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L99PM60S

STMicroelectronics

L99PM60S by STMicroelectronics

L99PM60S by STMicroelectronics is a versatile power management IC in a compact 16-terminal SO package. It features adjustable thresholds, surface mount capability, and dual terminal positioning. Ideal for automotive applications, it ensures efficient power supply management.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,870 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,870

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Vyrian

USA . 2,886 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,886

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Anansix

USA . 1,906 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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1,906

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 771 parts In-Stock

1+ parts

$11.484

100+ parts

-

1k+ parts

$10.336

10k+ parts

-

771

$11.484

-

$10.336

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MKK Technologies

India . 776 parts In-Stock

1+ parts

$21.596

100+ parts

-

1k+ parts

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10k+ parts

-

776

$21.596

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-

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DigiPath Technology Company

USA . 776 parts In-Stock

1+ parts

$21.596

100+ parts

-

1k+ parts

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10k+ parts

-

776

$21.596

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-

-

Corphita

USA . 3,079 parts In-Stock

1+ parts

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3,079

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Parana Technologies

USA . 1,002 parts In-Stock

1+ parts

-

100+ parts

$13.731

1k+ parts

-

10k+ parts

-

1,002

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$13.731

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Overview

Elevate your designs with the L99PM60S from STMicroelectronics—a leading name in innovation and quality. This Power Management IC delivers exceptional efficiency and reliability, ensuring optimal performance across a variety of applications. Its compact design and adjustable threshold provide versatility, making it ideal for automotive, industrial, and consumer electronics. Trust in STMicroelectronics to power your success with cutting-edge solutions that meet today’s demands.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy offers excellent protection against environmental factors and provides durability, making this IC suitable for various applications.

Surface Mount: YES

Surface mount technology (SMT) allows for compact design and high density on PCBs, which is ideal for modern electronic devices where space is a premium.

Package Shape: RECTANGULAR

A rectangular package shape optimizes PCB space and ensures easier integration into different layouts, providing versatility in design.

No. of Terminals: 16

With 16 terminals, this IC offers sufficient connectivity for a range of control and power management functions, making it versatile for various applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables the integration of the IC into compact device layouts, helping manufacturers save space without sacrificing performance.

Terminal Position: DUAL

Dual terminal positioning allows for greater flexibility in PCB design and layout, helping to minimize routing complexity and optimize space.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

As a power supply management circuit, this IC is essential for efficient energy regulation and management in electronic devices, ensuring reliable operation.

Terminal Form: GULL WING

Gull wing terminals facilitate a simple soldering process and enhance reliability in connections, making assembly easier for manufacturers.

Adjustable Threshold: YES

The adjustable threshold feature allows designers to customize voltage levels according to specific application requirements, providing a tailored solution for diverse needs.

Technical Specifications

Power Management ICs L99PM60S attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G16

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Trade Compliance

L99PM60S Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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