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L6743DTR

STMicroelectronics

L6743DTR by STMicroelectronics

L6743DTR by STMicroelectronics is a high-side MOSFET gate driver with a max supply voltage of 13.8V and operates b/w 10.5V to 12V. It features fast turn-on (0.075µs) and turn-off (0.045µs) times, making it ideal for efficient power management in compact applications. Its small outline package ensures easy surface mounting in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,826 parts In-Stock

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8,826

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Digiode

USA . 4,629 parts In-Stock

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4,629

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Anansix

USA . 1,730 parts In-Stock

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1,730

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LWI Electronics Inc

India . 28 parts In-Stock

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28

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Distributors (Availability)

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Vigor

Singapore . 6,483 parts In-Stock

1+ parts

$0.840

100+ parts

-

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6,483

$0.840

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AZTECH Wire

Italy . 355 parts In-Stock

1+ parts

$8.620

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-

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355

$8.620

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IDEA Electronic Components Group

UK . 537 parts In-Stock

1+ parts

$11.623

100+ parts

-

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$10.461

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537

$11.623

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$10.461

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MKK Technologies

India . 921 parts In-Stock

1+ parts

$21.857

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-

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921

$21.857

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DigiPath Technology Company

USA . 921 parts In-Stock

1+ parts

$21.857

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921

$21.857

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QUARKTWIN TECHNOLOGY LTD

USA . 20,171 parts In-Stock

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Perfect Parts

USA . 15,154 parts In-Stock

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Microchip USA

USA . 5,340 parts In-Stock

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5,340

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A-Z Elektronik GmbH

Germany . 5,138 parts In-Stock

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5,138

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 4,156 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,425 parts In-Stock

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3,425

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Metaverse IC Inc.

Canada . 2,310 parts In-Stock

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Kepictronics

USA . 2,035 parts In-Stock

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2,035

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Parana Technologies

USA . 1,040 parts In-Stock

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$13.897

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1,040

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$13.897

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GreenTree Electronics

Israel . 500 parts In-Stock

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500

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ChipstoGo Electronic ltd

UK . 239 parts In-Stock

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239

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Overview

Elevate your designs with the L6743DTR from STMicroelectronics, a standout in MOSFET gate drivers. Renowned for quality and innovation, STMicroelectronics ensures this driver delivers exceptional performance across various applications, from automotive to industrial control. With rapid turn-on/off times and superb thermal management, the L6743DTR optimizes efficiency and reliability, empowering your projects to achieve their full potential while simplifying integration into your systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material contributes to a lightweight design, enhancing thermal management and overall durability.

Surface Mount: YES

Being surface mount allows for a compact layout, facilitating efficient use of space on printed circuit boards.

Maximum Supply Voltage: 13.8 V

A maximum supply voltage of 13.8 V provides flexibility for various applications without compromising performance.

Package Shape: RECTANGULAR

The rectangular shape is conducive to efficient board layouts, making it easier to design and implement in various electronic circuits.

Power Supplies (V): 12

Designed for a nominal supply voltage of 12 V, this driver is well-suited for standard automotive and industrial applications.

No. of Terminals: 8

With 8 terminals, this driver provides ample connectivity options, making it versatile for different wiring configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style optimizes board space while maintaining reliable connections, ideal for densely packed designs.

Minimum Supply Voltage: 10.5 V

A minimum supply voltage of 10.5 V ensures reliable operation in lower voltage scenarios, enhancing device flexibility.

Maximum Operating Temperature: 70 °C

Operating up to 70 °C indicates robustness, making it suitable for various applications operating in elevated temperatures.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this driver functions effectively in colder environments, ensuring reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish enhances solderability and guarantees longevity, reducing the risk of corrosion.

Terminal Position: DUAL

Dual terminal position design allows for easier layout and better routing on the PCB, enhancing overall design efficiency.

Maximum Seated Height: 1.75 mm

A maximum seated height of just 1.75 mm supports low-profile designs, making integration in compact devices easier.

Width: 3.9 mm

A narrow width of 3.9 mm enables the component to fit into tight spaces, promoting design versatility.

High Side Driver: YES

As a high-side driver, it allows for effective management of power loads, making it suitable for high-voltage applications.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures compatibility with standard soldering processes, enhancing manufacturing ease.

Length: 4.9 mm

The compact length of 4.9 mm offers further flexibility for fitting in confined layouts in electronic devices.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates suitability for products used in typical ambient conditions, enhancing accessibility.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength and support reliable soldering, ensuring long-term product integrity.

Nominal Supply Voltage: 12 V

A nominal supply voltage of 12 V aligns with common industry standards, making it preferable for many applications.

Turn-on Time: 0.075 us

A quick turn-on time of 0.075 µs ensures rapid switching performance, improving overall circuit efficiency and responsiveness.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for a compact arrangement, optimizing layout for high-density PCB designs.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the product demonstrates robustness in typical handling and operations.

Interface IC Type: BUFFER OR INVERTER BASED MOSFET DRIVER

This driver type enhances logical interfacing capabilities, making it versatile for various logic-level applications.

Turn-off Time: 0.045 us

A turn-off time of 0.045 µs further amplifies fast switching, critical for high-speed applications, ensuring dynamic performance.

Technical Specifications

MOSFET Gate Drivers L6743DTR attributes and parameters. Explore more MOSFET Gate Drivers devices from STMicroelectronics

Specs

High Side Driver:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Voltage:

13.8 V

Minimum Supply Voltage:

10.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

.045 us

Turn-on Time:

.075 us

Width:

3.9 mm

Trade Compliance

L6743DTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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