$16.882

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AZTECH Wire

Italy . 693 parts In-Stock

1+ parts

$21.710

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693

$21.710

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MKK Technologies

India . 2,023 parts In-Stock

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$35.273

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2,023

$35.273

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DigiPath Technology Company

USA . 2,023 parts In-Stock

1+ parts

$35.273

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2,023

$35.273

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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Corphita

USA . 4,599 parts In-Stock

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4,599

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S.R.D Solutions

India . 1,000 parts In-Stock

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1,000

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Kepictronics

USA . 296 parts In-Stock

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296

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Parana Technologies

USA . 77 parts In-Stock

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$22.428

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77

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$22.428

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Overview

Enhance the performance of your power management systems with the L99PM72PXPTR by STMicroelectronics. Crafted with precision and expertise, this Power Management IC offers unparalleled quality and reliability. Ideal for a variety of applications, this product ensures seamless power distribution while maximizing efficiency. With a compact design and advanced features, the L99PM72PXPTR provides exceptional value to customers, delivering superior benefits and advantages for your power management needs. Trust STMicroelectronics to elevate your power management solutions to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is known for its durability and resistance to heat, making it a reliable choice for power management ICs.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into circuit boards, saving space and simplifying assembly.

Package Shape: RECTANGULAR

Rectangular shape is commonly used for power management ICs as it provides a good balance between space efficiency and ease of handling.

Power Supplies (V): 4.5/28

Supporting a wide range of power supplies allows for versatility in different electronic applications.

No. of Terminals: 36

Having a high number of terminals enables connectivity to multiple external components, increasing the versatility of the IC.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch package style further enhances space efficiency and allows for high-density mounting on PCBs.

Terminal Position: DUAL

Dual terminal position provides redundancy and facilitates proper connection for reliable operation.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Being specifically designed for power supply management, this IC offers advanced features and optimized performance in regulating power.

Maximum Supply Current (Isup): 12 mA

Capable of handling a maximum supply current of 12 mA, ensuring stable operation even under high power demands.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and good solder joint reliability, important for robust connections in power applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm allows for high-density mounting and precise connection in compact electronic designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the IC can withstand moderate exposure to moisture during manufacturing and assembly processes.

Technical Specifications

Power Management ICs L99PM72PXPTR attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G36

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

36

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.4,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

12 mA

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

L99PM72PXPTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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