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L99PM62XPTR

STMicroelectronics

L99PM62XPTR by STMicroelectronics

L99PM62XPTR by STMicroelectronics is a versatile power management IC designed for automotive applications, featuring a nominal voltage of 13.5V and operating temperature range from -40 °C to 150 °C. It supports up to 4 channels with a max supply current of 12mA. This compact device comes in a small outline package, ensuring efficient space utilization in electronic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,877 parts In-Stock

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Digiode

USA . 4,897 parts In-Stock

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4,897

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Anansix

USA . 2,109 parts In-Stock

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R&J Components

USA . 340 parts In-Stock

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340

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IDEA Electronic Components Group

UK . 604 parts In-Stock

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$4.691

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$4.222

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604

$4.691

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$4.222

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MKK Technologies

India . 1,536 parts In-Stock

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$8.821

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$8.821

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DigiPath Technology Company

USA . 1,536 parts In-Stock

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$8.821

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$8.821

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Microchip USA

USA . 2,101 parts In-Stock

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$10.902

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$10.902

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AZTECH Wire

Italy . 310 parts In-Stock

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$20.060

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310

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Vigor

Singapore . 1,064 parts In-Stock

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Kepictronics

USA . 588 parts In-Stock

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Corphita

USA . 462 parts In-Stock

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Parana Technologies

USA . 162 parts In-Stock

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$5.609

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Overview

Unlock the power of innovation with the L99PM62XPTR from STMicroelectronics! This exceptional Power Management IC is designed for demanding automotive applications, ensuring reliability and efficiency in every drive. With a robust temperature range and efficient dual-channel design, it guarantees optimal performance under pressure. Trust in STMicroelectronics' legacy of excellence to enhance your systems—with this powerful component, elevate your projects and enjoy peace of mind on the road ahead!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and robustness, making it suitable for various applications.

Surface Mount: YES

Supports surface mount technology, allowing for high-density PCB designs and easier manufacturing processes.

Package Shape: RECTANGULAR

Rectangular shape facilitates efficient use of PCB space and simplifies layout designs.

Nominal Supply Voltage: 13.5 V

Operating at a nominal voltage of 13.5V provides flexibility in various power applications.

Power Supplies: 4.5/28 V

Wide range of power supply options (4.5V to 28V) enhances versatility for different use cases.

No. of Terminals: 36

With 36 terminals, this IC offers ample connectivity for complex circuitry.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch design optimize board space and improve performance.

Maximum Operating Temperature: 150 °C

Able to withstand high temperatures, making it reliable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

Operating down to -40 °C ensures functionality in harsh environmental conditions.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good solderability and corrosion resistance.

Terminal Position: DUAL

Dual terminal positioning enhances design flexibility and ease of connectivity.

Maximum Seated Height: 2.45 mm

Low seated height ensures compact designs and reduces overall profile of the PCB.

Width: 7.5 mm

Narrow width allows for dense layout options while maintaining performance.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Designed specifically for power management, making it ideal for energy-efficient applications.

Minimum Supply Voltage: 6 V

Minimum voltage of 6V allows for compatibility with a wide range of power systems.

Maximum Time At Peak Reflow Temperature: 30 s

The specified reflow time ensures robust solder connections during assembly.

Peak Reflow Temperature: 260 °C

High peak reflow temperatures enable compatibility with lead-free soldering processes.

Length: 10.3 mm

Compact length supports high-density designs and efficient PCB layouts.

Temperature Grade: AUTOMOTIVE

Automotive grade rating guarantees reliability and performance in automotive environments.

Maximum Supply Current: 12 mA

Low maximum supply current enhances energy efficiency in power management applications.

No. of Channels: 4

Four channels provide versatile power distribution options for multiple components.

Terminal Form: GULL WING

The gull wing terminal design improves thermal dissipation and mechanical strength.

Terminal Pitch: 0.5 mm

Small terminal pitch allows for higher terminal density, supporting smaller PCBs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates reasonable handling precautions are needed, ensuring product reliability.

Maximum Supply Voltage: 18 V

High maximum supply voltage capability enhances flexibility in various power management applications.

Technical Specifications

Power Management ICs L99PM62XPTR attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.4,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Maximum Seated Height:

2.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

12 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

13.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

L99PM62XPTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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