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L99PM60J

STMicroelectronics

L99PM60J by STMicroelectronics

L99PM60J by STMicroelectronics is a versatile power management IC with a supply voltage range of 4.5-28V and a max supply current of 12mA. It features a compact rectangular package with 16 terminals and adjustable thresholds for efficient power control. Ideal for automotive applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,859 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,859

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-

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Vyrian

USA . 1,159 parts In-Stock

1+ parts

-

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-

1k+ parts

-

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1,159

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-

-

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Anansix

USA . 619 parts In-Stock

1+ parts

-

100+ parts

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619

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,172 parts In-Stock

1+ parts

$1.777

100+ parts

-

1k+ parts

$1.600

10k+ parts

-

2,172

$1.777

-

$1.600

-

MKK Technologies

India . 1,829 parts In-Stock

1+ parts

$3.342

100+ parts

-

1k+ parts

-

10k+ parts

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1,829

$3.342

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-

-

DigiPath Technology Company

USA . 1,829 parts In-Stock

1+ parts

$3.342

100+ parts

-

1k+ parts

-

10k+ parts

-

1,829

$3.342

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-

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Corphita

USA . 1,871 parts In-Stock

1+ parts

-

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1,871

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Parana Technologies

USA . 579 parts In-Stock

1+ parts

-

100+ parts

$2.125

1k+ parts

-

10k+ parts

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579

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$2.125

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Overview

Unlock the full potential of your designs with the L99PM60J from STMicroelectronics—a leader in innovative power management solutions. This versatile IC enhances efficiency and reliability in a compact, surface-mount package, making it ideal for automotive, industrial, and consumer applications. With adjustable thresholds and a robust operating range, you can expect superior performance and durability. Trust in STMicroelectronics to deliver quality that drives your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various environmental conditions.

Surface Mount: YES

Surface mount technology allows for efficient space utilization on circuit boards, enabling compact designs.

Package Shape: RECTANGULAR

The rectangular package shape optimizes layout flexibility on PCBs and enhances thermal performance.

Power Supplies (V): 4.5/28

A broad input voltage range (4.5V to 28V) makes this IC versatile for various applications.

No. of Terminals: 16

The 16 terminals provide ample connectivity options for diverse circuit implementations.

Package Style (Meter): SMALL OUTLINE

Small outline packaging contributes to reduced space requirements in design and improved assembly efficiency.

Terminal Finish: Matte Tin (Sn)

Matte tin terminal finish enhances solderability and ensures reliable connections.

Terminal Position: DUAL

Dual terminal positioning improves layout flexibility and allows for easier routing on PCBs.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Designed specifically for power supply management, this IC is optimized for use in power applications.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds ensures that components can withstand soldering processes without damage.

Peak Reflow Temperature °C: 260

A reflow temperature of 260 °C signifies robustness, capable of enduring high-temperature soldering methods.

Maximum Supply Current (Isup): 12 mA

With a maximum supply current of 12 mA, this IC remains energy-efficient while delivering reliable performance.

Terminal Form: GULL WING

Gull wing terminals enhance solder joint reliability and ease of inspection post-assembly.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch is suitable for high-density designs, facilitating compact layouts.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates a moderate level of moisture sensitivity, suitable for standard handling processes.

Adjustable Threshold: YES

The adjustable threshold feature allows for greater flexibility in design, catering to various application requirements.

Technical Specifications

Power Management ICs L99PM60J attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SSOP16,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

12 mA

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

L99PM60J Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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