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L99PM62XP

STMicroelectronics

L99PM62XP by STMicroelectronics

L99PM62XP by STMicroelectronics is a versatile power management IC designed for automotive applications, featuring a nominal voltage of 13.5V and operating temperature range from -40 °C to 150 °C. It supports up to 4 channels with a max supply current of 12mA. This compact device comes in a small outline package, ideal for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,233 parts In-Stock

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6,233

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Anansix

USA . 2,857 parts In-Stock

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2,857

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Digiode

USA . 1,321 parts In-Stock

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1,321

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Distributors (Availability)

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Component Stockers USA

USA . 844 parts In-Stock

1+ parts

$2.920

100+ parts

$2.770

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-

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844

$2.920

$2.770

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IDEA Electronic Components Group

UK . 868 parts In-Stock

1+ parts

$5.820

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-

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$5.238

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868

$5.820

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$5.238

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Microchip USA

USA . 1,437 parts In-Stock

1+ parts

$7.866

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1,437

$7.866

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MKK Technologies

India . 2,127 parts In-Stock

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$10.944

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2,127

$10.944

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DigiPath Technology Company

USA . 2,127 parts In-Stock

1+ parts

$10.944

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2,127

$10.944

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AZTECH Wire

Italy . 38 parts In-Stock

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$11.270

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38

$11.270

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Kepictronics

USA . 5,800 parts In-Stock

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5,800

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A-Z Elektronik GmbH

Germany . 4,938 parts In-Stock

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4,938

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Corphita

USA . 4,092 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,292 parts In-Stock

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Vigor

Singapore . 2,214 parts In-Stock

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Parana Technologies

USA . 1,357 parts In-Stock

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$6.959

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$6.959

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Overview

Elevate your power management solutions with the L99PM62XP from STMicroelectronics, a trusted leader in semiconductor innovation. This robust IC delivers exceptional performance across diverse applications, from automotive to industrial systems. Its high temperature resilience and compact design ensure reliable operation even in the most challenging environments. Experience unmatched efficiency, reliability, and versatility that empower your projects for success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides excellent insulation properties and durability, making it suitable for a wide range of applications.

Surface Mount: YES

Being surface mount compatible allows for automated assembly processes, reducing manufacturing costs and improving efficiency.

Package Shape: RECTANGULAR

A rectangular package shape provides efficient space utilization on PCBs, making it ideal for compact designs.

Nominal Supply Voltage (Vsup): 13.5 V

The nominal supply voltage allows compatibility with various standard power supply systems, ensuring stable operation.

Power Supplies (V): 4.5/28

The wide range of supported power supply voltages increases the versatility of this IC for different applications.

No. of Terminals: 36

A higher number of terminals provides flexibility in circuit design, enabling connections to multiple components or functions.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline package style with shrink pitch is suited for minimizing board space while maintaining high functionality.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this IC can function effectively in demanding environments, making it suitable for automotive applications.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures ensures reliability in harsh conditions, which is essential for automotive and industrial applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good solderability and corrosion resistance, ensuring long-term reliability of connections.

Terminal Position: DUAL

Dual terminal positioning enhances layout flexibility and simplifies PCB design, allowing for optimized circuit configurations.

Maximum Seated Height: 2.45 mm

A low seated height is beneficial for height-constrained designs, especially in compact devices.

Width: 7.5 mm

A compact width helps in fitting the IC into space-limited designs without sacrificing performance.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

As a power supply management circuit, it is designed to optimize power usage, enhancing energy efficiency in the overall system.

Minimum Supply Voltage (Vsup): 6 V

The minimum supply voltage allows the IC to be used in low-power applications, thus broadening its applicability.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time offers flexibility in manufacturing processes, accommodating various soldering techniques.

Peak Reflow Temperature (°C): 260

The high peak reflow temperature ensures compatibility with lead-free soldering processes, aligning with industry standards.

Length: 10.3 mm

The length is optimized for a variety of designs, allowing integration with standard PCB layouts.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature classification ensures reliability and performance in the automotive environment, which experiences extreme temperature variations.

Maximum Supply Current (Isup): 12 mA

A maximum supply current of 12 mA supports a variety of applications while minimizing power consumption.

No. of Channels: 4

With four channels, this IC can manage multiple power supply outputs simultaneously, enhancing functionality in complex systems.

Terminal Form: GULL WING

The gull wing terminal form provides advantageous soldering properties, ensuring reliable connections on PCB.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for a denser layout, enabling more compact designs and efficient use of board space.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates that the device can withstand a moderate level of moisture exposure, enhancing its reliability during handling and assembly.

Maximum Supply Voltage (Vsup): 18 V

The capability to handle a maximum supply voltage of 18 V accommodates higher voltage applications, increasing the versatility of use.

Technical Specifications

Power Management ICs L99PM62XP attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.4,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Maximum Seated Height:

2.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

12 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

13.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

L99PM62XP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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