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L6370L

STMicroelectronics

L6370L by STMicroelectronics

L6370L by STMicroelectronics is a BCD technology peripheral driver with 11 terminals and built-in protections. It operates b/w -25 °C to 85°C, with a supply voltage range of 9.5V to 35V. Ideal for applications requiring a nominal output peak current limit of 3.2A, such as buffer or inverter-based interface ICs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,576 parts In-Stock

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6,576

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Anansix

USA . 2,642 parts In-Stock

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2,642

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Digiode

USA . 1,845 parts In-Stock

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1,845

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Kronex Distribution GmbH

USA . 14 parts In-Stock

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14

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,898 parts In-Stock

1+ parts

$5.005

100+ parts

-

1k+ parts

$4.504

10k+ parts

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1,898

$5.005

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$4.504

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Microchip USA

USA . 364 parts In-Stock

1+ parts

$8.435

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364

$8.435

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MKK Technologies

India . 1,151 parts In-Stock

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$9.411

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1,151

$9.411

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DigiPath Technology Company

USA . 1,151 parts In-Stock

1+ parts

$9.411

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1,151

$9.411

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AZTECH Wire

Italy . 1,001 parts In-Stock

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$18.150

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$18.150

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QUARKTWIN TECHNOLOGY LTD

USA . 12,666 parts In-Stock

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12,666

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Vigor

Singapore . 2,500 parts In-Stock

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2,500

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Corphita

USA . 1,469 parts In-Stock

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1,469

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Parana Technologies

USA . 705 parts In-Stock

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$5.984

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705

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$5.984

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Overview

Unlock the potential of your electronic devices with the L6370L by STMicroelectronics. With built-in protections against transient, over current, thermal, and under voltage issues, this peripheral driver ensures reliable performance and peace of mind. Perfect for a wide range of applications, this product offers a nominal output peak current limit of 3.2A and a maximum supply voltage of 35V, making it a versatile solution for your needs. Trust in the quality and innovation of STMicroelectronics to elevate your projects to new heights.

Feature Benefit Bullets

Maximum Supply Voltage: 35 V

This high maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and provides easy integration into various circuit designs.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

The built-in protections ensure the device is safeguarded against various potential risks, enhancing its reliability and longevity.

Power Supplies (V): 24

The 24V power supply provides sufficient power for the peripherals while maintaining efficiency and performance.

No. of Terminals: 11

Having 11 terminals allows for versatile connectivity options and compatibility with various systems and components.

Package Style (Meter): FLANGE MOUNT

The flange mount package style enables secure and stable mounting, enhancing the durability and longevity of the device.

Minimum Supply Voltage: 9.5 V

The low minimum supply voltage ensures compatibility with lower power systems while still providing reliable performance.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the device can withstand high temperatures, making it suitable for a range of operating environments.

Minimum Operating Temperature: -25 °C

The device can operate in cold temperatures down to -25 °C, making it versatile and suitable for a variety of environmental conditions.

Terminal Position: ZIG-ZAG

The zig-zag terminal position allows for efficient space utilization and easy routing of connections within the system.

Peak Reflow Temperature °C: 245

The high peak reflow temperature ensures robust soldering and reliability during assembly, reducing the risk of connection failure.

Technology: BCD

Using BCD technology offers enhanced performance, efficiency, and integration capabilities for the peripheral driver.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure and reliable connections, reducing the risk of disconnection or signal interference.

Nominal Supply Voltage: 24 V

The nominal supply voltage of 24V ensures stable and consistent power delivery to the peripherals, optimizing their performance.

Terminal Pitch: 1.7 mm

The 1.7mm terminal pitch enables compact and efficient circuit design, allowing for high-density mounting and space-saving.

Nominal Output Peak Current Limit: 3.2 A

With a peak current limit of 3.2A, the device can provide sufficient power to the connected peripherals while ensuring safe operation.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter-based interface IC type offers versatility in signal processing and compatibility with different types of peripherals.

Output Current Flow Direction: SOURCE

The output current direction being sourced ensures proper power delivery and compatibility with connected devices, enhancing overall system reliability.

Technical Specifications

Peripheral Drivers L6370L attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-XZFM-T11

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

11

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Output Current Flow Direction:

SOURCE

Nominal Output Peak Current Limit:

3.2 A

Package Body Material:

UNSPECIFIED

Package Equivalence Code:

SIP11,.1,67TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

245

Power Supplies (V):

24

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

35 V

Minimum Supply Voltage:

9.5 V

Nominal Supply Voltage:

24 V

Surface Mount:

NO

Technology:

BCD

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.7 mm

Terminal Position:

ZIG-ZAG

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

L6370L Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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