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L99PM60JTR

STMicroelectronics

L99PM60JTR by STMicroelectronics

L99PM60JTR by STMicroelectronics is a versatile power management IC with a supply voltage range of 4.5-28V and a max supply current of 12mA. It features a compact 16-terminal gull-wing package, ideal for space-constrained applications. Its adjustable threshold enhances flexibility in various electronic designs.

Median Price

$2.950

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,417 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,417

-

-

-

-

Digiode

USA . 3,362 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,362

-

-

-

-

Component Sense

UK . 1,769 parts In-Stock

1+ parts

-

100+ parts

$2.950

1k+ parts

$2.000

10k+ parts

$2.000

1,769

-

$2.950

$2.000

$2.000

Anansix

USA . 186 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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186

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,500 parts In-Stock

1+ parts

$1.690

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

$1.690

-

-

-

Microchip USA

USA . 4,487 parts In-Stock

1+ parts

$11.420

100+ parts

-

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-

10k+ parts

-

4,487

$11.420

-

-

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AZTECH Wire

Italy . 490 parts In-Stock

1+ parts

$20.570

100+ parts

-

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-

490

$20.570

-

-

-

IDEA Electronic Components Group

UK . 1 parts In-Stock

1+ parts

$22.854

100+ parts

-

1k+ parts

$20.568

10k+ parts

-

1

$22.854

-

$20.568

-

MKK Technologies

India . 2,290 parts In-Stock

1+ parts

$42.975

100+ parts

-

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-

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2,290

$42.975

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-

-

DigiPath Technology Company

USA . 2,290 parts In-Stock

1+ parts

$42.975

100+ parts

-

1k+ parts

-

10k+ parts

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2,290

$42.975

-

-

-

Corphita

USA . 4,372 parts In-Stock

1+ parts

-

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4,372

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-

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Parana Technologies

USA . 2,310 parts In-Stock

1+ parts

-

100+ parts

$27.325

1k+ parts

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10k+ parts

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2,310

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$27.325

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Overview

Unlock unparalleled efficiency with the L99PM60JTR from STMicroelectronics, a leader in innovative power management solutions. This sleek and reliable IC is designed for diverse applications, ensuring precision control and energy savings across your projects. With its robust design and superior performance, it guarantees long-lasting reliability, empowering you to elevate your designs while minimizing costs. Choose L99PM60JTR for quality you can trust and benefits that drive success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials ensures protection against environmental factors and enhances reliability.

Surface Mount: YES

Surface mount technology allows for compact design and efficient utilization of PCB space, making it suitable for modern applications.

Package Shape: RECTANGULAR

The rectangular shape provides versatility in mounting options and ensures optimal layout for better circuit performance.

Power Supplies (V): 4.5/28

Wide operating voltage range (4.5V to 28V) makes it adaptable for various applications, enhancing its usability.

No. of Terminals: 16

Having 16 terminals allows for complex functionalities and integration with multiple components, supporting advanced designs.

Package Style (Meter): SMALL OUTLINE

Small outline package style reduces footprint and is ideal for space-constrained designs, such as portable devices.

Terminal Finish: Matte Tin (Sn)

Matte tin finish enhances solderability and prevents corrosion, ensuring longevity and durability in connections.

Terminal Position: DUAL

Dual terminal positioning facilitates easier layout design and improved thermal management.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

This IC specializes in power supply management, making it perfect for applications requiring efficient power regulation.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum time at peak reflow of 30 seconds allows for efficient soldering processes without damaging the components.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures compatibility with high-temperature soldering processes, promoting reliability.

Maximum Supply Current (Isup): 12 mA

A maximum supply current of 12 mA is power-efficient and well-suited for low-power applications.

Terminal Form: GULL WING

Gull wing terminal form enhances stability and solder joint strength, reducing the probability of mechanical failure.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for denser layouts, making it easier to design compact circuits.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates reasonable handling precautions, catering to applications in moderately humid environments.

Adjustable Threshold: YES

The adjustable threshold feature provides flexibility for setting specific operational parameters, enhancing device customization.

Technical Specifications

Power Management ICs L99PM60JTR attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SSOP16,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

12 mA

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

L99PM60JTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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