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L6370Q

STMicroelectronics

L6370Q by STMicroelectronics

L6370Q by STMicroelectronics is a 48-terminal peripheral driver with a max output current of 2.5A and nominal voltage of 24V. It operates b/w -25 to 85°C, suitable for various applications requiring buffer or inverter-based interface ICs in a square chip carrier package style.

Median Price

$4.950

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 1,300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.950

10k+ parts

-

1,300

-

-

$4.950

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TME

Poland . 17 parts In-Stock

1+ parts

$1.350

100+ parts

-

1k+ parts

-

10k+ parts

-

17

$1.350

-

-

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Digiode

USA . 3,955 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,955

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-

-

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Vyrian

USA . 3,936 parts In-Stock

1+ parts

-

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3,936

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-

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IBS Electronics

USA . 1,300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.942

10k+ parts

-

1,300

-

-

$6.942

-

Anansix

USA . 945 parts In-Stock

1+ parts

-

100+ parts

-

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945

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-

-

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ComSIT Distribution GmbH

Germany . 780 parts In-Stock

1+ parts

-

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780

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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50

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 283 parts In-Stock

1+ parts

$3.880

100+ parts

-

1k+ parts

-

10k+ parts

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283

$3.880

-

-

-

Continental Prestige Electronics

USA . 1 parts In-Stock

1+ parts

$4.200

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$4.200

-

-

-

Ampacity Inc.

Singapore . 1,169 parts In-Stock

1+ parts

$4.210

100+ parts

-

1k+ parts

-

10k+ parts

-

1,169

$4.210

-

-

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Aztec Data Supply Inc.

USA . 3,891 parts In-Stock

1+ parts

$4.710

100+ parts

-

1k+ parts

-

10k+ parts

-

3,891

$4.710

-

-

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IDEA Electronic Components Group

UK . 2,087 parts In-Stock

1+ parts

$5.589

100+ parts

-

1k+ parts

$5.030

10k+ parts

-

2,087

$5.589

-

$5.030

-

Semicontronic

India . 1,217 parts In-Stock

1+ parts

$9.160

100+ parts

$8.931

1k+ parts

$8.885

10k+ parts

-

1,217

$9.160

$8.931

$8.885

-

MKK Technologies

India . 236 parts In-Stock

1+ parts

$10.510

100+ parts

-

1k+ parts

-

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236

$10.510

-

-

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DigiPath Technology Company

USA . 236 parts In-Stock

1+ parts

$10.510

100+ parts

-

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236

$10.510

-

-

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Microchip USA

USA . 413 parts In-Stock

1+ parts

$18.165

100+ parts

-

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10k+ parts

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413

$18.165

-

-

-

AZTECH Wire

Italy . 922 parts In-Stock

1+ parts

$20.510

100+ parts

-

1k+ parts

-

10k+ parts

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922

$20.510

-

-

-

A-Z Elektronik GmbH

Germany . 4,854 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,854

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-

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Argo Parts USA

USA . 4,822 parts In-Stock

1+ parts

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100+ parts

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4,822

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-

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Alle Elektronik GmbH

Germany . 3,236 parts In-Stock

1+ parts

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3,236

-

-

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Corphita

USA . 3,105 parts In-Stock

1+ parts

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100+ parts

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3,105

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-

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Parana Technologies

USA . 2,364 parts In-Stock

1+ parts

-

100+ parts

$6.682

1k+ parts

-

10k+ parts

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2,364

-

$6.682

-

-

Bastille Electronics

Australia . 450 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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450

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Overview

Enhance the performance of your electronic devices with the L6370Q by STMicroelectronics. Crafted with precision and expertise, this peripheral driver offers unparalleled quality and reliability that only a trusted manufacturer like STMicroelectronics can provide. Ideal for a wide range of applications, this product boasts a superior power supply, high output current, and cutting-edge BCDMOS technology. Experience seamless operation and enhanced functionality with the L6370Q, designed to deliver exceptional value and unmatched benefits to customers seeking top-notch performance in their electronic systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection for the internal components, making the product a reliable choice.

Surface Mount: YES

The surface mount capability allows for easy installation and connection, enhancing the efficiency of the product.

Package Shape: SQUARE

The square shape of the package provides a compact design, saving space and making it suitable for tight installations.

Power Supplies (V): 24

With a standard power supply of 24V, this product is compatible with a wide range of systems and applications.

No. of Terminals: 48

The high number of terminals allows for versatile connectivity options, making it suitable for complex setups.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers a secure and efficient way to house the internal components, ensuring reliability.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the product can withstand harsh environmental conditions, increasing its longevity.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature allows the product to function effectively in cold environments, increasing its versatility.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides corrosion resistance and reliable contact, ensuring the product maintains optimal performance.

Terminal Position: QUAD

The quad terminal position allows for secure connections and efficient signal transmission, making the product a dependable choice.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature ensures proper soldering and secure connections during installation, enhancing the product's reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability allows for proper soldering and durability, ensuring the product can withstand high temperatures.

Maximum Output Current: 2.5 A

The high maximum output current capacity makes the product suitable for powering various devices and components, enhancing its versatility.

Technology: BCDMOS

The BCDMOS technology offers efficient power management and signal processing capabilities, making the product a high-performance choice.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of contamination and enhances the product's reliability, making it a safe choice.

Nominal Supply Voltage: 24 V

The nominal supply voltage of 24V ensures compatibility with standard power sources, making the product easy to integrate into existing systems.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for compact design and efficient signal transmission, making the product suitable for space-constrained applications.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates the product can withstand moderate levels of moisture exposure, ensuring reliability in various environmental conditions.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The interface IC type offers versatile signal processing options, making the product suitable for a wide range of applications and systems.

Technical Specifications

Peripheral Drivers L6370Q attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Driver No. of Bits:

1

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Maximum Output Current:

2.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

24

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Nominal Supply Voltage:

24 V

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

L6370Q Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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