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L6370QTR

STMicroelectronics

L6370QTR by STMicroelectronics

L6370QTR by STMicroelectronics is a 48-terminal peripheral driver with a max output current of 2.5A and nominal voltage of 24V. It operates b/w -25 to 85°C, suitable for various applications requiring buffer or inverter-based interface ICs in a square chip carrier package style.

Median Price

$3.780

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 910 parts In-Stock

1+ parts

$2.781

100+ parts

-

1k+ parts

-

10k+ parts

-

910

$2.781

-

-

-

Chip1Stop

Japan . 910 parts In-Stock

1+ parts

$3.780

100+ parts

-

1k+ parts

-

10k+ parts

-

910

$3.780

-

-

-

Mouser Electronics

USA . 2,295 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$3.910

2,295

-

-

-

$3.910

Verical

USA . 910 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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910

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,842 parts In-Stock

1+ parts

$2.603

100+ parts

-

1k+ parts

-

10k+ parts

-

2,842

$2.603

-

-

-

Anansix

USA . 1,711 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,711

-

-

-

-

Vyrian

USA . 1,307 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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1,307

-

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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100

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,239 parts In-Stock

1+ parts

$2.330

100+ parts

$2.272

1k+ parts

$2.260

10k+ parts

-

1,239

$2.330

$2.272

$2.260

-

Ampacity Inc.

Singapore . 1,172 parts In-Stock

1+ parts

$2.330

100+ parts

-

1k+ parts

-

10k+ parts

-

1,172

$2.330

-

-

-

Corphita

USA . 264 parts In-Stock

1+ parts

$2.466

100+ parts

-

1k+ parts

-

10k+ parts

-

264

$2.466

-

-

-

IDEA Electronic Components Group

UK . 1,495 parts In-Stock

1+ parts

$2.531

100+ parts

-

1k+ parts

$2.278

10k+ parts

-

1,495

$2.531

-

$2.278

-

Corohmni

South Africa . 880 parts In-Stock

1+ parts

$3.500

100+ parts

-

1k+ parts

-

10k+ parts

-

880

$3.500

-

-

-

MKK Technologies

India . 469 parts In-Stock

1+ parts

$4.759

100+ parts

-

1k+ parts

-

10k+ parts

-

469

$4.759

-

-

-

DigiPath Technology Company

USA . 469 parts In-Stock

1+ parts

$4.759

100+ parts

-

1k+ parts

-

10k+ parts

-

469

$4.759

-

-

-

Aztec Data Supply Inc.

USA . 4,731 parts In-Stock

1+ parts

$14.420

100+ parts

-

1k+ parts

-

10k+ parts

-

4,731

$14.420

-

-

-

Microchip USA

USA . 456 parts In-Stock

1+ parts

$18.170

100+ parts

$18.170

1k+ parts

$18.170

10k+ parts

$18.170

456

$18.170

$18.170

$18.170

$18.170

Authorized Procurement Solutions

USA . 30,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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30,000

-

-

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Lixinc

USA . 18,829 parts In-Stock

1+ parts

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18,829

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Kepictronics

USA . 8,120 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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8,120

-

-

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Continental Prestige Electronics

USA . 4,297 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,297

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-

-

-

Parana Technologies

USA . 1,339 parts In-Stock

1+ parts

-

100+ parts

$3.026

1k+ parts

-

10k+ parts

-

1,339

-

$3.026

-

-

Argo Parts USA

USA . 409 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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409

-

-

-

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Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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100

-

-

-

-

Overview

Unlock the potential of your electronic devices with the L6370QTR by STMicroelectronics. This high-quality peripheral driver offers unmatched reliability and performance, thanks to its cutting-edge BCDMOS technology and innovative design. Ideal for a wide range of applications, this chip carrier package provides a seamless interface for buffer or inverter based peripheral drivers. With a nominal supply voltage of 24V and a maximum output current of 2.5A, the L6370QTR delivers exceptional value and efficiency to customers looking to elevate their products to the next level. Trust STMicroelectronics to bring you the best in semiconductor solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and high reliability, making it a great choice for long-lasting use.

Surface Mount: YES

Allows for easy installation on circuit boards, making it convenient for integration into various systems.

Package Shape: SQUARE

The square shape provides a compact design, saving space and enabling efficient utilization of PCB real estate.

Power Supplies (V): 24

With a power supply of 24 volts, this peripheral driver can efficiently operate various devices within the specified voltage range.

No. of Terminals: 48

The abundance of terminals allows for versatile connectivity options, accommodating a wide range of applications.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers enhanced thermal and electrical performance, ensuring stable operation.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, making it suitable for use in demanding industrial environments.

Minimum Operating Temperature: -25 °C

Can also function in low-temperature conditions, providing reliability in extreme weather conditions.

Terminal Finish: MATTE TIN

The matte tin finish provides corrosion resistance, ensuring long-term reliability and performance.

Terminal Position: QUAD

The quad terminal position offers secure connection points, reducing the risk of signal loss or interference.

Maximum Time At Peak Reflow Temperature (s): 40

The short reflow time enables quick and efficient soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures, ensuring robust solder joints for reliable performance.

Maximum Output Current: 2.5 A

With a high maximum output current, this peripheral driver can drive power-hungry devices without overheating.

Technology: BCDMOS

Utilizing BCDMOS technology ensures efficient power management and high-speed operation for optimal performance.

Terminal Form: NO LEAD

The no lead terminal form simplifies the manufacturing process and reduces the environmental impact.

Nominal Supply Voltage: 24 V

The nominal supply voltage of 24 volts offers compatibility with a wide range of industrial equipment and systems.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for dense packing on PCBs, maximizing space utilization and enabling compact designs.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this peripheral driver can withstand moderate exposure to moisture without compromising performance.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This interface IC type provides flexibility in signal conditioning, making it suitable for diverse applications.

Technical Specifications

Peripheral Drivers L6370QTR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Driver No. of Bits:

1

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Maximum Output Current:

2.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

24

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Nominal Supply Voltage:

24 V

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

L6370QTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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