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L6375

STMicroelectronics

L6375 by STMicroelectronics

L6375 by STMicroelectronics is a robust peripheral driver with a max supply voltage of 35V and built-in protections against overcurrent, thermal issues, and undervoltage. It operates b/w -20 °C to 85°C, making it ideal for various applications. With an output current of 0.625A, it's perfect for buffer or inverter-based systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,283 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,283

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Digiode

USA . 3,487 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,487

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Anansix

USA . 2,801 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,801

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,646 parts In-Stock

1+ parts

$10.350

100+ parts

-

1k+ parts

$9.315

10k+ parts

-

1,646

$10.350

-

$9.315

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MKK Technologies

India . 2,244 parts In-Stock

1+ parts

$19.462

100+ parts

-

1k+ parts

-

10k+ parts

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2,244

$19.462

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DigiPath Technology Company

USA . 2,244 parts In-Stock

1+ parts

$19.462

100+ parts

-

1k+ parts

-

10k+ parts

-

2,244

$19.462

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-

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Corphita

USA . 4,742 parts In-Stock

1+ parts

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4,742

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Parana Technologies

USA . 1,050 parts In-Stock

1+ parts

-

100+ parts

$12.375

1k+ parts

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10k+ parts

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1,050

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$12.375

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Overview

Unlock the power of precision with the L6375 by STMicroelectronics, your go-to solution for robust peripheral driving. Engineered with top-tier quality and built-in protections against overcurrent and thermal issues, this reliable component ensures seamless performance in diverse applications. With its compact design and exceptional temperature resilience, it's perfect for enhancing efficiency in industrial and consumer electronic systems. Experience unparalleled reliability and innovation that keeps your projects ahead of the curve!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy helps ensure durability and resistance to environmental factors, making the product suitable for a variety of applications.

Maximum Supply Voltage: 35 V

A high maximum supply voltage allows for versatility in application settings, accommodating more demanding electrical conditions.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on PCBs (printed circuit boards), allowing for efficient layout designs.

Built-in Protections: OVER CURRENT; THERMAL; UNDER VOLTAGE

Multiple built-in protections enhance reliability, reducing the risk of failure and ensuring safe operation even in challenging conditions.

Power Supplies (V): 24

Designed to operate at a nominal 24V, this driver is ideal for a range of standard power supply systems.

No. of Terminals: 8

With 8 terminals, the device offers flexibility for various configurations and connections to meet different application needs.

Package Style (Meter): IN-LINE

The in-line package style is suitable for mass production and efficient assembly processes, leading to cost savings.

Minimum Supply Voltage: 8 V

A low minimum supply voltage expands the range of power sources compatible with this driver, enhancing its usability in different environments.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C ensures the driver can function in hotter environments, making it suitable for high-performance applications.

Minimum Operating Temperature: -20 °C

The ability to operate at -20 °C ensures reliability in colder climates or environments where temperatures can drop significantly.

Terminal Finish: MATTE TIN

Matte tin terminal finish enhances solderability and long-term corrosion resistance, ensuring stable electrical performance.

Terminal Position: DUAL

Dual terminal positioning aids in efficient design and routing on PCBs, optimizing space and connectivity.

Maximum Seated Height: 5.08 mm

With a compact seated height, this product helps maintain a low profile in design, essential for space-constrained applications.

Width: 7.62 mm

The width dimension aids in space-efficient PCB designs, allowing more components in a limited area.

Temperature Grade: COMMERCIAL EXTENDED

This grade categorizes the component for broader temperature variations, increasing its adaptability across various commercial applications.

Maximum Output Current: 0.625 A

A maximum output current of 0.625 A is sufficient for driving many peripherals while ensuring safe and efficient operation.

Technology: BCDMOS

Utilizing BCDMOS technology results in better power efficiency and performance characteristics, suitable for high-performance applications.

Terminal Form: THROUGH-HOLE

Through-hole design provides excellent mechanical strength and is ideal for applications requiring durable and reliable electrical connections.

Nominal Supply Voltage: 24 V

The nominal supply voltage of 24V is common in many industrial applications, ensuring easy integration into existing systems.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm is standard for many designs, making it compatible with numerous PCB designs and layouts.

Nominal Output Peak Current Limit: 1.1 A

The ability to handle a peak current limit of 1.1 A provides additional performance headroom for transient loads, enhancing overall versatility.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Designed as a buffer or inverter based driver, it can efficiently interface with various signal types, broadening its utilization in different applications.

Output Current Flow Direction: SOURCE

Having a source current flow direction allows for straightforward implementation in various interface scenarios, improving flexibility in design.

Technical Specifications

Peripheral Drivers L6375 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Output Current Flow Direction:

SOURCE

Maximum Output Current:

.625 A

Nominal Output Peak Current Limit:

1.1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

24

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

35 V

Minimum Supply Voltage:

8 V

Nominal Supply Voltage:

24 V

Surface Mount:

NO

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

L6375 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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