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L6743D

STMicroelectronics

L6743D by STMicroelectronics

L6743D by STMicroelectronics is a high-side MOSFET gate driver with a max supply voltage of 13.8V and operates b/w 10.5V to 12V. It features fast turn-on (0.075µs) and turn-off (0.045µs) times, making it ideal for efficient power management in compact applications. Its small outline package ensures easy surface mounting in space-constrained designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,266 parts In-Stock

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6,266

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Digiode

USA . 1,956 parts In-Stock

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1,956

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Anansix

USA . 1,006 parts In-Stock

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1,006

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LWI Electronics Inc

India . 50 parts In-Stock

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 413 parts In-Stock

1+ parts

$7.332

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413

$7.332

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IDEA Electronic Components Group

UK . 1,607 parts In-Stock

1+ parts

$8.424

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-

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$7.581

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1,607

$8.424

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$7.581

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AZTECH Wire

Italy . 312 parts In-Stock

1+ parts

$12.720

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312

$12.720

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MKK Technologies

India . 1,043 parts In-Stock

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$15.840

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1,043

$15.840

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DigiPath Technology Company

USA . 1,043 parts In-Stock

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$15.840

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1,043

$15.840

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Component Stockers USA

USA . 641 parts In-Stock

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$99.990

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641

$99.990

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A-Z Elektronik GmbH

Germany . 7,223 parts In-Stock

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7,223

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Alle Elektronik GmbH

Germany . 4,815 parts In-Stock

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4,815

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Vigor

Singapore . 4,500 parts In-Stock

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4,500

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Corphita

USA . 2,946 parts In-Stock

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Kepictronics

USA . 1,382 parts In-Stock

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Assy Fe

Spain . 1,382 parts In-Stock

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Parana Technologies

USA . 109 parts In-Stock

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$10.072

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109

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$10.072

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Overview

Unleash the power of precision with the L6743D MOSFET Gate Driver from STMicroelectronics! Crafted for reliability and efficiency, this compact solution excels in diverse applications, from automotive to industrial sectors. Experience rapid response times and robust performance, ensuring your designs achieve optimal functionality. Trust in STMicroelectronics' legacy of innovation and quality to elevate your projects and drive success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy gives a balanced performance in durability and thermal characteristics, making the driver reliable in various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easy integration into various PCB layouts, enhancing versatility.

Maximum Supply Voltage: 13.8 V

A higher maximum supply voltage ensures compatibility with a wide range of applications, allowing for robust performance.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on PCBs and is a common form factor for many electronic designs.

Power Supplies (V): 12

Operating at 12V is standard for many applications, ensuring easy integration with common power sources.

No. of Terminals: 8

The 8-terminal configuration offers flexibility in connections, making it suitable for various circuit designs.

Package Style (Meter): SMALL OUTLINE

A small outline package reduces footprint on the PCB, making it ideal for space-constrained applications.

Minimum Supply Voltage: 10.5 V

The capability to operate at lower voltages ensures reliable performance even with minor power supply variations.

Maximum Operating Temperature: 70 °C

The high operating temperature threshold makes this driver suitable for environments where heat management is crucial.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, the driver can function in a wide range of environments, increasing its application range.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium-gold finish ensures excellent conductivity and resistance to corrosion, enhancing the reliability of the connections.

Terminal Position: DUAL

Dual terminal positioning improves layout flexibility and ease of routing in PCB designs.

Maximum Seated Height: 1.75 mm

Low seated height helps in achieving a low-profile design, which is beneficial for compact electronic devices.

Width: 3.9 mm

The compact width allows for efficient use of PCB space, making it suitable for densely populated boards.

High Side Driver: YES

As a high-side driver, it can directly control loads connected to the positive side of the supply, simplifying circuit design.

Peak Reflow Temperature °C: 260

The ability to withstand high reflow temperatures is essential for reliable soldering during PCB assembly.

Length: 4.9 mm

The compact length supports miniaturization of circuits, making it ideal for space-sensitive applications.

Temperature Grade: COMMERCIAL

Being rated for commercial applications indicates reliable performance under standard operating conditions.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve mechanical stability in the assembly process.

Nominal Supply Voltage: 12 V

The nominal supply voltage aligns with typical industrial standards, ensuring compatibility with existing systems.

Turn-on Time: 0.075 us

A fast turn-on time enhances switching efficiency, making it ideal for high-speed applications.

Terminal Pitch: 1.27 mm

The 1.27 mm pitch allows for reliable connections in compact designs, ensuring stability and performance.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates that the component is capable of enduring a moderate level of moisture, facilitating reliable handling and storage.

Interface IC Type: BUFFER OR INVERTER BASED MOSFET DRIVER

Being a buffer or inverter based driver enhances versatility in circuit design, allowing for a variety of applications.

Turn-off Time: 0.045 us

A fast turn-off time aids in reducing switching losses, which is crucial for improving overall system efficiency.

Technical Specifications

MOSFET Gate Drivers L6743D attributes and parameters. Explore more MOSFET Gate Drivers devices from STMicroelectronics

Specs

High Side Driver:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Voltage:

13.8 V

Minimum Supply Voltage:

10.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

.045 us

Turn-on Time:

.075 us

Width:

3.9 mm

Trade Compliance

L6743D Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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